公开(公告)号：US20130128247A1

公开(公告)日：2013-05-23

申请号：US13679898

申请日：2012-11-16

Applicant: ASML Netherlands B.V.

Inventor： Laurent KHUAT DUY ,  Martinus Cornelis REIJNEN ,  Lukasz Jerzy MACHT ,  Erik Johan KOOP

IPC: G01B11/00 ,  G03B27/34

CPC classification number: G01B11/00 ,  G01B11/0608 ,  G03B27/34 ,  G03F9/7034

Abstract: The invention provides a level sensor configured to determine a height level of a surface of a substrate, comprising a detection unit arranged to receive a measurement beam after reflection on the substrate, wherein the detection unit comprises an array of detection elements, wherein each detection element is arranged to receive a part of the measurement beam reflected on a measurement subarea of the measurement area, and is configured to provide a measurement signal based on the part of the measurement beam received by the respective detection element, and wherein the processing unit is configured to calculate, in dependence of a selected resolution at the measurement subarea, a height level of the measurement subarea, or to calculate a height level of a combination of multiple measurement subareas.

Abstract translation: 本发明提供了一种水平传感器，其被配置为确定衬底的表面的高度水平，包括检测单元，其布置成在衬底上反射之后接收测量光束，其中检测单元包括检测元件阵列，其中每个检测元件 被配置为接收在测量区域的测量子区域上反射的测量光束的一部分，并且被配置为基于由各个检测元件接收的测量光束的一部分来提供测量信号，并且其中，配置处理单元 根据测量子区域中的选定分辨率计算测量子区域的高度水平，或计算多个测量子区域的组合的高度水平。

公开(公告)号：US20170248852A1

公开(公告)日：2017-08-31

申请号：US15438364

申请日：2017-02-21

Applicant: ASML Netherlands B.V.

Inventor： Patrick WARNAAR ,  Simon Philip Spencer HASTINGS ,  Alberto DA COSTA ASSAFRAO ,  Lukasz Jerzy MACHT

IPC: G03F7/20

Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1−, p1, p1+; λ1−, λ1, λ1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.

公开(公告)号：US20200064744A1

公开(公告)日：2020-02-27

申请号：US16669317

申请日：2019-10-30

Applicant: ASML Netherlands B.V.

Inventor： Patrick WARNAAR ,  Simon Philip Spencer Hastings ,  Alberto Da Costa Assafrao ,  Lukasz Jerzy MACHT

IPC: G03F7/20

Abstract: An inspection apparatus (140) measures asymmetry or other property of target structures (T) formed by a lithographic process on a substrate. For a given set of illumination conditions, accuracy of said measurement is influenced strongly by process variations across the substrate and/or between substrates. The apparatus is arranged to collect radiation scattered by a plurality of structures under two or more variants of said illumination conditions (p1−, p1, p1+; λ1−, λ1, λ1+). A processing system (PU) is arranged to derive the measurement of said property using radiation collected under a different selection or combination of said variants for different ones of said structures. The variants may be for example in wavelength, or in angular distribution, or in any characteristic of the illumination conditions. Selection and/or combination of variants is made with reference to a signal quality (302, Q, A) observed in the different variants.

公开(公告)号：US20160109812A1

公开(公告)日：2016-04-21

申请号：US14965467

申请日：2015-12-10

Applicant: ASML NETHERLANDS B.V.

Inventor： Engelbertus Antonius Fransiscus VAN DER PASCH ,  Joost Jeroen OTTENS ,  Emiel Jozef Melanie EUSSEN ,  Johannes Henricus Wilhelmus JACOBS ,  William Peter VAN DRENT ,  Frank STAALS ,  Lukasz Jerzy MACHT ,  Erik Willem BOGAART

IPC: G03F7/20

CPC classification number: G03F7/70716 ,  G03F7/70725 ,  G03F7/70775 ,  G03F7/70833 ,  G03F7/709

Abstract: A lithographic apparatus including a substrate table position measurement system and a projection system position measurement system to measure a position of the substrate table and the projection system, respectively. The substrate table position measurement system includes a substrate table reference element mounted on the substrate table and a first sensor head. The substrate table reference element extends in a measurement plane substantially parallel to the holding plane of a substrate on substrate table. The holding plane is arranged at one side of the measurement plane and the first sensor head is arranged at an opposite side of the measurement plane. The projection system position measurement system includes one or more projection system reference elements and a sensor assembly. The sensor head and the sensor assembly or the associated projection system measurement elements are mounted on a sensor frame.

Abstract translation: 一种光刻设备，包括基板台位置测量系统和用于分别测量基板台和投影系统的位置的投影系统位置测量系统。 衬底台位置测量系统包括安装在衬底台上的衬底台参考元件和第一传感器头。 衬底台参考元件在基本上平行于衬底台上的衬底的保持平面的测量平面中延伸。 保持平面布置在测量平面的一侧，第一传感器头布置在测量平面的相对侧。 投影系统位置测量系统包括一个或多个投影系统参考元件和传感器组件。 传感器头和传感器组件或相关联的投影系统测量元件安装在传感器框架上。