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公开(公告)号:US20160278192A1
公开(公告)日:2016-09-22
申请号:US15034268
申请日:2013-11-05
Applicant: ABB TECHNOLOGY LTD
Inventor: Björn SANDIN , Christer SJÖBERG , Erik DORÉ , Johannes GRAN HIRVIOJA
CPC classification number: H05F3/02 , H01L23/00 , H01L2924/0002 , H02H9/02 , H01L2924/00
Abstract: A high voltage valve arrangement includes a high voltage valve unit; an external electric shield structure arranged at least partially around the high voltage modular valve unit and a grounding system. The grounding system includes a grounding system configured to be remotely extended from a retracted position to an extended position, whereby the extendable grounding device establishes electric connection with the external shield structure when it is extended from the retracted position.
Abstract translation: 高压阀装置包括高压阀单元; 至少部分地围绕高电压模块化阀单元布置的外部电屏蔽结构和接地系统。 接地系统包括被配置为从缩回位置到延伸位置远程延伸的接地系统,由此可伸展接地装置在从缩回位置延伸时与外部屏蔽结构建立电连接。
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公开(公告)号:US20180337015A1
公开(公告)日:2018-11-22
申请号:US15559648
申请日:2015-04-24
Applicant: ABB TECHNOLOGY LTD
Inventor: Erik DORÉ , Henrik BREDER , Ola JEPPSSON
CPC classification number: H01H71/10 , H01H1/2025 , H01H39/00 , H01H71/08 , H01H2235/01 , H02H1/0007
Abstract: A bypass switch provides a bypass path between a first terminal and a second terminal. The bypass switch includes: a first set of electrical contacts respectively connected to the first terminal and the second terminal; a second set of electrical contacts respectively connected to the first terminal and the second terminal; and a movable member. The movable member includes a first conductive section, a second conductive section and an insulator between the first conductive section and the second conductive section, wherein the movable member is movable from an initial state, via a first state, to a second state, wherein in the initial state the first set of electrical contacts are conductively separated and the second set of electrical contacts are conductively separated, in the first state the first set of electrical contacts are conductively connected via the first conductive section and the second set of electrical contacts are conductively separated, and in the second state the second set of electrical contacts are conductively connected via the second conductive section.
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公开(公告)号:US20160329264A1
公开(公告)日:2016-11-10
申请号:US14442049
申请日:2012-12-07
Applicant: ABB TECHNOLOGY LTD
Inventor: Olle EKWALL , Erik DORÉ , Franc DUGAL , Raffael SCHNELL
IPC: H01L23/40 , H02M7/00 , H01L25/07 , H01L25/11 , H01L23/367 , H01L23/473
CPC classification number: H01L23/4012 , H01L23/3675 , H01L23/4006 , H01L23/473 , H01L24/72 , H01L25/071 , H01L25/074 , H01L25/117 , H01L25/16 , H01L2023/4031 , H01L2023/4081 , H01L2023/4087 , H01L2924/1305 , H01L2924/13055 , H02M7/003 , H05K7/209 , H01L2924/00
Abstract: A semiconductor assembly includes a stack with a semiconductor module and a cooler, wherein the semiconductor module is provided in contact with the cooler. A clamping assembly is adapted to exert a force on the two sides of the stack. The stack is provided with a through hole between the two sides thereof and a part of the clamping assembly including an electrically conductive part which extends through the through hole of the stack. Thereby, a compact mechanical arrangement is provided while obtaining improved electrical properties, such as lower inductance and more even current distribution.
Abstract translation: 半导体组件包括具有半导体模块和冷却器的堆叠,其中半导体模块设置成与冷却器接触。 夹紧组件适于在堆叠的两侧施加力。 该堆叠在其两侧之间设置有通孔,并且夹持组件的一部分包括延伸穿过堆叠的通孔的导电部分。 由此,提供紧凑的机械布置,同时获得改进的电性能,例如较低的电感和更均匀的电流分布。
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