公开(公告)号：US09949385B2

公开(公告)日：2018-04-17

申请号：US14790437

申请日：2015-07-02

Applicant: ABB TECHNOLOGY AG

Inventor： Samuel Hartmann ,  David Guillon ,  David Hajas ,  Markus Thut

IPC: H05K5/00 ,  H01L23/047 ,  H05K3/30 ,  H01R43/20 ,  H05K1/18 ,  H05K1/11 ,  H01L23/48 ,  H01R43/02 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  B23K20/10

CPC classification number: H05K5/0034 ,  B23K20/10 ,  H01L21/4853 ,  H01L23/047 ,  H01L23/3735 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01R43/0207 ,  H01R43/205 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K2203/0285 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region.

公开(公告)号：US09975194B2

公开(公告)日：2018-05-22

申请号：US15067779

申请日：2016-03-11

Applicant: ABB Technology AG

Inventor： Venkatesh Sivasubramaniam ,  David Guillon ,  Dominik Trüssel ,  Markus Thut ,  Samuel Hartman

IPC: B23K1/06 ,  B23K20/10 ,  B23K20/26 ,  B29C35/02

CPC classification number: B23K1/06 ,  B23K20/10 ,  B23K20/26 ,  B29C35/0261

Abstract: The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) Connecting the components by activating the welding tool. The method like described above provides an easy and cost-saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles.

公开(公告)号：US20160193678A1

公开(公告)日：2016-07-07

申请号：US15067779

申请日：2016-03-11

Applicant: ABB Technology AG

Inventor： Venkatesh Sivasubramaniam ,  David Guillon ,  Dominik Trüssel ,  Markus Thut ,  Samuel Hartman

IPC: B23K1/06 ,  B29C35/02

CPC classification number: B23K1/06 ,  B23K20/10 ,  B23K20/26 ,  B29C35/0261

Abstract: The present invention relates to a method of connecting two components by ultrasonic welding for producing a power semiconductor module, said method comprising the steps of: a) Aligning the components to be welded to form a welding interface; b) Aligning a welding tool to the aligned components; c) Removably arranging a trapping material at least partly encompassing the welding interface, whereby the trapping material is a foam; and d) Connecting the components by activating the welding tool. The method like described above provides an easy and cost-saving measure in order to prevent particle contamination when performing a welding process such as particularly an ultrasonic welding process sue to scattered particles.

Abstract translation: 本发明涉及一种通过超声波焊接连接两个部件以产生功率半导体模块的方法，所述方法包括以下步骤：a）对准被焊接部件以形成焊接界面; b）将焊接工具对准对齐的部件; c）可移除地布置至少部分地包围焊接界面的捕集材料，由此捕获材料是泡沫; 和d）通过激活焊接工具连接组件。 上述方法提供了一种简单且成本节约的措施，以便在执行诸如特别是对散射颗粒的超声波焊接工艺的焊接过程时防止颗粒污染。