公开(公告)号：US20150382448A1

公开(公告)日：2015-12-31

申请号：US14503067

申请日：2014-09-30

Applicant: APPLE INC.

Inventor： Shankar S. PENNATHUR ,  Carlos A.S. RIBAS ,  Deniz TEOMAN ,  Michael ENG

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/28

CPC classification number: H05K1/0212 ,  G06F1/20 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/34 ,  H01L23/36 ,  H01L23/4334 ,  H01L23/552 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15192 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/023 ,  H05K3/284 ,  H05K3/303 ,  H01L2924/00

Abstract: A compact portable electronic device packaged into a System-in-Package assembly and thermal solutions for the device is disclosed. The compact portable electronic device can be assembled into a single package to reduce size and enhance form factor. Several tens or hundreds of components including multiple dies, passive components, mechanical or optical components can be packaged into a single system on a printed circuit board. One or more of the components can dissipate a lot of power resulting in the generation of excess heat. To remove the excess heat, the device can include one or more thermal solutions such as internal thermal plugs, heat spreaders, internal embedded heat sinks, and/or external heat sinks. In some examples, the thermal solutions can dissipate heat via conduction to the bottom of the substrate or via convection to the top of the system or a combination of both.

Abstract translation: 公开了一种紧凑的便携式电子设备，其被封装成系统级封装组件和该器件的热解决方案。 紧凑型便携式电子设备可以组装成单个包装以减小尺寸并增强外形尺寸。 包括多个管芯，无源部件，机械或光学部件的数十或数百个部件可以封装在印刷电路板上的单个系统中。 一个或多个组件可以耗散大量的功率，导致产生过多的热量。 为了去除多余的热量，该装置可以包括一个或多个热解决方案，例如内部热插塞，散热器，内部嵌入式散热器和/或外部散热器。 在一些实例中，热解决方案可以通过导电散热到衬底的底部，或通过对系统的顶部或二者的组合来散热。

公开(公告)号：US20170199625A1

公开(公告)日：2017-07-13

申请号：US15470690

申请日：2017-03-27

Applicant: Apple Inc.

Inventor： Steven P. HOTELLING ,  David AMM ,  Michael LAMMERS ,  John T. ORCHARD ,  Brian Michael KING ,  Omar S. LEUNG ,  Deniz TEOMAN

IPC: G06F3/041 ,  G06F3/044

CPC classification number: G06F3/0418 ,  G06F3/044

Abstract: Ground detection of a touch sensitive device is disclosed. The device can detect its grounded state so that poor grounding can be selectively compensated for in touch signals outputted by the device. The device can include one or more components to monitor certain conditions of the device. The device can analyze the monitored conditions to determine the grounding condition of the device. The device can apply a function to compensate its touch signal outputs if the device determines that it is poorly grounded. Conversely, the device can omit the function if the device determines that it is well grounded.