DEPOSITION APPARATUS
    3.
    发明申请
    DEPOSITION APPARATUS 审中-公开
    沉积装置

    公开(公告)号:US20140202382A1

    公开(公告)日:2014-07-24

    申请号:US14157626

    申请日:2014-01-17

    CPC classification number: C23C16/4401 C23C16/4586 H01L21/68742

    Abstract: A deposition apparatus is provided to eliminate unnecessary empty spaces that may form between a substrate and a substrate supporting pin, which may be formed within a substrate supporting pin hole, by covering the substrate supporting pin, inserted into the substrate supporting pin hole formed in the substrate support, by a substrate supporting pin cover loaded on the substrate support. Accordingly, the temperature under the substrate can be maintained constant, and generation of parasitic plasma or contaminating particles can be avoided.

    Abstract translation: 提供一种沉积装置,用于通过覆盖插入基板支撑销中形成的基板支撑销孔中的基板和基板支撑销之间形成的不必要的空白空间,该基板可以形成在基板支撑销孔内。 基板支撑,由衬底支撑销盖装载在基板支撑上。 因此,衬底下的温度可以保持恒定,并且可以避免寄生等离子体或污染颗粒的产生。

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