公开(公告)号：US20180355223A1

公开(公告)日：2018-12-13

申请号：US16061045

申请日：2016-12-06

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Jan U. Wieneke ,  Susanne H. Rieder-Otterburg ,  Armin Kayser ,  Krishna B. Uibel ,  Martin Engler ,  Robert M. Schaedel ,  Takujiro Yamabe

IPC: C09J11/04 ,  C09J7/38 ,  C09J9/00 ,  C09K5/14

CPC classification number: C09J11/04 ,  C08F220/18 ,  C08K3/38 ,  C08K2003/385 ,  C09J7/385 ,  C09J9/00 ,  C09J133/08 ,  C09J2203/33 ,  C09J2205/102 ,  C09J2400/12 ,  C09J2433/00 ,  C09K5/14 ,  C08F2220/1858 ,  C08F220/06

Abstract: The present disclosure relates to a thermally conductive pressure sensitive adhesive composition, comprising: a) an acrylic polymer component; and b) a boron nitride mixture composition comprising: i. anisotropic boron nitride agglomerates comprising hexagonal boron nitride primary particles, wherein the hexagonal boron nitride primary particles have an average primary particle size d50 comprised between 1 and 50 micrometer, wherein the anisotropic boron nitride agglomerates have an average agglomerate size d50 comprised between 50 and 250 micrometer and an aspect ratio greater than 1.5, and wherein the envelope density of the anisotropic boron nitride agglomerates is greater than 1 g/cm3?, when measured according to the test method described in the experimental section; and ii. (optionally), free hexagonal boron nitride primary particles having an average primary particle size d50 comprised between 3 and 50 micrometer; and wherein the content of the boron nitride mixture composition is greater than 15 vol %, based on the volume of the thermally conductive pressure sensitive adhesive composition. The present disclosure also relates to a method of manufacturing such thermally conductive pressure sensitive adhesives and uses thereof.