公开(公告)号：US09006041B2

公开(公告)日：2015-04-14

申请号：US14046156

申请日：2013-10-04

Applicant: ABB Technology AG

Inventor： Munaf Rahimo ,  Arnost Kopta ,  Thomas Clausen ,  Maxi Andenna

IPC: H01L21/332 ,  H01L21/8224 ,  H01L29/76 ,  H01L29/00 ,  H01L27/082 ,  H01L29/66 ,  H01L29/08 ,  H01L29/36 ,  H01L29/739 ,  H01L29/861

CPC classification number: H01L29/66325 ,  H01L29/0834 ,  H01L29/36 ,  H01L29/6609 ,  H01L29/66136 ,  H01L29/66333 ,  H01L29/66348 ,  H01L29/7393 ,  H01L29/7395 ,  H01L29/7397 ,  H01L29/861

Abstract: A method for manufacturing a bipolar punch-through semiconductor device is disclosed, which includes providing a wafer having a first and a second side, wherein on the first side a high-doped layer of the first conductivity type having constant high doping concentration is arranged; epitaxially growing a low-doped layer of the first conductivity type on the first side; performing a diffusion step by which a diffused inter-space region is created at the inter-space of the layers; creating at least one layer of the second conductivity type on the first side; and reducing the wafer thickness within the high-doped layer on the second side so that a buffer layer is created, which can include the inter-space region and the remaining part of the high-doped layer, wherein the doping profile of the buffer layer decreases steadily from the doping concentration of the high-doped region to the doping concentration of the drift layer.

Abstract translation: 公开了一种制造双极穿通半导体器件的方法，其包括提供具有第一和第二侧的晶片，其中在第一侧上布置具有恒定的高掺杂浓度的第一导电类型的高掺杂层; 在第一侧上外延生长第一导电类型的低掺杂层; 执行扩散步骤，通过该扩散步骤在层的间隔处产生扩散的空间间区域; 在第一侧产生至少一层第二导电类型; 并且减小第二侧上的高掺杂层内的晶片厚度，从而形成缓冲层，其可以包括空间间区域和高掺杂层的剩余部分，其中缓冲层的掺杂分布 从高掺杂区域的掺杂浓度稳定地降低到漂移层的掺杂浓度。