公开(公告)号：US20140027807A1

公开(公告)日：2014-01-30

申请号：US14110816

申请日：2012-04-25

Applicant: ASAHI RUBBER INC.

Inventor： Masutsugu Tasaki ,  Akira Ichikawa ,  Hideaki Sato ,  Satoshi Endo ,  Takayuki Motoyanagi ,  Yoshihiro Okabe ,  Yoichi Orikasa ,  Masaru Azuma

IPC: H01L33/52

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L33/58 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A lens-equipped optical semiconductor device including: an optical semiconductor device including at least one optical semiconductor element mounted on a substrate and a transparent resin encapsulating body that encapsulates the optical semiconductor element; a resin lens having a recessed portion for housing the transparent resin encapsulating body; and a transparent resin layer filled into a space among the substrate, the recessed portion, and the transparent resin encapsulating body, wherein the recessed portion has a capacity that is at least 1.1 times a total volume of the optical semiconductor element and the transparent resin encapsulating body.

Abstract translation: 1.一种镜头配备的光半导体装置，具备：包含安装在基板上的至少一个光半导体元件和封装上述光半导体元件的透明树脂封装体的光半导体装置; 树脂透镜，具有用于容纳透明树脂封装体的凹部; 以及填充在基板，凹部和透明树脂封装体之间的空间中的透明树脂层，其中凹部的能力为光半导体元件的总体积的至少1.1倍，并且透明树脂封装 身体。

公开(公告)号：US11326065B2

公开(公告)日：2022-05-10

申请号：US16693471

申请日：2019-11-25

Applicant: ASAHI RUBBER INC.

Inventor： Masutsugu Tasaki ,  Naoto Igarashi ,  Akira Ichikawa ,  Tsutomu Odaki ,  Maimi Yoshida

IPC: C09D7/62 ,  B29C48/00 ,  B29C45/14 ,  C09D183/04 ,  H01L31/0224 ,  H01L31/0352 ,  H01L31/048 ,  H01L33/60 ,  C08L83/04 ,  H01L31/054 ,  H01L31/068 ,  C08G77/04 ,  B29C59/04 ,  C08K3/22 ,  C08K9/02 ,  C08K9/06 ,  C09C1/36 ,  C09C3/12 ,  C09D5/33 ,  H01L31/02 ,  H01L33/56 ,  H01L33/62 ,  B29C48/07 ,  B29C48/08 ,  B29C48/13 ,  B29C48/16 ,  B29C48/154 ,  B29C48/155 ,  B29K705/10 ,  B29L7/00 ,  B29D11/00 ,  B29K83/00 ,  B29K105/20 ,  B29L9/00

Abstract: A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.

公开(公告)号：US10533094B2

公开(公告)日：2020-01-14

申请号：US15399058

申请日：2017-01-05

Applicant: ASAHI RUBBER INC.

Inventor： Masutsugu Tasaki ,  Naoto Igarashi ,  Akira Ichikawa ,  Tsutomu Odaki ,  Maimi Yoshida

IPC: C09D5/33 ,  B29C48/00 ,  B29C45/14 ,  C08G77/04 ,  C09D183/04 ,  H01L31/0224 ,  H01L31/0352 ,  H01L31/048 ,  H01L31/068 ,  H01L33/60 ,  C08L83/04 ,  H01L31/054 ,  C09D7/62 ,  B29C59/04 ,  C08K3/22 ,  C08K9/02 ,  C08K9/06 ,  C09C1/36 ,  C09C3/12 ,  H01L31/02 ,  H01L33/56 ,  H01L33/62 ,  B29C48/07 ,  B29C48/08 ,  B29C48/13 ,  B29C48/16 ,  B29C48/154 ,  B29C48/155 ,  B29K705/10 ,  B29L7/00 ,  B29D11/00 ,  B29K83/00 ,  B29K105/20 ,  B29L9/00

Abstract: A versatile silicone resin reflective substrate which exhibits high reflectance of high luminance light from an LED light source over a wide wavelength from short wavelengths of approximately 340-500 nm, which include wavelengths from 380-400 nm near lower limit of the visible region, to longer wavelength in the infra-red region. The silicone resin reflective substrate has a reflective layer which contains a white inorganic filler powder dispersed in a three-dimensional cross linked silicone resin, the inorganic filler powder having a high reflective index than the silicone resin. The reflective layer is formed on a support body as a film, a solid, or a sheet. The silicone resin reflective substrate can be easily formed as a wiring substrate, a packaging case or the like, and can be manufactured at low cost and a high rate of production.