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    Optical Sensor Package with Magnetic Component for Device Attachment
    2.
    发明申请
    Optical Sensor Package with Magnetic Component for Device Attachment 有权

    公开(公告)号：US20220085231A1

    公开(公告)日：2022-03-17

    申请号：US17473745

    申请日：2021-09-13

    Applicant: Apple Inc.

    Inventor： Saijin Liu ,  Tongbi T. Jiang ,  Saahil Mehra

    IPC: H01L31/167 ,  H02J50/10 ,  G06F1/16 ,  G04G21/02 ,  G04C10/00 ,  A61B5/00

    Abstract: An integrated sensor package for an electronic device may include a matrix material defining a body structure of the integrated sensor package, a light emitting diode at least partially encapsulated in the matrix material, a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package, a via structure at least partially encapsulated in the matrix material, a permanent magnet at least partially encapsulated in the matrix material, a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure, and a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.

    VCSEL structure with embedded heat sink
    3.
    发明授权
    VCSEL structure with embedded heat sink 有权

    公开(公告)号：US10103512B2

    公开(公告)日：2018-10-16

    申请号：US15641244

    申请日：2017-07-04

    Applicant: APPLE INC.

    Inventor： Tongbi T. Jiang ,  Weiping Li ,  Xiaofeng Fan

    IPC: H01S5/024 ,  H01S5/42 ,  H01S5/042 ,  H01S5/183

    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

    Blood pressure monitoring system including a liquid filled sensor
    4.
    发明授权
    Blood pressure monitoring system including a liquid filled sensor 有权

    公开(公告)号：US12251204B2

    公开(公告)日：2025-03-18

    申请号：US17166914

    申请日：2021-02-03

    Applicant: Apple Inc.

    Inventor： Caleb C. Han ,  Patrick E. O'Brien ,  Tongbi T. Jiang

    IPC: A61B5/022 ,  A61B5/00 ,  A61B5/318

    Abstract: Embodiments are directed to a blood pressure measurement device that includes a strap configured to couple the blood pressure measurement device to a user, an air pump coupled to the strap and having a housing defining a surface facing the user, and an inflatable chamber positioned on the surface of the air pump and fluidly coupled to the air pump. The inflatable chamber can be positioned between the air pump and the user when the blood pressure measurement device is worn by the user and expand towards the user when inflated. The blood pressure measurement device can also include a pressure sensing chamber coupled to the inflatable chamber and positioned between the inflatable chamber and the user when the blood pressure measurement device is worn by the user. The pressure sensing chamber can include a liquid volume and a pressure sensing device configured to detect a pressure of the liquid volume.

    SYSTEMS AND METHODS FOR MAGNETIC BARRIER ASSEMBLY
    5.
    发明申请
    SYSTEMS AND METHODS FOR MAGNETIC BARRIER ASSEMBLY 有权

    公开(公告)号：US20230090608A1

    公开(公告)日：2023-03-23

    申请号：US17539745

    申请日：2021-12-01

    Applicant: Apple Inc.

    Inventor： Saijin Liu ,  Tongbi T. Jiang

    IPC: H05K5/02 ,  G01V8/20 ,  H01F7/02

    Abstract: An embodiment of a barrier assembly includes a housing having an aperture and a magnet at least partially disposed within the housing. A first surface of the magnet is exposed. The barrier assembly also includes a light-emitting component disposed within the aperture. Another embodiment of a barrier assembly includes a housing having a plurality of apertures formed about a perimeter of the housing. The barrier assembly also includes a magnet at least partially embedded within the housing and the magnet includes an opening formed through a center of the magnet and a plurality of light-emitting components, each light-emitting component at least partially disposed within a corresponding aperture of the plurality of apertures.

    Edge-mountable semiconductor chip package
    7.
    发明授权
    Edge-mountable semiconductor chip package 有权

    公开(公告)号：US11211515B2

    公开(公告)日：2021-12-28

    申请号：US16287965

    申请日：2019-02-27

    Applicant: Apple Inc.

    Inventor： Tongbi T. Jiang ,  Miaolei Yan

    IPC: H01L33/62 ,  H01L31/16 ,  H01L33/56 ,  H01L31/02 ,  H01L25/16 ,  G01J1/42 ,  G01N27/04

    Abstract: A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.

    Edge-Mountable Semiconductor Chip Package
    8.
    发明申请
    Edge-Mountable Semiconductor Chip Package 审中-公开

    公开(公告)号：US20200274020A1

    公开(公告)日：2020-08-27

    申请号：US16287965

    申请日：2019-02-27

    Applicant: Apple Inc.

    Inventor： Tongbi T. Jiang ,  Miaolei Yan

    IPC: H01L31/16 ,  H01L33/56 ,  H01L31/02 ,  H01L33/62 ,  H01L25/16 ,  G01J1/42

    Abstract: A device includes a semiconductor chip, and a semiconductor chip package in which the semiconductor chip is packaged. The semiconductor chip has a first major surface opposite a second major surface, and a set of four edges extending between the first major surface and the second major surface. The semiconductor chip package includes at least first and second electrodes exposed to an exterior of the semiconductor chip package and positioned apart from the semiconductor chip. The at least first and second electrodes overlap only one edge of the semiconductor chip. The semiconductor chip package also includes a filler that is molded between the semiconductor chip and each of the at least first and second electrodes.

    VCSEL structure with embedded heat sink
    9.
    发明授权
    VCSEL structure with embedded heat sink 有权

    公开(公告)号：US10454241B2

    公开(公告)日：2019-10-22

    申请号：US16106037

    申请日：2018-08-21

    Applicant: APPLE INC.

    Inventor： Tongbi T. Jiang ,  Weiping Li ,  Xiaofeng Fan

    IPC: H01S5/024 ,  H01S5/42 ,  H01S5/042 ,  H01S5/183 ,  H01S5/02 ,  H01S5/026

    Abstract: An optoelectronic device includes a semiconductor substrate, having front and back sides and having at least one cavity extending from the back side through the semiconductor substrate into proximity with the front side. At least one optoelectronic emitter is formed on the front side of the semiconductor substrate in proximity with the at least one cavity. A heat-conducting material at least partially fills the at least one cavity and is configured to serve as a heat sink for the at least one optoelectronic emitter.

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