公开(公告)号：US20060193560A1

公开(公告)日：2006-08-31

申请号：US11407105

申请日：2006-04-20

申请人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

发明人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

IPC分类号： G02B6/30

CPC分类号： G02B6/3636 ,  G02B6/30 ,  G02B6/3652 ,  G02B2006/1215

摘要： A coupling structure between a fiber and a PLC to couple the PLC to the fiber is provided. A substrate includes a PLC region and at least one aligning groove for accommodating the fiber. The PLC region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove and are at a non-perpendicular angle with respect to progressing direction of the incident light from the top view of the PLC. Therefore, the coupling loss and reflection during transmission can be effectively reduced.

摘要翻译： 提供了将光纤和PLC耦合到光纤之间的耦合结构。 基板包括PLC区域和用于容纳光纤的至少一个对准槽。 PLC区域具有光电路和光电路的输入/输出表面。 输入/输出表面面向对准槽，并且相对于来自PLC的俯视图的入射光的前进方向处于非垂直角度。 因此，可以有效地减少传输期间的耦合损耗和反射。

公开(公告)号：US20050265664A1

公开(公告)日：2005-12-01

申请号：US10972519

申请日：2004-10-25

申请人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

发明人： Chien-Cheng Yang ,  Wen-Jiun Liu ,  Zhi-Cheng Hsiao

IPC分类号： G02B6/12 ,  G02B6/26 ,  G02B6/30 ,  G02B6/36

CPC分类号： G02B6/3636 ,  G02B6/30 ,  G02B6/3652 ,  G02B2006/1215

摘要： A coupling structure between a fiber and an optical waveguide to couple the optical waveguide to the fiber is disclosed. A substrate includes an optical waveguide region and at least one aligning groove for containing the fiber. The optical waveguide region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove. A non-perpendicular angle is formed between input/output surfaces and the progressing direction of the incident light.

摘要翻译： 公开了将光波导耦合到光纤的光纤和光波导之间的耦合结构。 基板包括光波导区域和用于容纳光纤的至少一个对准槽。 光波导区域具有光电路和光电路的输入/输出表面。 输入/输出表面面向对齐槽。 在输入/输出表面与入射光的前进方向之间形成非垂直角。

公开(公告)号：US20050220412A1

公开(公告)日：2005-10-06

申请号：US10901040

申请日：2004-07-29

申请人： Wen-Jiun Liu ,  Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Shau-Yi Chen ,  Yun-Wen Lee

发明人： Wen-Jiun Liu ,  Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Shau-Yi Chen ,  Yun-Wen Lee

IPC分类号： G02B6/12 ,  G02B6/125 ,  G02B6/26 ,  G02B6/42

CPC分类号： G02B6/125 ,  G02B2006/1215

摘要： An optical splitter with reflection suppression is disclosed. It includes an input waveguide and a plurality of receiving waveguides. The input waveguide has at least one output surface for transferring an incident light to the receiving surfaces of the receiving waveguides. Each of the output surfaces parallels the corresponding receiving surfaces, and an oblique angle is formed between the output surface and the progressing direction of the incident light.

摘要翻译： 公开了一种具有反射抑制的分光器。 它包括输入波导和多个接收波导。 输入波导具有用于将入射光传送到接收波导的接收表面的至少一个输出表面。 每个输出表面平行于相应的接收表面，并且在输出表面和入射光的前进方向之间形成倾斜角。

公开(公告)号：US07973330B2

公开(公告)日：2011-07-05

申请号：US12510255

申请日：2009-07-27

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20090283750A1

公开(公告)日：2009-11-19

申请号：US12510255

申请日：2009-07-27

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US07682855B2

公开(公告)日：2010-03-23

申请号：US11461436

申请日：2006-07-31

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L21/00

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20070158639A1

公开(公告)日：2007-07-12

申请号：US11461436

申请日：2006-07-31

申请人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

发明人： Chien-Cheng Yang ,  Zhi-Cheng Hsiao ,  Gen-Wen Hsieh

IPC分类号： H01L33/00 ,  H01L21/461

CPC分类号： H01L33/0079

摘要： A substrate-free light emitting diode (LED) including an epitaxy layer, a conductive supporting layer, and a first contact pad is provided. The epitaxy layer includes a first type doped semiconductor layer, a light emitting layer, and a second type doped semiconductor layer. The light emitting layer is disposed on the first type doped semiconductor layer, and a portion of the first type doped semiconductor layer is exposed. The second type doped semiconductor layer and the conductive supporting layer are sequentially disposed on the second type doped semiconductor layer. The first contact pad is disposed on the exposed first type doped semiconductor layer and electrically connected thereto. The first contact pad and the conductive supporting layer serving as an electrode are disposed on the same side of the epitaxy layer to avoid the light shielding effects of the electrode to improve the front light emitting efficiency of the LED.

摘要翻译： 提供了包括外延层，导电支撑层和第一接触焊盘的无基板的发光二极管（LED）。 外延层包括第一掺杂半导体层，发光层和第二掺杂半导体层。 发光层设置在第一掺杂半导体层上，第一掺杂半导体层的一部分露出。 第二类掺杂半导体层和导电支撑层依次设置在第二掺杂半导体层上。 第一接触焊盘设置在暴露的第一型掺杂半导体层上并与其电连接。 用作电极的第一接触焊盘和导电支撑层设置在外延层的同一侧，以避免电极的遮光效应，以提高LED的前发光效率。

公开(公告)号：US20060110108A1

公开(公告)日：2006-05-25

申请号：US11227609

申请日：2005-09-16

申请人： Tsung-Fu Hsieh ,  Chien-Cheng Yang ,  Wen-Jiun Liu ,  Shau-Yi Chen ,  Jing-Yao Chang

发明人： Tsung-Fu Hsieh ,  Chien-Cheng Yang ,  Wen-Jiun Liu ,  Shau-Yi Chen ,  Jing-Yao Chang

IPC分类号： G02B6/36

CPC分类号： H02N1/008 ,  G02B6/422

摘要： A tunable light transceiver module for adjusting a photoelectric device is provided. The tunable structure includes a photoelectric device, a stage, and a set of two-dimensional actuators having a first direction actuator and a second direction actuator. The photoelectric device is installed on the stage. The first direction actuation device and the second direction actuation device are coupled to the stage for controlling the movement of the stage along the first direction and the second direction, which are parallel to the stage. The tunable module may comprise an additional vertical actuator for controlling the movement of the stage along the direction perpendicular to the stage, thus realizing the displacement adjustment in three dimensions.

摘要翻译： 提供了一种用于调节光电装置的可调光收发模块。 可调谐结构包括具有第一方向致动器和第二方向致动器的光电器件，载物台和一组二维致动器。 光电装置安装在舞台上。 第一方向致动装置和第二方向致动装置联接到载物台，用于控制载物台沿与平台平行的第一方向和第二方向的移动。 可调谐模块可以包括附加的垂直致动器，用于控制工作台沿垂直于工作台的方向的移动，从而实现三维位移调节。

公开(公告)号：US07381995B2

公开(公告)日：2008-06-03

申请号：US11081319

申请日：2005-03-16

申请人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

发明人： Ra-Min Tain ,  Shyi-Ching Liau ,  Chien-Cheng Yang

IPC分类号： H01L31/12

CPC分类号： F21K9/00 ,  F21Y2107/30 ,  F21Y2115/10 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed is a lighting device with flipped side-structure of LEDs, which allows emitted lights to travel in parallel with the mounting surface. Single or plural LED chips are mounted on a substrate with their side surfaces facing the substrate surface. The lighting device can be further combined with optical protrusions on the substrate to form a light module for reflecting and mixing lights emitted from the LED chips. It does not require a conventional wire bonding process. The packaging structure also resolves the heat dissipation problem of the LEDs. Electrostatic discharge protection circuits can be included in the light module if desired. The invention achieves good uniformity and high intensity of the combined lights with desired chromaticity.

摘要翻译： 公开了一种具有翻转的LED侧面结构的照明装置，其允许发射的光与安装表面平行地行进。 单个或多个LED芯片安装在基板上，其侧表面面向基板表面。 照明装置可以进一步与基板上的光学突起组合，以形成用于反射和混合从LED芯片发射的光的光模块。 它不需要常规的引线接合工艺。 封装结构也解决了LED散热问题。 如果需要，静电放电保护电路可以包括在灯模块中。 本发明实现了具有所需色度的组合光的均匀性和高强度。

公开(公告)号：US20110182457A1

公开(公告)日：2011-07-28

申请号：US12973036

申请日：2010-12-20

申请人： Chiu-Yun Tung ,  Hui-Yin Liang ,  Ju-Mei Tsai ,  Yu-Huan Yen ,  Chien-Cheng Yang ,  Ming-Hung Tsai ,  Shi-Pan Ho

发明人： Chiu-Yun Tung ,  Hui-Yin Liang ,  Ju-Mei Tsai ,  Yu-Huan Yen ,  Chien-Cheng Yang ,  Ming-Hung Tsai ,  Shi-Pan Ho

IPC分类号： H04R1/10

CPC分类号： H04R1/1041 ,  H04R1/1016

摘要： An in-ear earphone with a capacitive sensing function is provided. The earphone includes a case, a speaker, a circuit board, and a capacitive sensing unit. The case has an extension tube and an accommodating portion. An ear tip is sleeved on the extension tube. The accommodating portion accommodates the speaker, the circuit board, and the capacitive sensing unit. A sound emitting surface of the speaker faces the extension tube. The circuit board is electrically connected to the speaker, and a sensing chip is disposed on the circuit board. The capacitive sensing unit includes a sensor and a conducting element. The sensor is electrically connected to the sensing chip through the conducting element. When the extension tube is inserted into an ear canal of a user, the sensor returns a sensing signal to the sensing chip, and the sensing chip sends a control signal to control sound output of the speaker.

摘要翻译： 提供具有电容感应功能的入耳式耳机。 耳机包括外壳，扬声器，电路板和电容感测单元。 壳体具有延伸管和容纳部分。 耳尖套在延长管上。 容纳部分容纳扬声器，电路板和电容感测单元。 扬声器的发声表面面向延伸管。 电路板电连接到扬声器，并且感测芯片设置在电路板上。 电容感测单元包括传感器和导电元件。 传感器通过导电元件与传感芯片电连接。 当延长管插入用户的耳道时，传感器将感测信号返回到感测芯片，感测芯片发送控制信号以控制扬声器的声音输出。