Abstract:
A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.
Abstract:
The present invention provides: a highly transparent optical member which is formed from a silicone resin or a silicone rubber, and which has less mass change and excellent heat resistance without causing contact faults, or deterioration or contamination of the surface of other members due to adhesion to an electronic circuit or the surfaces of other members; and a production method for producing said optical member. According to the production method, the content of low-molecular-weight siloxanes D3-D20 in a optical member is reduced to an infinitesimal amount with use of a plurality of different low-molecular-weight siloxane removal steps.