公开(公告)号：US09067296B2

公开(公告)日：2015-06-30

申请号：US13454146

申请日：2012-04-24

申请人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

发明人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

IPC分类号： B24B37/015 ,  B24B37/04 ,  B24B37/10 ,  B24B57/02

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B57/02

摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

摘要翻译： 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括事先确定抛光液的供给流量与抛光基板时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

公开(公告)号：US06609950B2

公开(公告)日：2003-08-26

申请号：US09897918

申请日：2001-07-05

申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B4900

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

公开(公告)号：US06186872B1

公开(公告)日：2001-02-13

申请号：US09485299

申请日：2000-05-15

申请人： Norio Kimura ,  Yu Ishii

发明人： Norio Kimura ,  Yu Ishii

IPC分类号： B24B100

CPC分类号： B24B37/105 ,  B24B37/20 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02

摘要： A polisher comprises a turn table having first and second end surfaces which are substantially normal to an axis of the turn table. The first end surface defines a polishing surface for polishing an article. A drive shaft is connected to the turn table in such a manner that the shaft extends along the axis of the turn table from the second end surface of the turn table. The polisher further includes a cooling system which comprises a cooling fluid path provided in the turn table for passing a cooling fluid therethrough to deprive the polishing surface of heat generated in a polishing operation and a fluid coupler provided at the center of the first end surface of the turn table for fluidly connecting the cooling fluid path with a cooling fluid supply outside of the turn table.

摘要翻译： 抛光机包括具有基本上垂直于转台的轴线的第一和第二端面的转台。 第一端面限定用于抛光物品的抛光表面。 驱动轴以转动台的转动台的轴线从转台的第二端面延伸的方式连接到转台上。 抛光机还包括冷却系统，其包括设置在转台中的冷却流体路径，用于使冷却流体通过其中以剥离抛光表面在抛光操作中产生的热量和设置在第一端面中心处的流体耦合器 用于将冷却流体路径与转台外部的冷却流体供给流体连接的转台。

公开(公告)号：US08360817B2

公开(公告)日：2013-01-29

申请号：US12730409

申请日：2010-03-24

申请人： Yu Ishii ,  Yoichi Shiokawa ,  Jyoji Heianna ,  Hisanori Matsuo

发明人： Yu Ishii ,  Yoichi Shiokawa ,  Jyoji Heianna ,  Hisanori Matsuo

IPC分类号： B24B1/00

CPC分类号： B24B57/02 ,  B24B37/04 ,  B24B49/00

摘要： A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.

摘要翻译： 抛光装置可以对抛光轮廓进行更精确的控制，而无需事先进行许多抛光测试。 抛光装置包括：具有抛光表面52a的抛光台22; 用于保持抛光对象W并将抛光对象W压靠在抛光表面52a上的顶环24; 用于将抛光液供给到研磨面52a的研磨液供给喷嘴26; 移动机构70，其用于使抛光液供给喷嘴26的研磨液供给位置26a大致沿研磨面52a的径向移动; 用于控制移动机构70的控制器66; 以及用于预测抛光液供给喷嘴26的研磨液供给位置26a与抛光轮廓之间的关系的模拟器72，进行模拟，并向控制器66输出数据。

公开(公告)号：US07837534B2

公开(公告)日：2010-11-23

申请号：US12155618

申请日：2008-06-06

申请人： Shunichi Aiyoshizawa ,  Ryuichi Kosuge ,  Ryo Kato ,  Yu Ishii

发明人： Shunichi Aiyoshizawa ,  Ryuichi Kosuge ,  Ryo Kato ,  Yu Ishii

IPC分类号： B24B49/00

CPC分类号： B24B37/015 ,  B24B55/02

摘要： The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a heat-exchanging medium flows, and a bottom surface facing the polishing surface. At least a part of the bottom surface is inclined with an upward gradient above the polishing surface such that a polishing liquid on the polishing surface generates a lift exerted on the bottom surface during movement of the polishing surface.

摘要翻译： 本发明提供一种用于加热或冷却抛光表面的设备。 该装置包括在抛光工件时布置成面向抛光表面的热交换器。 热交换器包括热交换介质流过的介质通道和面向抛光表面的底面。 底表面的至少一部分在研磨表面上方向上倾斜地倾斜，使得抛光表面上的抛光液体在抛光表面的移动期间产生施加在底表面上的升力。

公开(公告)号：US20100255756A1

公开(公告)日：2010-10-07

申请号：US12730409

申请日：2010-03-24

申请人： Yu ISHII ,  Yoichi Shiokawa ,  Jyoji Heianna ,  Hisanori Matsuo

发明人： Yu ISHII ,  Yoichi Shiokawa ,  Jyoji Heianna ,  Hisanori Matsuo

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B57/02 ,  B24B37/04 ,  B24B49/00

摘要： A polishing apparatus can perform more precise control of a polishing profile without carrying out many polishing tests in advance. The polishing apparatus includes: a polishing table 22 having a polishing surface 52a; a top ring 24 for holding a polishing object W and pressing the polishing object W against the polishing surface 52a; a polishing liquid supply nozzle 26 for supplying a polishing liquid to the polishing surface 52a; a movement mechanism 70 for moving a polishing liquid supply position 26a of the polishing liquid supply nozzle 26 approximately along the radial direction of the polishing surface 52a; a controller 66 for controlling the movement mechanism 70; and a simulator 72 for predicting the relationship between the polishing liquid supply position 26a of the polishing liquid supply nozzle 26 and a polishing profile, performing a simulation and outputting data to the controller 66.

摘要翻译： 抛光装置可以对抛光轮廓进行更精确的控制，而无需事先进行许多抛光测试。 抛光装置包括：具有抛光表面52a的抛光台22; 用于保持抛光对象W并将抛光对象W压靠在抛光表面52a上的顶环24; 用于将抛光液供给到研磨面52a的研磨液供给喷嘴26; 移动机构70，其用于使抛光液供给喷嘴26的研磨液供给位置26a大致沿研磨面52a的径向移动; 用于控制移动机构70的控制器66; 以及用于预测抛光液供给喷嘴26的研磨液供给位置26a与抛光轮廓之间的关系的模拟器72，进行模拟，并向控制器66输出数据。

公开(公告)号：US07291057B2

公开(公告)日：2007-11-06

申请号：US10601789

申请日：2003-06-24

申请人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

发明人： Norio Kimura ,  Yu Ishii ,  Hirokuni Hiyama ,  Katsuya Okumura ,  Hiroyuki Yano

IPC分类号： B24B49/00 ,  B24B1/00

CPC分类号： B24B37/013 ,  B24B37/042 ,  B24B49/04 ,  H01L21/02074 ,  H01L21/3212 ,  H01L21/76807

摘要： A method of polishing substrates enables the size of a polishing table to be reduced. A surface of a substrate to be polished is brought into contact with a polishing surface of a polishing table in such a manner that a portion of the surface of the substrate extends outwardly from an outer periphery of the polishing surface. The substrate is rotated about its center axis while keeping its surface in contact with the polishing surface of the polishing table. The attitude of the substrate carrier is controlled so that the surface of the substrate is kept parallel with the polishing surface of the polishing table during a polishing operation.

摘要翻译： 研磨基板的方法能够减小抛光台的尺寸。 将要抛光的基底的表面以与研磨台的抛光表面接触的方式使得基底表面的一部分从抛光表面的外周向外延伸。 衬底围绕其中心轴线旋转，同时保持其表面与抛光台的抛光表面接触。 控制基板载体的姿态，使得在抛光操作期间基板的表面与抛光台的抛光表面保持平行。

公开(公告)号：US20120276816A1

公开(公告)日：2012-11-01

申请号：US13454146

申请日：2012-04-24

申请人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

发明人： Katsutoshi Ono ,  Yu Ishii ,  Hisanori Matsuo ,  Kuniaki Yamaguchi

IPC分类号： B24B1/00 ,  B24B37/005

CPC分类号： B24B37/015 ,  B24B37/042 ,  B24B37/105 ,  B24B57/02

摘要： A polishing method for reducing an amount of polishing liquid used without lowering a polishing rate is provided. The polishing method comprises determining, in advance, the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished without controlling a surface temperature of the polishing pad, and the relationship between a supply flow rate of a polishing liquid and a polishing rate at the time the substrate is polished while controlling a surface temperature of the polishing pad at a predetermined level, and continuously supplying the polishing liquid to the surface of the polishing pad to achieve a higher polishing rate when the substrate is polished while controlling the surface temperature of the polishing pad at the predetermined level, than when the substrate is polished without controlling the surface temperature of the polishing pad.

摘要翻译： 提供了一种用于在不降低抛光速率的情况下减少使用的抛光液量的抛光方法。 抛光方法包括预先确定抛光液的供给流量与抛光衬底时的抛光速度之间的关系，而不控制抛光垫的表面温度，以及供给流量之间的关系 抛光液体和抛光时的抛光速度，同时将抛光垫的表面温度控制在预定水平，并且将研磨液连续地供给到抛光垫的表面，以便当基板 抛光，同时将抛光垫的表面温度控制在预定水平，而不是在不控制抛光垫的表面温度的情况下抛光衬底。

公开(公告)号：US06544111B1

公开(公告)日：2003-04-08

申请号：US09485862

申请日：2000-02-17

申请人： Norio Kimura ,  Yu Ishii

发明人： Norio Kimura ,  Yu Ishii

IPC分类号： B24B722

CPC分类号： B24B37/11 ,  B24B37/015

摘要： A polishing apparatus can strictly control the degree of material removal by providing close control over the operating temperature in the polishing table (12). The polishing apparatus has a polishing table (12) and a workpiece holder (14) for pressing a workpiece (W) towards the polishing table (12). The polishing table (12) has a polishing section (30) or a polishing tool attachment section at a surface thereof and a thermal medium passage (32) formed along the surface. The thermal medium passage (32) has a plurality of temperature adjustment passages provided respectively in a plurality of temperature adjustment regions which are formed by radially dividing a surface area of the polishing table (12).

摘要翻译： 抛光装置可以通过对抛光台（12）中的工作温度进行紧密控制来严格控制材料去除的程度。 抛光装置具有用于将工件（W）朝向抛光台（12）按压的研磨台（12）和工件保持器（14）。 抛光台（12）的表面具有抛光部（30）或抛光工具安装部，沿着表面形成有热介质通路（32）。 热介质通道（32）具有多个温度调节通道，分别设置在通过径向分割抛光台（12）的表面积而形成的多个温度调节区域中。

公开(公告)号：US20080311823A1

公开(公告)日：2008-12-18

申请号：US12155618

申请日：2008-06-06

申请人： Shunichi Aiyoshizawa ,  Ryuichi Kosuge ,  Ryo Kato ,  Yu Ishii

发明人： Shunichi Aiyoshizawa ,  Ryuichi Kosuge ,  Ryo Kato ,  Yu Ishii

IPC分类号： B24B51/00

CPC分类号： B24B37/015 ,  B24B55/02

摘要： The present invention provides an apparatus for heating or cooling a polishing surface. This apparatus includes a heat exchanger arranged so as to face the polishing surface when the workpiece is polished. The heat exchanger includes a medium passage through which a heat-exchanging medium flows, and a bottom surface facing the polishing surface. At least a part of the bottom surface is inclined with an upward gradient above the polishing surface such that a polishing liquid on the polishing surface generates a lift exerted on the bottom surface during movement of the polishing surface.

摘要翻译： 本发明提供一种用于加热或冷却抛光表面的设备。 该装置包括在抛光工件时布置成面向抛光表面的热交换器。 热交换器包括热交换介质流过的介质通道和面向抛光表面的底面。 底表面的至少一部分在研磨表面上方向上倾斜地倾斜，使得抛光表面上的抛光液体在抛光表面的移动期间产生施加在底表面上的升力。