公开(公告)号：US07763895B2

公开(公告)日：2010-07-27

申请号：US12422291

申请日：2009-04-13

申请人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

发明人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

IPC分类号： H01L29/267

CPC分类号： H05K3/32 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09481 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1469 ,  H01L2924/00

摘要： A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.

摘要翻译： 提供了包括基板，发光装置，模塑料，电介质层和金属线的柔性光源装置。 基板具有第一表面，与第一表面相对的第二表面和第一开口。 发光装置设置在基板的第一表面上并覆盖第一开口。 模塑料位于第一表面上方并覆盖发光器件。 电介质层设置在第二表面上并且覆盖第一开口的侧壁。 介电层具有暴露部分发光器件的第二开口。 金属线设置在电介质层上，其中金属线通过电介质层中的第二开口与发光器件电连接。 另外，还提供了柔性光源装置的制造方法。

公开(公告)号：US07682855B2

公开(公告)日：2010-03-23

申请号：US11461436

申请日：2006-07-31

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L21/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US07973330B2

公开(公告)日：2011-07-05

申请号：US12510255

申请日：2009-07-27

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20090283750A1

公开(公告)日：2009-11-19

申请号：US12510255

申请日：2009-07-27

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20090116244A1

公开(公告)日：2009-05-07

申请号：US12046419

申请日：2008-03-11

申请人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

发明人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

IPC分类号： F21V7/00

CPC分类号： H05K1/0274 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H05K2201/10106 ,  H05K2201/2054

摘要： A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.

摘要翻译： 发光模块包括具有第一表面和第二表面的衬底，设置在衬底的第一表面上的至少一个发光器件，以及设置在衬底的第一表面上并围绕光的光反射层 用于接收从发光装置发射的一部分光并反射该光的部分的发光装置。 基底可以是刚性的或柔性的。

公开(公告)号：US20060193560A1

公开(公告)日：2006-08-31

申请号：US11407105

申请日：2006-04-20

申请人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

发明人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

IPC分类号： G02B6/30

CPC分类号： G02B6/3636 ,  G02B6/30 ,  G02B6/3652 ,  G02B2006/1215

摘要： A coupling structure between a fiber and a PLC to couple the PLC to the fiber is provided. A substrate includes a PLC region and at least one aligning groove for accommodating the fiber. The PLC region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove and are at a non-perpendicular angle with respect to progressing direction of the incident light from the top view of the PLC. Therefore, the coupling loss and reflection during transmission can be effectively reduced.

摘要翻译： 提供了将光纤和PLC耦合到光纤之间的耦合结构。 基板包括PLC区域和用于容纳光纤的至少一个对准槽。 PLC区域具有光电路和光电路的输入/输出表面。 输入/输出表面面向对准槽，并且相对于来自PLC的俯视图的入射光的前进方向处于非垂直角度。 因此，可以有效地减少传输期间的耦合损耗和反射。

公开(公告)号：US08777437B2

公开(公告)日：2014-07-15

申请号：US12046419

申请日：2008-03-11

申请人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

发明人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

IPC分类号： G09F13/04

CPC分类号： H05K1/0274 ,  F21K9/68 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/46 ,  H05K2201/10106 ,  H05K2201/2054

摘要： A light-emitting module includes a substrate having a first surface and a second surface, at least one light-emitting device disposed on the first surface of the substrate, and an optical reflection layer disposed on the first surface of the substrate and surrounding the light-emitting device for receiving a portion of light emitted from the light-emitting device and reflecting the portion of light. The substrate can be rigid or flexible.

摘要翻译： 发光模块包括具有第一表面和第二表面的衬底，设置在衬底的第一表面上的至少一个发光器件，以及设置在衬底的第一表面上并围绕光的光反射层 用于接收从发光装置发射的一部分光并反射该光的部分的发光装置。 基底可以是刚性的或柔性的。

公开(公告)号：US20100163897A1

公开(公告)日：2010-07-01

申请号：US12422291

申请日：2009-04-13

申请人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

发明人： Zhi-Cheng Hsiao ,  Chao-Kai Hsu ,  Yu-Hua Chen

IPC分类号： H01L33/00

CPC分类号： H05K3/32 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/09481 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2201/2054 ,  H05K2203/1316 ,  H05K2203/1469 ,  H01L2924/00

摘要： A flexible light source device including a substrate, a light emitting device, a molding compound, a dielectric layer, and a metal line is provided. The substrate has a first surface, a second surface opposite to the first surface, and a first opening. The light emitting device is disposed on the first surface of the substrate and covers the first opening. The molding compound is located above the first surface and covers the light emitting device. The dielectric layer is disposed on the second surface and covers a sidewall of the first opening. The dielectric layer has a second opening which exposes part of the light emitting device. The metal line is disposed on the dielectric layer, wherein the metal line is electrically connected to the light emitting device via the second opening in the dielectric layer. Additionally, a fabrication method of the flexible light source device is also provided.

摘要翻译： 提供了包括基板，发光装置，模塑料，电介质层和金属线的柔性光源装置。 基板具有第一表面，与第一表面相对的第二表面和第一开口。 发光装置设置在基板的第一表面上并覆盖第一开口。 模塑料位于第一表面上方并覆盖发光器件。 电介质层设置在第二表面上并且覆盖第一开口的侧壁。 介电层具有暴露部分发光器件的第二开口。 金属线设置在电介质层上，其中金属线通过电介质层中的第二开口与发光器件电连接。 另外，还提供了柔性光源装置的制造方法。

公开(公告)号：US20070158639A1

公开(公告)日：2007-07-12

申请号：US11461436

申请日：2006-07-31

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00 ,  H01L21/461

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20050265664A1

公开(公告)日：2005-12-01

申请号：US10972519

申请日：2004-10-25

申请人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

发明人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/30 ,  G02B6/36

CPC分类号： G02B6/3636 ,  G02B6/30 ,  G02B6/3652 ,  G02B2006/1215

摘要： A coupling structure between a fiber and an optical waveguide to couple the optical waveguide to the fiber is disclosed. A substrate includes an optical waveguide region and at least one aligning groove for containing the fiber. The optical waveguide region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove. A non-perpendicular angle is formed between input/output surfaces and the progressing direction of the incident light.

摘要翻译： 公开了将光波导耦合到光纤的光纤和光波导之间的耦合结构。 基板包括光波导区域和用于容纳光纤的至少一个对准槽。 光波导区域具有光电路和光电路的输入/输出表面。 输入/输出表面面向对齐槽。 在输入/输出表面与入射光的前进方向之间形成非垂直角。