公开(公告)号：US20230154555A1

公开(公告)日：2023-05-18

申请号：US18154372

申请日：2023-01-13

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： STEVEN RAASCH ,  GREG SADOWSKI ,  DAVID A. ROBERTS

IPC: G11C16/34 ,  G06F12/02 ,  G06F3/06 ,  G06F9/50 ,  G11C29/00 ,  G11C11/4076 ,  G11C7/04

CPC classification number: G11C16/3495 ,  G06F12/0246 ,  G06F3/0679 ,  G06F3/0616 ,  G11C16/3418 ,  G06F12/0223 ,  G06F9/50 ,  G11C16/349 ,  G11C29/70 ,  G06F3/064 ,  G11C11/4076 ,  G11C7/04 ,  G06F2212/1036 ,  G06F2212/7211

Abstract: Exemplary embodiments provide wear spreading among die regions (i.e., one or more circuits) in an integrated circuit or among dies by using operating condition data in addition to or instead of environmental data such as temperature data, from each of a plurality of die regions. Control logic produces a cumulative amount of time each of the plurality of die regions has spent at an operating condition based on operating condition data wherein the operating condition data is based on at least one of the following operating characteristics: frequency of operation of the plurality of die regions, an operating voltage of the plurality of die regions, an activity level of the plurality of die regions, a timing margin of the plurality of die regions, and a number of detected faults of the plurality of die regions. The method and apparatus spreads wear among the plurality of same type of die regions by controlling task execution among the plurality of die regions using the die wear-out data.

公开(公告)号：US20210320672A1

公开(公告)日：2021-10-14

申请号：US17348202

申请日：2021-06-15

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： GREG SADOWSKI ,  JOHN KALAMATIANOS

IPC: H03M7/30 ,  H04B1/16 ,  H04B1/04 ,  H04B3/54 ,  H03M5/04

Abstract: Various energy efficient data encoding schemes and computing devices are disclosed. In one aspect, a method of transmitting data from a transmitter to a receiver connected by plural wires is provided. The method includes sending from the transmitter on at least one but not all of the wires a first wave form that has first and second signal transitions. The receiver receives the first waveform and measures a first duration between the first and second signal transitions using a locally generated clock signal not received from the transmitter. The first duration is indicative of a first particular data value.

公开(公告)号：US20240413035A1

公开(公告)日：2024-12-12

申请号：US18809578

申请日：2024-08-20

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： DAVID A. ROBERTS ,  GREG SADOWSKI ,  STEVEN RAASCH

IPC: H01L23/34 ,  G05B15/02 ,  G06F1/20 ,  H01L25/065

Abstract: Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

公开(公告)号：US20230143622A1

公开(公告)日：2023-05-11

申请号：US18152022

申请日：2023-01-09

Applicant: ADVANCED MICRO DEVICES, INC.

Inventor： DAVID A. ROBERTS ,  GREG SADOWSKI ,  STEVEN RAASCH

IPC: H01L23/34 ,  G05B15/02 ,  H01L25/065 ,  G06F1/20

CPC classification number: H01L23/34 ,  G05B15/02 ,  H01L25/0657 ,  G06F1/20 ,  H01L2225/06589

Abstract: Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.

公开(公告)号：US20190108154A1

公开(公告)日：2019-04-11

申请号：US16212930

申请日：2018-12-07

Applicant: Advanced Micro Devices, Inc.

Inventor： GREG SADOWSKI

IPC: G06F13/38 ,  G06F3/06 ,  G06F12/02

Abstract: A method of and device for transferring data is provided. The method includes determining a difference between a data segment that was transferred last relative to each of one or more data segments available to be transferred next. In some embodiments, for so long as no data segment available to be sent has been waiting too long, the data segment chosen to be sent next is the data segment having the smallest difference relative to the data segment transferred last. The chosen data segment is then transmitted as the next data segment transferred.