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    Multi-connector assembly
    2.
    发明授权
    Multi-connector assembly 有权
    多连接器总成

    公开(公告)号：US09112316B2

    公开(公告)日：2015-08-18

    申请号：US14262352

    申请日：2014-04-25

    Applicant: APPLE INC.

    Inventor： Douglas Joseph Weber ,  Pinida Jan Moolsintong

    IPC: H05K5/00 ,  H01R12/70 ,  H01R13/631 ,  H05K7/14 ,  H01R13/518

    CPC classification number: H01R12/70 ,  H01R13/518 ,  H01R13/6315 ,  H05K7/1418 ,  H05K7/1427

    Abstract: The present invention can relate to multiple-connector assemblies for use in, for example, electronic devices. Each of the connectors are constrained to another connector by aligning one or more complementary sets of reference features. A locating bracket may be used to couple multiple connectors together. Alternatively, the connectors may be coupled to each other directly. The electronic device also may include a retainer coupled to the connectors (either directly or indirectly through the locating bracket). The retainer and a surface of one of the connectors may form a single plane to which an end cap of the housing may be coupled, thereby accurately locating the end cap with respect to the connectors. The present invention also can relate to methods of manufacturing such an electronic device.

    Abstract translation: 本发明可涉及用于例如电子设备的多连接器组件。 通过对齐一个或多个互补的参考特征集，将每个连接器约束到另一个连接器。 定位支架可用于将多个连接器连接在一起。 或者，连接器可以直接彼此耦合。 电子设备还可以包括联接到连接器（直接地或间接地通过定位支架）的保持器。 保持器和一个连接器的表面可以形成单个平面，壳体的端盖可以联接到该平面，从而相对于连接器精确地定位端盖。 本发明还可以涉及制造这种电子设备的方法。

    MULTI-CONNECTOR ASSEMBLY
    3.
    发明申请
    MULTI-CONNECTOR ASSEMBLY 审中-公开
    多连接器总成

    公开(公告)号：US20150004825A1

    公开(公告)日：2015-01-01

    申请号：US14262352

    申请日：2014-04-25

    Applicant: APPLE INC.

    Inventor： Douglas Joseph Weber ,  Pinida Jan Moosintong

    IPC: H01R12/70 ,  H05K7/14

    CPC classification number: H01R12/70 ,  H01R13/518 ,  H01R13/6315 ,  H05K7/1418 ,  H05K7/1427

    Abstract: The present invention can relate to multiple-connector assemblies for use in, for example, electronic devices. Each of the connectors are constrained to another connector by aligning one or more complementary sets of reference features. A locating bracket may be used to couple multiple connectors together. Alternatively, the connectors may be coupled to each other directly. The electronic device also may include a retainer coupled to the connectors (either directly or indirectly through the locating bracket). The retainer and a surface of one of the connectors may form a single plane to which an end cap of the housing may be coupled, thereby accurately locating the end cap with respect to the connectors. The present invention also can relate to methods of manufacturing such an electronic device.

    Abstract translation: 本发明可以涉及用于例如电子设备的多连接器组件。 通过对齐一个或多个互补的参考特征集，将每个连接器约束到另一个连接器。 定位支架可用于将多个连接器连接在一起。 或者，连接器可以直接彼此耦合。 电子设备还可以包括联接到连接器（直接地或间接地通过定位支架）的保持器。 保持器和一个连接器的表面可以形成单个平面，壳体的端盖可以联接到该平面，从而相对于连接器精确地定位端盖。 本发明还可以涉及制造这种电子设备的方法。

    RETENTION OF MAGNETIC PROPERTIES
    4.
    发明申请
    RETENTION OF MAGNETIC PROPERTIES 有权
    磁性特性的保留

    公开(公告)号：US20140174607A1

    公开(公告)日：2014-06-26

    申请号：US13955996

    申请日：2013-07-31

    Applicant: Apple Inc.

    Inventor： Douglas Joseph Weber ,  Julio C. Quintero ,  Benjamin M. Rappoport ,  Harry W. Smith, IV

    IPC: B29C33/04

    CPC classification number: B29C45/14836 ,  B29C45/78 ,  B29C2945/76157 ,  B29C2945/76294 ,  B29C2945/76531 ,  B29C2945/76545 ,  B29C2945/76772 ,  B29C2945/76782 ,  B29C2945/76933 ,  B29K2995/0008

    Abstract: Methods, systems, and apparatuses for retaining magnetic properties of magnetic elements while undergoing manufacturing processes are presented. In one embodiment, a manufacturing fixture includes a temperature controlled region suitable for retaining a magnetic element. The manufacturing fixture also includes a cooling mechanism configured to maintain the magnetic element at an acceptable temperature range during a thermally active manufacturing process. The temperature controlled or stabilized region can include a structure configured to receive the magnetic element and a sensor, or sensors. In one embodiment, the sensor can be configured to measure an ambient temperature of the temperature stabilized region. In another embodiment, the sensor can be a magnetic sensor configured to determine a magnetic property of the magnetic element.

    Abstract translation: 介绍了在制造过程中保持磁性元件磁性能的方法，系统和装置。 在一个实施例中，制造夹具包括适于保持磁性元件的温度控制区域。 制造夹具还包括冷却机构，其构造成在热活性制造过程期间将磁性元件保持在可接受的温度范围。 温度控制或稳定区域可以包括被配置为接收磁性元件和传感器或传感器的结构。 在一个实施例中，传感器可被配置成测量温度稳定区域的环境温度。 在另一个实施例中，传感器可以是被配置为确定磁性元件的磁性的磁传感器。

    METHODS FOR SECURING FEATURES TO HOUSINGS
    5.
    发明申请
    METHODS FOR SECURING FEATURES TO HOUSINGS 审中-公开
    用于将特征保护到住房的方法

    公开(公告)号：US20140109382A1

    公开(公告)日：2014-04-24

    申请号：US14135391

    申请日：2013-12-19

    Applicant: Apple Inc.

    Inventor： Douglas Joseph Weber

    IPC: B23P19/04 ,  H05K5/02

    CPC classification number: B23P19/04 ,  B29C45/14311 ,  B29C45/14344 ,  B29C45/14811 ,  B29C45/1657 ,  B29C45/1671 ,  B29C2045/14327 ,  B29K2705/00 ,  B29L2031/3481 ,  B32B37/02 ,  B32B38/04 ,  B32B2038/047 ,  B32B2457/00 ,  B32B2553/00 ,  H05K5/02 ,  H05K5/0217 ,  Y10T29/4998 ,  Y10T428/24008 ,  Y10T428/24289

    Abstract: A housing for an electronic device as well as methods for forming the housing are disclosed. The housing can be formed from a substrate having perforations to assist in adhering components internal to the housing. The substrate is typically a multi-layer substrate having at least two layers. In one embodiment, an inner layer of the multi-layer substrate can be provided with perforations. The perforations can them be used to adhere internal features to the multi-layer substrate. The internal features can be used for attaching parts or components to the multi-layer substrate, thereby securing the parts or components to the multi-layer substrate and thus the housing.

    Abstract translation: 公开了一种用于电子设备的外壳以及用于形成外壳的方法。 壳体可以由具有穿孔的基底形成，以有助于粘附在壳体内部的部件。 衬底通常是具有至少两层的多层衬底。 在一个实施例中，多层基底的内层可以设有穿孔。 穿孔可用于将内部特征粘附到多层基底。 内部特征可以用于将部件或部件附接到多层基板，从而将部件或部件固定到多层基板，从而将部件或部件固定到外壳上。

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