摘要:
A coupling structure between a fiber and a PLC to couple the PLC to the fiber is provided. A substrate includes a PLC region and at least one aligning groove for accommodating the fiber. The PLC region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove and are at a non-perpendicular angle with respect to progressing direction of the incident light from the top view of the PLC. Therefore, the coupling loss and reflection during transmission can be effectively reduced.
摘要:
A coupling structure between a fiber and an optical waveguide to couple the optical waveguide to the fiber is disclosed. A substrate includes an optical waveguide region and at least one aligning groove for containing the fiber. The optical waveguide region has optical circuits and input/output surfaces of the optical circuits. The input/output surfaces face the aligning groove. A non-perpendicular angle is formed between input/output surfaces and the progressing direction of the incident light.
摘要:
An optical splitter with reflection suppression is disclosed. It includes an input waveguide and a plurality of receiving waveguides. The input waveguide has at least one output surface for transferring an incident light to the receiving surfaces of the receiving waveguides. Each of the output surfaces parallels the corresponding receiving surfaces, and an oblique angle is formed between the output surface and the progressing direction of the incident light.
摘要:
A tunable light transceiver module for adjusting a photoelectric device is provided. The tunable structure includes a photoelectric device, a stage, and a set of two-dimensional actuators having a first direction actuator and a second direction actuator. The photoelectric device is installed on the stage. The first direction actuation device and the second direction actuation device are coupled to the stage for controlling the movement of the stage along the first direction and the second direction, which are parallel to the stage. The tunable module may comprise an additional vertical actuator for controlling the movement of the stage along the direction perpendicular to the stage, thus realizing the displacement adjustment in three dimensions.
摘要:
A method for forming amorphous silicon films with low defect density on single crystal silicon substrates and structures formed. The method is carried out by first providing a single crystal silicon substrate, then depositing a buffer layer by a material such as silicon oxide, silicon nitride, silicon carbide or a metal on top of the single crystal silicon substrate. An amorphous silicon film of substantial thickness, i.e. of thicker than 1 &mgr;m, is then deposited on top of the buffer layer achieving a smooth top surface.
摘要:
A charging balancing system and method thereof based on a battery operating process and are disclosed. This is done by detecting a state of all cells in a detecting battery assembly to generate detection parameters, analyzing the detection parameters to produce an operating process, selecting at least one of residual power estimation methods according to the operating process, so as to calculate a residual power of each cell, and adjusting the charging current and charging time for each cell according to the residual power. As such, the efficiency of charging balancing is promoted.
摘要:
Test structure and method of step coverage for optical waveguide production are disclosed. It combines the steps of producing the optical waveguide and the testing structure by forming the optical waveguide components on the chip and the test structure in the surrounding areas, so the optical waveguide and the test structure have the same upper covering layer. Etching solution is used for the etch testing of the test structure, and the step coverage of the upper covering layer for the optical waveguide is extrapolated by the etching result.
摘要:
An interconnect structure includes a first trench and a second trench. The second trench is wider than the first trench. Both trenches are lined with a diffusion barrier layer, and a first conductive layer is deposited over the diffusion barrier layer. A metal cap layer is deposited over the first conductive layer. A second conductive layer is deposited over the metal cap layer in the second trench.