公开(公告)号：US20150367545A1

公开(公告)日：2015-12-24

申请号：US14311330

申请日：2014-06-22

Applicant: APPLE INC.

Inventor： Bruce E. Berg ,  Christopher J. Stringer ,  Glenn Aune ,  Ryan P. Brooks

IPC: B29C45/26 ,  B29C33/76 ,  B29C45/36

CPC classification number: B29C45/4421 ,  B29C45/2628 ,  B29C45/33 ,  Y10T428/139

Abstract: An article for use in an injection molding process is disclosed. The article is a sleeve which may be used to facilitate the removal of a molded part from a central core. The device eliminates the need for a draft angle which may be unsuitable for molded parts in certain applications. A method for injection molding is disclosed which uses this sleeve in the injection molding process. An article produced by this process is also disclosed.

Abstract translation: 公开了一种用于注射成型工艺的制品。 该制品是可以用于促进将模制件从中心芯移除的套筒。 该装置不需要在某些应用中可能不适合于模制部件的拔模角。 公开了一种用于注射成型的方法，其在注射成型工艺中使用该套筒。 还公开了通过该方法生产的制品。

公开(公告)号：US09582085B2

公开(公告)日：2017-02-28

申请号：US14502949

申请日：2014-09-30

Applicant: Apple Inc.

Inventor： Aidan N. Zimmerman ,  Bruce E. Berg ,  Glenn Aune ,  Kevin C. Armendariz ,  Ryan P. Brooks

IPC: G06F3/0354 ,  G06F3/046 ,  H01Q1/24 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00 ,  H05K3/40 ,  G06F3/044 ,  H05K3/28

CPC classification number: G06F3/03545 ,  G06F3/044 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2924/3025 ,  H01Q1/243 ,  H05K1/0274 ,  H05K1/115 ,  H05K3/0014 ,  H05K3/284 ,  H05K3/4038 ,  H05K2201/09027 ,  H05K2201/09545

Abstract: An electronic device may have printed circuits to which electrical components are mounted. Plastic may be molded over a printed circuit. Vias may be formed in the printed circuit that connect metal traces on the surface of the molded plastic to metal traces on the printed circuit. The vias may be formed by drilling or by covering the metal traces on the printed circuit with mold pins in a molding tool during plastic molding operations. Plated metal traces or other metal traces may extend onto the interior surface of via holes. Vias may also be filled with conductive material such as solder or conductive adhesive. Metal members that are soldered or otherwise connected to printed circuit traces may be used in coupling surface metal traces to printed circuit traces. Antenna structure, shielding structures, and electrodes for a stylus may be formed using the metal traces on the molded plastic.

Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 塑料可以在印刷电路上模制。 可以在印刷电路中形成通孔，其将模制塑料表面上的金属迹线连接到印刷电路上的金属迹线。 可以通过在塑料模制操作期间通过钻孔或通过在模制工具中的模具销覆盖印刷电路上的金属迹线来形成通孔。 镀金属痕迹或其他金属迹线可延伸到通孔的内表面。 通孔也可以填充导电材料，例如焊料或导电粘合剂。 焊接或以其他方式连接到印刷电路迹线的金属构件可用于将表面金属迹线耦合到印刷电路迹线。 用于触针的天线结构，屏蔽结构和电极可以使用模制塑料上的金属迹线形成。