公开(公告)号：US20150092373A1

公开(公告)日：2015-04-02

申请号：US14043970

申请日：2013-10-02

Applicant: ALCATEL-LUCENT CANADA INC.

Inventor： Alex CHAN ,  Paul J. BROWN

IPC: H05K1/11 ,  H05K13/04 ,  G06F17/50

CPC classification number: H05K1/111 ,  G06F17/5077 ,  H05K1/112 ,  H05K1/114 ,  H05K3/0005 ,  H05K3/282 ,  H05K2201/09381 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10734 ,  Y02P70/611 ,  Y10T29/49144

Abstract: Various exemplary embodiments relate to a printed circuit board (PCB) comprising a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern; through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads; a solder mask covering the via pad with an opening; a solder pad within said opening electrically connected to said via pad; and a two-lead component attached to said solder pad.

Abstract translation: 各种示例性实施例涉及一种印刷电路板（PCB），其包括以栅格图案布置的PCB一侧上的BGA焊盘的球栅阵列（BGA）; 通孔通孔，包括通孔焊盘，布置成电连接到所述BGA焊盘的所述栅格图案; 覆盖通孔垫的开口的焊接掩模; 所述开口内的焊盘，电连接到所述通孔焊盘; 以及连接到所述焊盘的双引线部件。