Abstract:
Pixel binning is performed by summing charge from some pixels positioned diagonally in a pixel array. Pixel signals output from pixels positioned diagonally in the pixel array may be combined on the output lines. A signal representing summed charge produces a binned 2×1 cluster. A signal representing combined voltage signals produces a binned 2×1 cluster. A signal representing summed charge and a signal representing combined pixel signals can be combined digitally to produce a binned 2×2 pixel. Orthogonal binning may be performed on other pixels in the pixel array by summing charge on respective common sense regions and then then combining the voltage signals that represent the summed charge on respective output lines.
Abstract:
A sequence of digital images are produced using an imaging sensor circuit, wherein each of the digital images was a result of light capture by the imaging sensor circuit during a respective pixel integration phase followed by analog to digital conversion during a respective readout phase. A camera actuator is driven while producing the sequence of images, wherein during a part of every respective readout phase for the sequence of digital images the actuator is driven using a linear drive circuit, and wherein during a part of every respective pixel integration phase the actuator is driven using a switch mode drive circuit. Other embodiments are also described and claimed.
Abstract:
An image sensor includes an imaging area and one or more flicker detection regions. The imaging area includes pixels that capture one or more images. Each flicker detection region includes pixels that are sampled multiple times while an image is being captured. The samples can be analyzed to detect flicker in the scene being imaged.
Abstract:
Electronic devices may be provided with magnetic sensors for detecting the Earth's magnetic field. The magnetic sensors may include thin magnetic sensors located in magnetically quiet regions of the device. The magnetic sensors may be attached to a device housing or a component such as a battery or a cover structure for a battery. The device may include unidirectional magnetic sensors aligned in three orthogonal directions or sensors with two or three magnetic sensor elements aligned in orthogonal directions. Magnetic field data from the three orthogonally aligned sensors or sensor elements may be combined to form directional compass data for the device. Each magnetic sensor may include one or more magnetic sensor elements for detecting the magnetic field and one or more shielded reference sensor elements for detecting environmental changes that can affect the magnetic sensor element. Reference sensor elements may be shared elements for multiple magnetic sensors elements.
Abstract:
Pixel binning is performed by summing charge from some pixels positioned diagonally in a pixel array. Pixel signals output from pixels positioned diagonally in the pixel array may be combined on the output lines. A signal representing summed charge produces a binned 2×1 cluster. A signal representing combined voltage signals produces a binned 2×1 cluster. A signal representing summed charge and a signal representing combined pixel signals can be combined digitally to produce a binned 2×2 pixel. Orthogonal binning may be performed on other pixels in the pixel array by summing charge on respective common sense regions and then combining the voltage signals that represent the summed charge on respective output lines.
Abstract:
An image sensor and a method of operating an image sensor to achieve a substantially uniform power signature. An array of pixels may be scanned using analog sensing circuitry to obtain an analog sensor output. The scanning is performed over a first time interval. The analog sensor output is converted to a digital data output using digital logic circuitry. The converting occurs over a second time interval that is subsequent to the first time interval and may be substantially the same duration as the first time interval. While the array of pixels are being scanned, the digital logic circuitry is operated over the first time interval and substantially coincides with the scanning of the array of pixels.
Abstract:
An image sensor includes pixels that accumulate charge during a first integration period and pixels that accumulate charge during shorter second integration periods when an image is captured. The pixels having the shorter second integration period accumulate charge at two or more different times during the first integration period. Charge is read out of the pixels associated with the first integration period at the end of the first integration period, while charge is read out of the pixels having the second integration period at the end of each second integration period.
Abstract:
One or more cross-wafer capacitors are formed in an electronic component, circuit, or device that includes stacked wafers. One example of such a device is a stacked image sensor. The image sensor can include two or more wafers, with two wafers that are bonded to each other each including a conductive segment adjacent to, proximate, or abutting a bonding surface of the respective wafer. The conductive segments are positioned relative to each other such that each conductive element forms a plate of a capacitor. A cross-wafer capacitor is formed when the two wafers are attached to each other.
Abstract:
One or more cross-wafer capacitors are formed in an electronic component, circuit, or device that includes stacked wafers. One example of such a device is a stacked image sensor. The image sensor can include two or more wafers, with two wafers that are bonded to each other each including a conductive segment adjacent to, proximate, or abutting a bonding surface of the respective wafer. The conductive segments are positioned relative to each other such that each conductive element forms a plate of a capacitor. A cross-wafer capacitor is formed when the two wafers are attached to each other.
Abstract:
Electronic devices may be provided with magnetic sensors for detecting the Earth's magnetic field. The magnetic sensors may include thin magnetic sensors located in magnetically quiet regions of the device. The magnetic sensors may be attached to a device housing or a component such as a battery or a cover structure for a battery. The device may include unidirectional magnetic sensors aligned in three orthogonal directions or sensors with two or three magnetic sensor elements aligned in orthogonal directions. Magnetic field data from the three orthogonally aligned sensors or sensor elements may be combined to form directional compass data for the device. Each magnetic sensor may include one or more magnetic sensor elements for detecting the magnetic field and one or more shielded reference sensor elements for detecting environmental changes that can affect the magnetic sensor element. Reference sensor elements may be shared elements for multiple magnetic sensors elements.