Method of stripping off wafer-protective sheet
    7.
    发明授权
    Method of stripping off wafer-protective sheet 失效
    剥离晶片保护片的方法

    公开(公告)号:US5254201A

    公开(公告)日:1993-10-19

    申请号:US824564

    申请日:1992-01-23

    摘要: A method of stripping off a wafer-protective sheet which comprises bonding an electrically conductive continuousform stripping tape comprising a flexible substrate to, through a pressure-sensitive adhesive layer, an electrically conductive protective sheet applied to a semiconductor wafer on its side where a circuit pattern has been formed, and then peeling the stripping tape from the semiconductor wafer thereby to strip the protective sheet from the semiconductor wafer, said bonding and peeling of the stripping tape being conducted automatically by means of an automatic stripping system while the protective sheet is kept being grounded through the stripping tape.

    摘要翻译: 剥离晶片保护片的方法,其包括将包含柔性基板的导电连续成型剥离带粘合到通过压敏粘合剂层的导电保护片上,所述导电保护片在其侧面上具有电路图案 已经形成,然后从半导体晶片剥离剥离带,从而从半导体晶片剥离保护片,所述剥离带的粘合和剥离通过自动剥离系统自动进行,同时保护片保持在 通过剥离胶带接地。