公开(公告)号：US09498866B2

公开(公告)日：2016-11-22

申请号：US14198560

申请日：2014-03-05

Applicant: Applied Materials, Inc.

Inventor： Christopher Heung-Gyun Lee ,  Thomas Ho Fai Li ,  Tianyu Yang

IPC: B24B53/017 ,  B24B53/00

CPC classification number: B24B53/017 ,  B24B53/003

Abstract: In one embodiment, a method for cleaning a surface of a polishing pad includes conditioning the polishing pad surface and rotating the conditioned polishing pad surface. The method also includes spraying the polishing pad surface to lift debris from the conditioned polishing pad surface. The method further includes vacuuming the debris from the polishing pad surface downstream from where the condition occurs, wherein downstream is defined by a rotational direction of the polishing pad. In another embodiment, a processing station including a rotatable platen, a substrate carrier head, a polishing fluid delivery system, a conditioner, a spray nozzle, and a vacuum system is provided. The conditioner is disposed between the substrate carrier head and the spray nozzle. The vacuum system is configured to vacuum the polishing pad surface. The vacuum system is downstream from the conditioner, defined by a rotation of the platen.

Abstract translation: 在一个实施例中，用于清洁抛光垫表面的方法包括调整抛光垫表面并旋转经调节的抛光垫表面。 该方法还包括喷涂抛光垫表面以从调理的抛光垫表面提起碎屑。 该方法还包括从发生状况的下游的抛光垫表面抽吸碎屑，其中下游由抛光垫的旋转方向限定。 在另一个实施例中，提供了包括可旋转压板，基板载体头，抛光流体输送系统，调节器，喷嘴和真空系统的处理站。 调理剂设置在基板载体头部和喷嘴之间。 真空系统被配置成对抛光垫表面进行真空。 真空系统在调节器的下游，由压盘的旋转限定。

公开(公告)号：US20240393262A1

公开(公告)日：2024-11-28

申请号：US18201927

申请日：2023-05-25

Applicant: APPLIED MATERIALS, INC.

Inventor： Jeong Jin Hong ,  Sejune Cheon ,  Sang Hong Kim ,  Thomas Ho Fai Li ,  Anders Andelman Nottrott ,  Zhaozhao Zhu ,  MiHyun Jang

IPC: G01N21/95 ,  G06T7/00

Abstract: A method includes receiving spectral data of a substrate and metrology data corresponding to the spectral data of the substrate. The method further includes determining a plurality of feature model configurations for each of a plurality of feature models, each of the plurality of feature model configurations including one or more feature model conditions. The method further includes determining a plurality of feature model combinations, where each feature model combination of the plurality of feature model combinations includes a subset of the plurality of feature model configurations. The method further includes generating a plurality of input datasets, where each input dataset of the plurality of input datasets is generated based on application of the spectral data to a respective feature model combination of the plurality of feature model combinations. The method further includes training a plurality of machine learning models, where each machine learning model is trained to generate an output using an input dataset of the plurality of input datasets and the metrology data. The method further includes selecting a trained machine learning model from the plurality of trained machine learning models satisfying one or more selection criteria.

公开(公告)号：US20240176338A1

公开(公告)日：2024-05-30

申请号：US18542562

申请日：2023-12-15

Applicant: Applied Materials, Inc.

Inventor： Thomas Ho Fai Li ,  Xiaoer Hu ,  Imaan Seraphine Islam Rahim

IPC: G05B19/418

CPC classification number: G05B19/4188 ,  G05B2219/34082 ,  G05B2219/45031 ,  G05B2219/45212

Abstract: A method includes providing, to a trained machine learning model configured to determine a recommended adjustment to an equipment constant of a substrate manufacturing system, first input data indicative of a state of the substrate manufacturing system. The method further includes providing, to the trained machine learning model as second input data, an indication of a performed adjustment to the equipment constant. The method further includes retraining the trained machine learning model based on a difference between the recommended adjustment to the equipment constant and the performed adjustment to the equipment constant to generate a retrained machine learning model.

公开(公告)号：US11890722B2

公开(公告)日：2024-02-06

申请号：US17222001

申请日：2021-04-05

Applicant: Applied Materials, Inc.

Inventor： Thomas Ho Fai Li

IPC: B24B49/12 ,  B24B37/005 ,  H01L21/321

CPC classification number: B24B49/12 ,  B24B37/005 ,  H01L21/3212

Abstract: An apparatus and method for to monitoring slurry buildup is disclosed. A substrate polishing apparatus includes a surface coated at least in part with a fluorescent material, a light source configured to illuminate the surface, an image sensor configured to image the surface, and a processor coupled to the image sensor and configured to monitor slurry buildup on the surface using data supplied from the image sensor.

公开(公告)号：US10350728B2

公开(公告)日：2019-07-16

申请号：US14919406

申请日：2015-10-21

Applicant: Applied Materials, Inc.

Inventor： Jie Diao ,  Erik S. Rondum ,  Thomas Ho Fai Li ,  Bum Jick Kim ,  Christopher Heung-Gyun Lee

IPC: B24B37/04 ,  B24B53/017 ,  H01L21/306 ,  H01L21/3105 ,  B24B57/02

Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.