公开(公告)号：US20220390832A1

公开(公告)日：2022-12-08

申请号：US17776728

申请日：2020-11-18

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Janardan NATH ,  Christopher John MASON ,  Duan-Fu Stephen HSU ,  Todd R. DOWNEY ,  Tian GANG

IPC: G03F1/70 ,  G03F1/36 ,  G03F7/20

Abstract: A method for source mask optimization or mask only optimization used to image a pattern onto a substrate. The method includes determining a non-uniform illumination intensity profile for illumination; and determining one or more adjustments for the pattern based on the non-uniform illumination intensity profile until a determination that features patterned onto a substrate substantially match a target design. The non-uniform illumination intensity profile may be determined based on an illumination optical system and projection optics of a lithographic apparatus. In some embodiments, the lithographic apparatus includes a slit, and the non-uniform illumination profile is a through slit non-uniform illumination intensity profile. Determining the one or more adjustments for the pattern may include performing optical proximity correction, for example.

公开(公告)号：US20230035511A1

公开(公告)日：2023-02-02

申请号：US17791641

申请日：2021-01-04

Applicant: ASML NETHERLANDS B.V. ,  ASML HOLDING N.V.

Inventor： Ronny DER KINDEREN ,  Tian GANG ,  Todd R. DOWNEY

IPC: G03F7/20

Abstract: A system, method, a lithographic apparatus and a software product configured to determine a drift in an attribute of an illumination and a corresponding drift correction. The system includes a lithographic apparatus that includes at least two sensors, each configured to measure a property related to an illumination region provided for imaging a substrate. Furthermore, a processor is configured to: determine, based on a ratio of the measured property, a drift of the illumination region with respect to a reference position; determine, based on the drift of the illumination region, a drift in an attribute related to the illumination upstream of the illumination region measured by the at least two sensors, and determine, based on the drift in the attribute, the drift correction to be applied to the attribute to compensate for the drift in the attribute.

公开(公告)号：US20220214622A1

公开(公告)日：2022-07-07

申请号：US17605601

申请日：2020-04-14

Applicant: ASML HOLDING N.V. ,  ASML NETHERLANDS B.V.

Inventor： Janardan NATH ,  Kalyan Kumar MANKALA ,  Todd R. DOWNEY ,  Joseph Harry LYONS ,  Ozer UNLUHISARCIKLI ,  Alexander Harris LEDBETTER ,  Nicholas Stephen APONE ,  Tian GANG

IPC: G03F7/20

Abstract: An illumination adjustment apparatus, to adjust a cross slot illumination of a beam in a lithographic apparatus, includes a plurality of fingers to adjust the cross slot illumination to conform to a selected intensity profile. Each finger has a distal edge that includes at least two segments. The two segments form an indentation of the distal edge.

公开(公告)号：US20240353756A1

公开(公告)日：2024-10-24

申请号：US18682789

申请日：2022-07-27

Applicant: ASML Netherlands B.V.

Inventor： Todd R. DOWNEY ,  Marianna MANCA ,  Widianta GOMULYA ,  Kalyan Kumar MANKALA ,  Janardan NATH

IPC: G03F7/20

CPC classification number: G03F7/2004

Abstract: Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include determining whether an exposure field for a wafer exposure operation is less than a maximum exposure field of a uniformity correction system. In response to determining that the exposure field is less than the maximum exposure field, the example method can include modifying illumination slit uniformity calibration data associated with the maximum exposure field to generate modified illumination slit uniformity calibration data associated with the exposure field. Subsequently, the example method can include determining an optimal position of a finger assembly of the uniformity correction system based on the modified illumination slit uniformity calibration data.

公开(公告)号：US20240319608A1

公开(公告)日：2024-09-26

申请号：US18262467

申请日：2022-01-16

Applicant: ASML Holding N.V.

Inventor： Roberto B. WIENER ,  Kalyan Kumar MANKALA ,  Todd R. DOWNEY

IPC: G03F7/00

CPC classification number: G03F7/70141 ,  G03F7/70075 ,  G03F7/70133 ,  G03F7/7015 ,  G03F7/70191 ,  G03F7/7085

Abstract: Systems, apparatuses, and methods are provided for adjusting illumination slit uniformity in a lithographic apparatus. An example method can include irradiating, by a radiation source, a portion of a finger assembly with radiation. The example method can further include receiving, by a radiation detector, at least a portion of the radiation in response to the irradiating of the portion of the finger assembly. The example method can further include determining, by a processor, a change in a shape of the finger assembly based on the received radiation. The example method can further include generating, by the processor, a control signal configured to modify a position of the finger assembly based on the determined change in the shape of the finger assembly. Subsequently, the example method can include transmitting, by the processor, the control signal to a motion control system coupled to the finger assembly.