公开(公告)号：US20130319015A1

公开(公告)日：2013-12-05

申请号：US13902310

申请日：2013-05-24

Applicant: APPLIED MATERIALS, INC.

Inventor： DAVID K. CARLSON ,  ERROL ANTONIO C. SANCHEZ ,  KENRIC CHOI ,  MARCEL E. JOSEPHSON ,  DENNIS DEMARS ,  EMRE CUVALCI ,  MEHMET TUGRUL SAMIR

IPC: F25B21/02

CPC classification number: F25B21/02 ,  C23C16/448 ,  C23C16/4482

Abstract: Methods and apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; a heat sink coupled to the one or more thermoelectric devices; and a fan disposed proximate to a back side of the heat sink to provide a flow of air to the heat sink.

Abstract translation: 本文提供了用于基板处理的前体的热管理方法和装置。 在一些实施例中，用于对基板处理中使用的前体进行热管理的设备可以包括具有开口尺寸的开口的主体，该开口的尺寸适于容纳设置在其中的液体或固体前体的存储容器，所述主体由导热材料制成; 一个或多个耦合到靠近开口的本体的热电装置; 耦合到所述一个或多个热电装置的散热器; 以及靠近所述散热器的后侧设置的风扇，以向所述散热器提供空气流。

公开(公告)号：US20130220221A1

公开(公告)日：2013-08-29

申请号：US13769912

申请日：2013-02-19

Applicant: Applied Materials, Inc.

Inventor： ERROL ANTONIO C. SANCHEZ ,  MARCEL E. JOSEPHSON ,  JAIDEV RAJARAM ,  RICHARD O. COLLINS ,  DAVID K. CARLSON

IPC: C23C16/455

CPC classification number: C23C16/455 ,  C23C16/4482 ,  C23C16/4483 ,  Y10T137/0318 ,  Y10T137/6416

Abstract: Methods and apparatus for delivering a gas mixture to a process chamber are provided herein. In some embodiments, a precursor delivery apparatus may include an ampoule having a body with a first volume to hold a liquid precursor, an inlet to receive the liquid precursor and a carrier gas, and an outlet to flow a gas mixture of the liquid precursor and the carrier gas from the ampoule; a first heater disposed proximate to or in the first volume to heat the liquid precursor disposed in the first volume proximate to or at a first location within the first volume where the liquid precursor contacts the carrier gas; and a heat transfer apparatus disposed about the body to at least one of provide heat to or remove heat from the ampoule.

Abstract translation: 本文提供了将气体混合物输送到处理室的方法和装置。 在一些实施方案中，前体输送装置可以包括具有第一体积以容纳液体前体的本体的安瓿，用于接收液体前体和载气的入口，以及使液体前体和 来自安瓿的载气; 设置在第一体积附近或第一体积中的第一加热器，用于加热设置在第一体积中的液体前体，该液体前体靠近第一容积或液体前体接触载气的第一容积内的第一位置; 以及传热装置，其围绕所述主体设置为向所述安瓿提供热量或从所述安瓿去除热量中的至少一个。

公开(公告)号：US20130319013A1

公开(公告)日：2013-12-05

申请号：US13902304

申请日：2013-05-24

Applicant: APPLIED MATERIALS, INC.

Inventor： DAVID K. CARLSON ,  ERROL ANTONIO C. SANCHEZ ,  KENRIC CHOI ,  MARCEL E. JOSEPHSON ,  DENNIS DEMARS

IPC: F25B21/02

CPC classification number: F25B21/02 ,  C23C16/448 ,  C23C16/4482

Abstract: Apparatus for thermal management of a precursor for use in substrate processing are provided herein. In some embodiments, an apparatus for thermal management of a precursor for use in substrate processing may include a body having an opening sized to receive a storage container having a liquid or solid precursor disposed therein, the body fabricated from thermally conductive material; one or more thermoelectric devices coupled to the body proximate the opening; and a heat sink coupled to the one or more thermoelectric devices.

Abstract translation: 本文提供了用于基板处理中使用的前体的热管理装置。 在一些实施例中，用于对基板处理中使用的前体进行热管理的设备可以包括具有开口尺寸的开口的主体，该开口的尺寸适于容纳设置在其中的液体或固体前体的存储容器，所述主体由导热材料制成; 一个或多个耦合到靠近开口的本体的热电装置; 以及耦合到所述一个或多个热电装置的散热器。