公开(公告)号：US20180098415A1

公开(公告)日：2018-04-05

申请号：US15703041

申请日：2017-09-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Chung-Han Tsai ,  Shih-Keng Chuang

IPC: H05K1/02 ,  H01R12/57 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H05K3/40 ,  H05K3/10

CPC classification number: H05K1/0213 ,  H01R12/57 ,  H01R12/724 ,  H05K1/115 ,  H05K1/181 ,  H05K3/10 ,  H05K3/306 ,  H05K3/40 ,  H05K2201/10022

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.

公开(公告)号：US10057975B2

公开(公告)日：2018-08-21

申请号：US15703041

申请日：2017-09-13

Applicant: ASUSTeK COMPUTER INC.

Inventor： Hank Lin ,  Bin-Chyi Tseng ,  Chung-Han Tsai ,  Shih-Keng Chuang

IPC: H05K1/00 ,  H05K1/02 ,  H01R12/57 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K3/40

CPC classification number: H05K1/0213 ,  H01R12/57 ,  H01R12/724 ,  H05K1/025 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/181 ,  H05K3/10 ,  H05K3/306 ,  H05K3/40 ,  H05K2201/10022

Abstract: An electronic assembly and a method for manufacturing the electronic assembly are provided. The method includes: configuring a chip and a connector at a first wiring layer of a PCB, and determining a first trace between a first pin of the chip and a first pin of the connector, and a second trace between a second pin of the chip and a second pin of the connector according to a first internal resistance of the chip, a second internal resistance of the chip, a first internal resistance of the connector, and a second internal resistance of the connector.