公开(公告)号：US09949385B2

公开(公告)日：2018-04-17

申请号：US14790437

申请日：2015-07-02

Applicant: ABB TECHNOLOGY AG

Inventor： Samuel Hartmann ,  David Guillon ,  David Hajas ,  Markus Thut

IPC: H05K5/00 ,  H01L23/047 ,  H05K3/30 ,  H01R43/20 ,  H05K1/18 ,  H05K1/11 ,  H01L23/48 ,  H01R43/02 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  B23K20/10

CPC classification number: H05K5/0034 ,  B23K20/10 ,  H01L21/4853 ,  H01L23/047 ,  H01L23/3735 ,  H01L23/48 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49097 ,  H01L2224/49111 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01R43/0207 ,  H01R43/205 ,  H05K1/111 ,  H05K1/181 ,  H05K3/301 ,  H05K2203/0285 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor module includes a base plate, a substrate on the base plate and carrying at least one semiconductor chip, a housing attached to the base plate and at least partially enclosing the substrate, and at least one terminal having one end which protrudes from the housing and another end which has a terminal foot attached on a terminal pad of the metallization by means of ultrasonic welding. The housing has a protective wall which encloses the terminal and divides an interior space of the housing into an unprotected region and a protected region. The protective wall is formed such that a gap is formed between the substrate and the protective wall. The gap is designed to carry a fluid flow such that particles produced during the ultrasonic welding of the terminal foot to the terminal pad are prevented from penetrating into the protected region from the unprotected region.

公开(公告)号：US20140021640A1

公开(公告)日：2014-01-23

申请号：US13937546

申请日：2013-07-09

Applicant: ABB Technology AG

Inventor： Gontran PÂQUES ,  Dominik Trüssel ,  Waldemar Groot ,  Stefan Ellenbroek ,  David Hajas

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/32 ,  H01L25/071 ,  H01L25/074 ,  H01L25/162 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/19107 ,  H05K1/0254 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09081 ,  H05K2201/09163 ,  H05K2201/1028 ,  H05K2201/10287 ,  H05K2201/2045 ,  H01L2924/00

Abstract: A method and arrangement are disclosed for electrically connecting a contact of a first substrate to a contact of a second substrate, whereby the first substrate is positioned relative the second substrate. The method includes providing the first substrate with its contact facing towards the second substrate, providing the second substrate with its contact facing away from the first substrate, bonding a bonding medium to the contact of the first substrate, bonding the bonding medium to the first substrate thereby forming a loop, electrically connecting the contact of the second substrate to the bonding medium, and providing the second substrate with the contact on a nose or tongue extending from an edge of the second substrate. The first substrate can be positioned below the second substrate, with a contact of the first substrate connected to a contact of the second substrate.

Abstract translation: 公开了一种用于将第一基板的触点电连接到第二基板的触点的方法和装置，由此第一基板相对于第二基板定位。 该方法包括提供其第一基底的接触面朝向第二基底，使第二基底的接触面远离第一基底，将接合介质粘合到第一基底的接触面上，将接合介质粘合到第一基底 从而形成环路，将第二基板的接触电连接到接合介质，以及将第二基板提供在从第二基板的边缘延伸的鼻或舌上的接触。 第一基板可以位于第二基板的下方，第一基板的接触连接到第二基板的接触。