公开(公告)号：US06875029B2

公开(公告)日：2005-04-05

申请号：US10634820

申请日：2003-08-06

申请人： Akira Kawabata ,  Yasumitsu Tanaka ,  Yuichiro Fukaya

发明人： Akira Kawabata ,  Yasumitsu Tanaka ,  Yuichiro Fukaya

IPC分类号： H05K7/14 ,  B60R16/02 ,  B60R16/023 ,  H05K3/30 ,  H01R9/09

CPC分类号： B60R16/0239 ,  H05K3/301 ,  H05K2201/10446 ,  H05K2201/10962

摘要： An electronic control unit (ECU) includes onboard type electronic components and non-onboard type electronic components inside an aluminum case. The ECU has a circuit board for mounting the onboard type electronic component in a first portion of a bottom surface, and a concavity for installing the non-onboard type electronic components in a second portion of the bottom surface. A resinous frame is provided in the concavity to house and hold the non-onboard type electronic components.

摘要翻译： 电子控制单元（ECU）包括铝壳内的车载型电子部件和非机载型电子部件。 ECU具有用于将车载型电子部件安装在底面的第一部分中的电路板，以及用于将非车载型电子部件安装在底面的第二部分中的凹部。 在凹部中设置树脂框架以容纳和保持非机载型电子部件。

公开(公告)号：US07672138B2

公开(公告)日：2010-03-02

申请号：US11826851

申请日：2007-07-19

申请人： Akira Kawabata ,  Yuichiro Fukaya

发明人： Akira Kawabata ,  Yuichiro Fukaya

IPC分类号： H05K7/02

CPC分类号： H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

摘要： An electronic apparatus include a housing, a circuit board held in the housing, and large electronic components held in the housing and electrically coupled to the circuit board. The housing has a mounting surface, and the electronic apparatus is mounted to an object at the mounting surface. The large electronic components are arranged in a three-dimensional manner with respect to the mounting surface in such a manner that at least one of the large electronic components overlaps at least one of the large electronic components in a direction toward the mounting surface.

摘要翻译： 电子设备包括壳体，保持在壳体中的电路板以及保持在壳体中并电耦合到电路板的大型电子部件。 壳体具有安装面，电子设备安装在安装面上的物体上。 大型电子部件以相对于安装面的三维方式配置，使得大电子部件中的至少一个与朝向安装面的方向重叠至少一个大型电子部件。

公开(公告)号：US20080025006A1

公开(公告)日：2008-01-31

申请号：US11826851

申请日：2007-07-19

申请人： Akira Kawabata ,  Yuichiro Fukaya

发明人： Akira Kawabata ,  Yuichiro Fukaya

IPC分类号： H05K5/00

CPC分类号： H05K3/301 ,  H01M2/1055 ,  H05K1/0263 ,  H05K1/18 ,  H05K1/182 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10272 ,  H05K2201/10515 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

摘要： An electronic apparatus include a housing, a circuit board held in the housing, and large electronic components held in the housing and electrically coupled to the circuit board. The housing has a mounting surface, and the electronic apparatus is mounted to an object at the mounting surface. The large electronic components are arranged in a three-dimensional manner with respect to the mounting surface in such a manner that at least one of the large electronic components overlaps at least one of the large electronic components in a direction toward the mounting surface.

摘要翻译： 电子设备包括壳体，保持在壳体中的电路板以及保持在壳体中并电耦合到电路板的大型电子部件。 壳体具有安装面，电子设备安装在安装面上的物体上。 大型电子部件以相对于安装面的三维方式配置，使得大电子部件中的至少一个与朝向安装面的方向重叠至少一个大型电子部件。