公开(公告)号：US20250069914A1

公开(公告)日：2025-02-27

申请号：US18811897

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The degas station includes a housing, a magnetic levitation system coupled to the housing configured to levitate and move a carrier within the housing, a first heater assembly and a second heater assembly. The first heater assembly is disposed in the housing. The first heater assembly includes a first support, a first reflector disposed within the housing by the first support, and a first heat source coupled to reflector. The second heater assembly is disposed in the housing above the first heater assembly. The second heater assembly includes a second support, a second reflector disposed within the housing by the second support, and a second heat source coupled to the second reflector. At least one substrate support member is disposed between the first heater assembly and the second heater assembly.

公开(公告)号：US20250069915A1

公开(公告)日：2025-02-27

申请号：US18811911

申请日：2024-08-22

Applicant: Applied Materials, Inc.

Inventor： Thomas BREZOCZKY ,  Punnati KRUSHNA REDDY ,  Azhar ALI M.A. ,  Kirankumar Neelasandra SAVANDAIAH ,  Lakshmikanth Krishnamurthy SHIRAHATTI ,  Dhritiman Subha KASHYAP

IPC: H01L21/67 ,  H01L21/324 ,  H01L21/677 ,  H01L21/687

Abstract: Degas stations for degassing substrates that are conveyed through a substrate processing system on a magnetically levitated carrier and related methods are provided. The method includes magnetically levitating a carrier with a substrate disposed thereon in a first position between a reflector assembly and a heater assembly disposed within a housing of the station. The method further includes moving both the reflector assembly and the heater assembly from a retracted position to an extended position while the carrier is disposed between the reflector assembly and heater assembly. The method further includes degassing the substrate disposed on the carrier with the heater assembly while the reflector assembly and heater assembly are each in the extended position, wherein the degassing includes pumping a purge gas through a gas port formed in at least one of the reflector assembly or the heater assembly towards the substrate.

公开(公告)号：US20160322239A1

公开(公告)日：2016-11-03

申请号：US14749209

申请日：2015-06-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Pulkit AGARWAL ,  Bonnie T. CHIA ,  Song-Moon SUH ,  Cheng-Hsiung TSAI ,  Dhritiman Subha KASHYAP ,  Xiaoxiong YUAN ,  Eric RIESKE

IPC: H01L21/67 ,  B24C1/00

CPC classification number: B24C1/003 ,  B24C3/322 ,  H01L21/67028

Abstract: Embodiments of methods and apparatus for cleaning contaminants from a substrate are disclosed herein. In some embodiments, a substrate cleaning apparatus includes: a substrate support to support a substrate along an edge of the substrate, wherein the substrate further includes a first side and an opposing second side having contaminants disposed on the second side; a showerhead disposed a first distance of about 1.5 mm to about 4.4 mm opposite the substrate support and facing the first side of the substrate; and one or more nozzles disposed a second distance of about 1 inch to about 2 inches beneath the substrate support to discharge a mixture of solid and gaseous carbon dioxide toward the contaminants on the second side of the substrate, and wherein the one or more nozzles have an angle of about 20 to about 40 degrees.

Abstract translation: 本文公开了用于从衬底清洁污染物的方法和设备的实施例。 在一些实施例中，基板清洁装置包括：基板支撑件，用于沿着基板的边缘支撑基板，其中所述基板还包括第一侧和相对的第二侧，其具有设置在所述第二侧上的污染物; 喷头，其布置在与基板支撑件相对的大约1.5mm至大约4.4mm的第一距离处，并面向基板的第一侧; 以及一个或多个喷嘴，其在基板支撑件下方设置约1英寸至约2英寸的第二距离，以将固体和气态二氧化碳的混合物朝向基板的第二侧上的污染物排出，并且其中所述一个或多个喷嘴具有 约20至约40度的角度。

公开(公告)号：US20240068096A1

公开(公告)日：2024-02-29

申请号：US18199223

申请日：2023-05-18

Applicant: Applied Materials, Inc.

Inventor： Anantha K. SUBRAMANI ,  Seyyed Abdolreza FAZELI ,  Yang GUO ,  Chandrashekara BAGINAGERE ,  Ramcharan SUNDAR ,  Steven MOSBRUCKER ,  John LEE ,  Yiyang WAN ,  Shumao ZHANG ,  Dhritiman Subha KASHYAP ,  Azhar ALI M.A

IPC: C23C16/455 ,  C23C16/505

CPC classification number: C23C16/4557 ,  C23C16/505

Abstract: In some embodiments, a showerhead assembly includes a heated showerhead having a heater plate and a gas distribution plate coupled together; an ion filter spaced from the heated showerhead; a spacer ring in contact between the heated showerhead and the ion filter; a remote plasma region between the heated showerhead and the ion filter; an upper isolator spaced from the spacer ring and supported on the ion filter; a sealing ring fastened to the heated showerhead sealing against the upper isolator and pushing the upper isolator against the ion filter; a gap between a bottom of the gas distribution plate and a top of the ion filter, the gap being in fluid communication with the remote plasma region; a first passage extending through the heater plate; and a second passage in communication with the first passage and extending through the gas distribution plate, the second passage extending to the gap.

公开(公告)号：US20200230782A1

公开(公告)日：2020-07-23

申请号：US16838848

申请日：2020-04-02

Applicant: APPLIED MATERIALS, INC.

Inventor： Pulkit AGARWAL ,  Bonnie T. CHIA ,  Song-Moon SUH ,  Cheng-Hsiung TSAI ,  Dhritiman Subha KASHYAP ,  Xiaoxiong YUAN ,  Eric RIESKE

IPC: B24C1/00 ,  B24C3/32 ,  H01L21/67

Abstract: Embodiments of methods and apparatus for cleaning contaminants from a substrate are disclosed herein. In some embodiments, a substrate cleaning apparatus includes: a substrate support to support a substrate along an edge of the substrate, wherein the substrate further includes a first side and an opposing second side having contaminants disposed on the second side; a showerhead disposed a first distance of about 1.5 mm to about 4.4 mm opposite the substrate support and facing the first side of the substrate; and one or more nozzles disposed a second distance of about 1 inch to about 2 inches beneath the substrate support to discharge a mixture of solid and gaseous carbon dioxide toward the contaminants on the second side of the substrate, and wherein the one or more nozzles have an angle of about 20 to about 40 degrees.