公开(公告)号：US09279604B2

公开(公告)日：2016-03-08

申请号：US13902310

申请日：2013-05-24

Applicant: APPLIED MATERIALS, INC.

Inventor： David K. Carlson ,  Errol Antonio C. Sanchez ,  Kenric Choi ,  Marcel E. Josephson ,  Dennis Demars ,  Emre Cuvalci ,  Mehmet Tugrul Samir

IPC: F25B21/02 ,  C23C16/448

CPC classification number: F25B21/02 ,  C23C16/448 ,  C23C16/4482

Abstract: Methods and apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; a heat sink coupled to the one or more thermoelectric devices; and a fan disposed proximate to a back side of the heat sink to provide a flow of air to the heat sink.

Abstract translation: 本文提供了用于基板处理的前体的热管理方法和装置。 在一些实施例中，用于对基板处理中使用的前体进行热管理的设备可以包括具有开口尺寸的开口的主体，该开口的尺寸适于容纳设置在其中的液体或固体前体的存储容器，所述主体由导热材料制成; 一个或多个耦合到靠近开口的本体的热电装置; 耦合到所述一个或多个热电装置的散热器; 以及靠近所述散热器的后侧设置的风扇，以向所述散热器提供空气流。

公开(公告)号：US09347696B2

公开(公告)日：2016-05-24

申请号：US13902304

申请日：2013-05-24

Applicant: APPLIED MATERIALS, INC.

Inventor： David K. Carlson ,  Errol Antonio C. Sanchez ,  Kenric Choi ,  Marcel E. Josephson ,  Dennis Demars

IPC: F25B21/02 ,  C23C16/448

CPC classification number: F25B21/02 ,  C23C16/448 ,  C23C16/4482

Abstract: Apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; and a heat sink coupled to the one or more thermoelectric devices.

Abstract translation: 本文提供了用于基板处理中使用的前体的热管理装置。 在一些实施例中，用于对基板处理中使用的前体进行热管理的设备可以包括具有开口尺寸的开口的主体，该开口的尺寸适于容纳设置在其中的液体或固体前体的存储容器，所述主体由导热材料制成; 一个或多个耦合到靠近开口的本体的热电装置; 以及耦合到所述一个或多个热电装置的散热器。