公开(公告)号：US20210059048A1

公开(公告)日：2021-02-25

申请号：US16992092

申请日：2020-08-12

Applicant: AAC Technologies Pte. Ltd.

Inventor： Hongyuan Wang ,  Hezhi Wang

IPC: H05K1/03 ,  H05K3/02 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B5/26

Abstract: A copper-clad laminate includes an insulating substrate and a copper foil layer covering a surface of the insulating substrate. The insulating substrate includes at least one first insulating layer, and the first insulating layer is a blend of a surface fiber felt made of fibers and resin or a blend of a non-woven fabric-reinforced composite material and resin, and the copper foil layer is attached to an outer surface of the first insulating layer. The present disclosure also provides a printed circuit board, which is made from the copper-clad laminate of the present disclosure. The present disclosure also provides a method for manufacturing the printed circuit board. Compared with the related arts, the copper-clad laminate and the printed circuit board of the present disclosure have improved dielectric properties.

公开(公告)号：US20210054158A1

公开(公告)日：2021-02-25

申请号：US16992100

申请日：2020-08-13

Applicant: AAC Technologies Pte. Ltd.

Inventor： Hongyuan Wang ,  Hezhi Wang ,  Yilan Zhang

IPC: C08J5/24 ,  C08L47/00 ,  C08L9/06 ,  H05K1/03 ,  B32B5/02 ,  B32B15/14 ,  B32B15/20 ,  B32B17/04

Abstract: A prepreg is a blend of a fiber reinforcement, a matrix resin and a filler. Based on 100 parts by mass of the prepreg, the fiber reinforcement is 20-60 parts by mass, the matrix resin is 20-65 parts by mass, and the filler is 10-40 parts by mass. The filler is a flame-retardant organic microsphere or a blend of the flame-retardant organic microsphere and an inorganic filler, and the particle size of the filler is preferably 0.1 microns to 15 microns. A copper-clad laminate and a printed circuit board are also disclosed. In various embodiments, the stability of material properties of the prepreg can be improved, the prepreg manufacturing process is simplified, the prepreg production efficiency is improved. Due to the high production efficiency of the prepreg, the manufacturing cost of the prepreg, the copper-clad laminate and the printed circuit board can be reduced.