公开(公告)号：US20160329264A1

公开(公告)日：2016-11-10

申请号：US14442049

申请日：2012-12-07

申请人： ABB TECHNOLOGY LTD

发明人： Olle EKWALL ,  Erik DORÉ ,  Franc DUGAL ,  Raffael SCHNELL

IPC分类号： H01L23/40 ,  H02M7/00 ,  H01L25/07 ,  H01L25/11 ,  H01L23/367 ,  H01L23/473

CPC分类号： H01L23/4012 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/473 ,  H01L24/72 ,  H01L25/071 ,  H01L25/074 ,  H01L25/117 ,  H01L25/16 ,  H01L2023/4031 ,  H01L2023/4081 ,  H01L2023/4087 ,  H01L2924/1305 ,  H01L2924/13055 ,  H02M7/003 ,  H05K7/209 ,  H01L2924/00

摘要： A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.

摘要翻译： 半导体组件包括具有半导体模块和冷却器的堆叠，其中半导体模块设置成与冷却器接触。 夹紧组件适于在堆叠的两侧施加力。 该堆叠在其两侧之间设置有通孔，并且夹持组件的一部分包括延伸穿过堆叠的通孔的导电部分。 由此，提供紧凑的机械布置，同时获得改进的电性能，例如较低的电感和更均匀的电流分布。