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公开(公告)号：US20220189790A1
公开(公告)日：2022-06-16
申请号：US17594346
申请日：2020-04-14
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US12020951B2
公开(公告)日：2024-06-25
申请号：US17594346
申请日：2020-04-14
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R. D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC分类号： H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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公开(公告)号：US20220037278A1
公开(公告)日：2022-02-03
申请号：US17309705
申请日：2019-12-23
发明人： Ankit Mahajan , Saagar A. Shah , Daniel B. Taylor , Mikhail L. Pekurovsky , Kara A. Meyers , Kayla C. Niccum , David J. Rowe , Gino L. Pitera
摘要： An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
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公开(公告)号：US11996380B2
公开(公告)日：2024-05-28
申请号：US17309705
申请日：2019-12-23
发明人： Ankit Mahajan , Saagar A. Shah , Daniel B. Taylor , Mikhail L. Pekurovsky , Kara A. Meyers , Kayla C. Niccum , David J. Rowe , Gino L. Pitera
IPC分类号： H01L23/00 , H01L21/56 , H01L23/31 , H01M50/109
CPC分类号： H01L24/19 , H01L21/568 , H01L23/3121 , H01L23/3135 , H01L24/20 , H01L24/24 , H01L24/82 , H01L2224/19 , H01L2224/211 , H01L2224/215 , H01L2224/24137 , H01L2224/24195 , H01L2224/82101 , H01L2924/186 , H01M50/109
摘要： An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
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公开(公告)号：US20240282592A1
公开(公告)日：2024-08-22
申请号：US18652529
申请日：2024-05-01
发明人： Ankit Mahajan , Saagar A. Shah , Mikhail L. Pekurovsky , Kayla C. Niccum , Kara A. Meyers , Matthew R.D. Smith , Gino L. Pitera , Graham M. Clarke , Jeremy K. Larsen , Teresa M. Goeddel
CPC分类号： H01L21/56 , H01L23/293 , H01L23/3107 , H01L24/03 , H01L24/05 , H01L2224/03312 , H01L2224/0332 , H01L2224/03505 , H01L2224/03515 , H01L2224/04105 , H01L2224/05567
摘要： A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.
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