公开(公告)号：US12108580B2

公开(公告)日：2024-10-01

申请号：US17435489

申请日：2020-02-27

Applicant: AUDI AG ,  Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/473

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

公开(公告)号：US12160982B2

公开(公告)日：2024-12-03

申请号：US17435489

申请日：2020-02-27

Applicant: AUDI AG ,  Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

公开(公告)号：US12199013B2

公开(公告)日：2025-01-14

申请号：US17629904

申请日：2020-07-24

Applicant: Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Milad Maleki ,  Daniele Torresin

IPC: H01L23/473

Abstract: An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

公开(公告)号：US12068174B2

公开(公告)日：2024-08-20

申请号：US17630080

申请日：2020-07-24

Applicant: Hitachi Energy Ltd

Inventor： Daniele Torresin ,  Fabian Mohn ,  Bruno Agostini ,  Thomas Gradinger ,  Juergen Schuderer

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L21/4882 ,  H01L21/4842 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927

Abstract: In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

公开(公告)号：US12016162B2

公开(公告)日：2024-06-18

申请号：US17434546

申请日：2020-02-25

Applicant: AUDI AG ,  Hitachi Energy Switzerland AG

Inventor： Thomas Gradinger ,  Jürgen Schuderer ,  Felix Traub ,  Chunlei Lui ,  Fabian Mohn ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/473

Abstract: An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

公开(公告)号：US11848252B2

公开(公告)日：2023-12-19

申请号：US16846844

申请日：2020-04-13

Applicant: AUDI AG ,  Hitachi Energy Switzerland AG

Inventor： Thomas Gradinger ,  Daniele Torresin

IPC: H01L23/473 ,  H01L21/48 ,  H01L25/07

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L25/072

Abstract: A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.