Alignment sensor and lithographic apparatus

    公开(公告)号:US09857703B2

    公开(公告)日:2018-01-02

    申请号:US15328194

    申请日:2015-07-07

    CPC classification number: G03F9/7088 G03F9/7065 G03F9/7069

    Abstract: An alignment sensor for a lithographic apparatus is arranged and constructed to measure an alignment of a movable part of the lithographic apparatus in respect of a stationary part of the lithographic apparatus. The alignment sensor comprises a light source configured to generate a pulse train at a optical wavelength and a pulse repetition frequency, a non-linear optical element, arranged in an optical propagation path of the pulse train, the non-linear optical element configured to transform the pulse train at the optical wavelength into a transformed pulse train in an optical wavelength range, an optical imaging system configured to project the transformed pulse train onto an alignment mark comprising a diffraction grating; a detector to detect a diffraction pattern as diffracted by the diffraction grating, and a data processing device configured to derive alignment data from the detected diffraction pattern as detected by the detector.

    Self-referencing integrated alignment sensor

    公开(公告)号:US12216414B2

    公开(公告)日:2025-02-04

    申请号:US18012799

    申请日:2021-06-09

    Abstract: Systems, apparatuses, and methods are provided for determining the alignment of a substrate. An example method can include emitting a multi-wavelength radiation beam including a first wavelength and a second wavelength toward a region of a surface of a substrate. The example method can further include measuring a first diffracted radiation beam indicative of first order diffraction at the first wavelength in response to an irradiation of the region by the multi-wavelength radiation beam. The example method can further include measuring a second diffracted radiation beam indicative of first order diffraction at the second wavelength in response to the irradiation of the region by the multi-wavelength radiation beam. Subsequently, the example method can include generating, based on the measured first set of photons and the measured second set of photons, an electronic signal for use in determining an alignment position of the substrate.

    Metrology tool and method of using the same

    公开(公告)号:US10908516B2

    公开(公告)日:2021-02-02

    申请号:US16466315

    申请日:2017-12-13

    Abstract: A method including: subsequent to a first device lithographic step of a device patterning process, measuring a degraded metrology mark on an object and/or a device pattern feature associated with the degraded metrology mark, the degraded metrology mark arising at least in part from the first device lithographic step on the object; and prior to a second device lithographic step of the device patterning process on the object, creating a replacement metrology mark, for use in the patterning process in place of the degraded metrology mark, on the object.

    Monolithic particle inspection device

    公开(公告)号:US12298257B2

    公开(公告)日:2025-05-13

    申请号:US18012801

    申请日:2021-06-09

    Abstract: Systems, apparatuses, and methods are provided for detecting a particle on a substrate surface. An example method can include receiving, by a grating structure, coherent radiation from a radiation source. The method can further include generating, by the grating structure, a focused coherent radiation beam based on the coherent radiation. The method can further include transmitting, by the grating structure, the focused coherent radiation beam toward a region of a surface of a substrate. The method can further include receiving, by the grating structure, photons scattered from the region in response to illuminating the region with the focused coherent radiation beam. The method can further include measuring, by a photodetector, the photons received by the grating structure. The method can further include generating, by the photodetector and based on the measured photons, an electronic signal for detecting a particle located in the region of the surface of the substrate.

    Spectrometric metrology systems based on multimode interference and lithographic apparatus

    公开(公告)号:US12135505B2

    公开(公告)日:2024-11-05

    申请号:US18016225

    申请日:2021-06-29

    Abstract: A metrology system comprises a radiation source, an optical element, first and second detectors, an integrated optical device comprising a multimode waveguide, and a processor. The radiation source generates radiation. The optical element directs radiation toward a target to generate scattered radiation from the target. The first detector receives a first portion of the scattered radiation and generates a first detection signal based on the received first portion. The multimode waveguide interferes a second portion of the scattered radiation using modes of the multimode waveguide. The second detector receives the interfered second portion and generates a second detection signal based on the received interfered second portion. The processor receives the first and second detection signals. The processor analyzes the received first portion, the received interfered second portion, and a propagation property of the multimode waveguide. The processor determines the property of the target based on the analysis.

    Optical system of an alignment system

    公开(公告)号:US10732524B2

    公开(公告)日:2020-08-04

    申请号:US15746164

    申请日:2016-07-19

    Abstract: An optical system for improving alignment measurement accuracy is discussed. The optical system includes first and second optical elements. The first optical element may be configured to change a first beam having a first polarization state into a second beam having a second polarization state. The second optical element may be configured to provide total internal reflection of the second beam and to change the second beam into a third beam having a third polarization state. The first, second, and third polarization states may be different from each other.

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