公开(公告)号：US09892908B2

公开(公告)日：2018-02-13

申请号：US14660755

申请日：2015-03-17

申请人： ASM America, Inc.

发明人： Fred Pettinger ,  Carl White ,  Dave Marquardt ,  Sokol Ibrani ,  Eric Shero ,  Todd Dunn ,  Kyle Fondurulia ,  Mike Halpin

IPC分类号： H01L21/02 ,  C23C16/455 ,  C23C16/44 ,  H01J37/32

CPC分类号： H01L21/02104 ,  C23C16/4409 ,  C23C16/4411 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32522 ,  H01J37/32532

摘要： Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

公开(公告)号：US20150187568A1

公开(公告)日：2015-07-02

申请号：US14660755

申请日：2015-03-17

申请人： ASM America, Inc.

发明人： Fred Pettinger ,  Carl White ,  Dave Marquardt ,  Sokol Ibrani ,  Eric Shero ,  Todd Dunn ,  Kyle Fondurulia ,  Mike Halpin

IPC分类号： H01L21/02

CPC分类号： H01L21/02104 ,  C23C16/4409 ,  C23C16/4411 ,  C23C16/45565 ,  C23C16/4557 ,  C23C16/45572 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32522 ,  H01J37/32532

摘要： Embodiments related to managing the process feed conditions for a semiconductor process module are provided. In one example, a gas channel plate for a semiconductor process module is provided. The example gas channel plate includes a heat exchange surface including a plurality of heat exchange structures separated from one another by intervening gaps. The example gas channel plate also includes a heat exchange fluid director plate support surface for supporting a heat exchange fluid director plate above the plurality of heat exchange structures so that at least a portion of the plurality of heat exchange structures are spaced from the heat exchange fluid director plate.

摘要翻译： 提供了与管理半导体工艺模块的工艺进料条件有关的实施例。 在一个示例中，提供了一种用于半导体处理模块的气体通道板。 示例性气体通道板包括热交换表面，其包括通过中间间隔彼此分离的多个热交换结构。 示例性气体通道板还包括热交换流体引导板支撑表面，用于在多个热交换结构之上支撑热交换流体导向板，使得多个热交换结构的至少一部分与热交换流体间隔开 导演板。