Position Metrology Apparatus and Associated Optical Elements

    公开(公告)号:US20200209608A1

    公开(公告)日:2020-07-02

    申请号:US16731249

    申请日:2019-12-31

    Abstract: Disclosed is a metrology apparatus comprising an optical element configured to receive at or near a pupil plane of the metrology apparatus, at least first radiation comprising a first higher diffracted order and second radiation comprising a zeroth order resulting from illumination of a metrology target with radiation; and to direct said first radiation and second radiation together in a first direction. The metrology apparatus is further configured to form at least a first image of a first interference pattern, the first interference pattern resulting from interference of said first radiation and second radiation at an image plane.

    Inspection Apparatus and Methods, Methods of Manufacturing Devices
    3.
    发明申请
    Inspection Apparatus and Methods, Methods of Manufacturing Devices 有权
    检验装置和方法,制造装置的方法

    公开(公告)号:US20160011523A1

    公开(公告)日:2016-01-14

    申请号:US14794013

    申请日:2015-07-08

    Abstract: Inspection apparatus (100) is used for measuring parameters of targets on a substrate. Coherent radiation follows an illumination path (solid rays) for illuminating target (T). A collection path (dashed rays) collects diffracted radiation from the target and delivers it to a lock-in image detector (112). A reference beam following a reference path (dotted rays). An acousto-optical modulator (108) shifts the optical frequency of the reference beam so that the intensity of radiation at the lock-in detector includes a time-varying component having a characteristic frequency corresponding to a difference between the frequencies of the diffracted radiation and the reference radiation. The lock-in image detector records two-dimensional image information representing both amplitude and phase of the time-varying component. A second reference beam with a different shift (110) follows a second reference path (dot-dash rays). Interference between the two reference beams can be used for intensity normalization.

    Abstract translation: 检查装置(100)用于测量基板上的目标的参数。 相干辐射遵循用于照射目标(T)的照明路径(固体光线)。 收集路径(虚线)从目标物体收集衍射辐射并将其传送到锁定图像检测器(112)。 参考光束遵循参考路径(虚线)。 声光调制器(108)移动参考光束的光频率,使得锁定检测器处的​​辐射强度包括具有与衍射辐射的频率之间的差异相对应的特征频率的时变分量,以及 参考辐射。 锁定图像检测器记录表示时变分量的幅度和相位的二维图像信息。 具有不同偏移(110)的第二参考光束遵循第二参考路径(点划线)。 两个参考光束之间的干涉可用于强度归一化。

    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

    公开(公告)号:US12235096B2

    公开(公告)日:2025-02-25

    申请号:US18486811

    申请日:2023-10-13

    Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

    公开(公告)号:US11828585B2

    公开(公告)日:2023-11-28

    申请号:US17692974

    申请日:2022-03-11

    CPC classification number: G01B11/24 G03F7/7085 G03F7/70191 G03F7/70633

    Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

    Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method

    公开(公告)号:US11307024B2

    公开(公告)日:2022-04-19

    申请号:US16817552

    申请日:2020-03-12

    Abstract: A scatterometer for measuring a property of a target on a substrate includes a radiation source, a detector, and a processor. The radiation source produces a radiated spot on the target. The scatterometer adjusts a position of the radiated spot along a first direction across the target and along a second direction that is at an angle with respect to the first direction. The detector receives radiation scattered by the target. The received radiation is associated with positions of the radiated spot on the target along at least the first direction. The detector generates measurement signals based on the positions of the radiated spot on the target. The processor outputs, based on the measurement signals, a single value that is representative of the property of the target. The processor also combines the measurement signals to output a combined signal and derives, based on the combined signal, the single value.

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