Method for Forming Si-Containing Film Using Two Precursors by ALD
    2.
    发明申请
    Method for Forming Si-Containing Film Using Two Precursors by ALD 有权
    使用ALD的两种前体形成含Si膜的方法

    公开(公告)号:US20130244446A1

    公开(公告)日:2013-09-19

    申请号:US13799708

    申请日:2013-03-13

    Abstract: A method for forming a silicon-containing dielectric film on a substrate by atomic layer deposition (ALD) includes: providing two precursors, one precursor containing a halogen in its molecule, another precursor containing a silicon but no halogen in its molecule, adsorbing a first precursor, which is one of the two precursors onto a substrate to deposit a monolayer of the first precursor; adsorbing a second precursor, which is the other of the two precursors onto the monolayer of the first precursor to deposit a monolayer of the second precursor; and exposing the monolayer of the second precursor to radicals of a reactant to cause surface reaction with the radicals to form a compound monolayer of a silicon-containing film.

    Abstract translation: 通过原子层沉积(ALD)在衬底上形成含硅电介质膜的方法包括:提供两个前体,在其分子中含有卤素的一种前体,在其分子中含有硅但不含卤素的另一种前体,吸附第一 前体,其是沉积单层第一前体的底物上的两种前体之一; 将作为所述两种前体中的另一种的第二前体吸附到所述第一前体的单层上以沉积所述第二前体的单层; 并将第二前体的单层暴露于反应物的自由基以引起与自由基的表面反应以形成含硅膜的化合物单层。

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