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公开(公告)号：US20230205306A1
公开(公告)日：2023-06-29
申请号：US17561837
申请日：2021-12-24
IPC分类号： G06F1/3296
CPC分类号： G06F1/3296
摘要： One or more components of a computing device are run by default in a boost mode state. The one or more components continue to run in the boost mode state until the boost mode state is no longer sustainable, e.g., due to power consumption of the one or more components or temperature of the one or more components. The one or more components are switched to a reduced power state (e.g., a non-boost mode state) in response to the boost mode state no longer being sustainable. When operating the one or more components in the boost mode state again becomes sustainable due to power consumption or temperature of the one or more components, the one or more components are returned to the default boost mode state.
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公开(公告)号：US20240192759A1
公开(公告)日：2024-06-13
申请号：US18065313
申请日：2022-12-13
IPC分类号： G06F1/3296 , G06F1/3228 , H01L25/065
CPC分类号： G06F1/3296 , G06F1/3228 , H01L25/0652
摘要： An apparatus and method for efficiently managing performance among replicated modules of an integrated circuit despite manufacturing variations across semiconductor dies. An integrated circuit includes a first module with a first partition of multiple dies that share at least a same first power rail. The integrated circuit also includes a second module with a second partition of multiple dies that share at least a same second power rail different from the first power rail. The dies within partitions have differences in circuit parameters within a threshold such that the dies can be placed in a same first bin. The dies in different partitions belong to different bins. A power manager initially assigns the same operating parameters to the first partition and the second partition, but adjusts the operating parameters based on detection of the different circuit behavior due to manufacturing variations between the first partition and the second partition.
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公开(公告)号：US11709536B2
公开(公告)日：2023-07-25
申请号：US17029852
申请日：2020-09-23
摘要： A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.
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公开(公告)号：US20240143056A1
公开(公告)日：2024-05-02
申请号：US18218463
申请日：2023-07-05
摘要： A multi-die semiconductor package includes a first integrated circuit (IC) die having a first intrinsic performance level and a second IC die having a second intrinsic performance level different from the first intrinsic performance level. A power management controller distributes, based on a determined die performance differential between the first IC die and the second IC die, a level of power allocated to the semiconductor chip package between the first IC die and the second IC die. In this manner, the first IC die receives and operates at a first level of power resulting in performance exceeding its intrinsic performance level. The second IC die receives and operates at a second level of power resulting in performance below its intrinsic performance level, thereby reducing performance differentials between the IC dies.
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公开(公告)号：US12124320B2
公开(公告)日：2024-10-22
申请号：US17854577
申请日：2022-06-30
申请人： ATI Technologies ULC
IPC分类号： G06F1/3296 , G06F1/3228
CPC分类号： G06F1/3296 , G06F1/3228
摘要： An apparatus and method for efficiently updating power supply voltages due to degradation from aging. A computing system includes one or more functional units and a runtime voltage calibrator (or calibrator). The calibrator is capable of performing power supply calibration for the one or more supply voltage power rail used by the one or more functional units. The calibrator identifies a particular ground reference power rail that is received by the one or more functional units. The calibrator also identifies a first supply voltage power rail that is received by at least a first functional unit of the one or more functional units. If the runtime voltage calibrator determines that all circuitry that uses the particular ground reference power rail is idle, the calibrator performs power supply calibration for the first supply voltage power rail. The calibrator does not wait for a bootup operation and avoids interference from ground bounce.
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公开(公告)号：US20240004455A1
公开(公告)日：2024-01-04
申请号：US17854577
申请日：2022-06-30
申请人： ATI Technologies ULC
IPC分类号： G06F1/3296 , G06F1/3228
CPC分类号： G06F1/3296 , G06F1/3228
摘要： An apparatus and method for efficiently updating power supply voltages due to degradation from aging. A computing system includes one or more functional units and a runtime voltage calibrator (or calibrator). The calibrator is capable of performing power supply calibration for the one or more supply voltage power rail used by the one or more functional units. The calibrator identifies a particular ground reference power rail that is received by the one or more functional units. The calibrator also identifies a first supply voltage power rail that is received by at least a first functional unit of the one or more functional units. If the runtime voltage calibrator determines that all circuitry that uses the particular ground reference power rail is idle, the calibrator performs power supply calibration for the first supply voltage power rail. The calibrator does not wait for a bootup operation and avoids interference from ground bounce.
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