公开(公告)号：US12108580B2

公开(公告)日：2024-10-01

申请号：US17435489

申请日：2020-02-27

Applicant: AUDI AG ,  Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/473

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

公开(公告)号：US12160982B2

公开(公告)日：2024-12-03

申请号：US17435489

申请日：2020-02-27

Applicant: AUDI AG ,  Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Andreas Apelsmeier ,  Benjamin Söhnle ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

公开(公告)号：US12199013B2

公开(公告)日：2025-01-14

申请号：US17629904

申请日：2020-07-24

Applicant: Hitachi Energy Ltd

Inventor： Thomas Gradinger ,  Milad Maleki ,  Daniele Torresin

IPC: H01L23/473

Abstract: An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

公开(公告)号：US12125632B2

公开(公告)日：2024-10-22

申请号：US17279611

申请日：2019-09-24

Applicant: HITACHI ENERGY LTD

Inventor： Uwe Drofenik ,  Thomas Gradinger

IPC: H01F27/32 ,  H01F27/24 ,  H01F41/00 ,  H01F41/06 ,  H01F41/066 ,  H01F41/12

CPC classification number: H01F27/327 ,  H01F27/24 ,  H01F27/324 ,  H01F41/005 ,  H01F41/066 ,  H01F41/127

Abstract: A transformer is described. The transformer includes a transformer core having a core leg having a longitudinal axis, a low voltage winding arranged around the core leg, the low voltage winding extending along a first length in the direction of the longitudinal axis, a high voltage winding arranged around the low voltage winding, the high voltage winding extending along a second length in the direction of the longitudinal axis, wherein the second length is shorter than the first length, and a casting embedding the low voltage winding and the high voltage winding. The casting has a recess. The recess is provided at a radial location of the high voltage winding and the recess extends in the direction of the longitudinal axis.

公开(公告)号：US12068174B2

公开(公告)日：2024-08-20

申请号：US17630080

申请日：2020-07-24

Applicant: Hitachi Energy Ltd

Inventor： Daniele Torresin ,  Fabian Mohn ,  Bruno Agostini ,  Thomas Gradinger ,  Juergen Schuderer

IPC: H01L21/48 ,  H01L23/367 ,  H01L23/473 ,  H05K7/20

CPC classification number: H01L21/4882 ,  H01L21/4842 ,  H01L23/3672 ,  H01L23/3677 ,  H01L23/473 ,  H01L2924/0002 ,  H05K7/20927

Abstract: In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

公开(公告)号：US12051537B2

公开(公告)日：2024-07-30

申请号：US17278914

申请日：2019-09-18

Applicant: Hitachi Energy Ltd

Inventor： Uwe Drofenik ,  Thomas Gradinger ,  Bernhard Wunsch

IPC: H01F27/06 ,  H01F27/32

CPC classification number: H01F27/327 ,  H01F27/06 ,  H01F2027/328

Abstract: A transformer includes a transformer core having a first core leg having a first longitudinal axis and second core leg having a second longitudinal axis; a first low voltage (LV) winding arranged around the first core leg, a first high voltage (HV) winding arranged around the first LV winding; a second low voltage (LV) winding arranged around the second core leg; and a second high voltage winding arranged around the second LV winding, wherein the first HV winding is provided with a first HV connector and a second HV connector each extending substantially perpendicular away from the first longitudinal axis, and wherein the second HV winding is provided with a third HV connector and a fourth HV connector each extending substantially perpendicular away from the second longitudinal axis.

公开(公告)号：US11984812B2

公开(公告)日：2024-05-14

申请号：US17631457

申请日：2020-09-18

Applicant: Hitachi Energy Ltd

Inventor： Uwe Drofenik ,  Thomas Gradinger ,  Francisco Canales

IPC: H02M3/335 ,  H02M3/00 ,  H02M3/337 ,  H02M1/00

CPC classification number: H02M3/33584 ,  H02M3/01 ,  H02M3/33571 ,  H02M3/33573 ,  H02M3/337 ,  H02M1/0085

Abstract: A dual active bridge DC/DC converter in accordance with the invention comprises a first DC link, preferably comprising a first DC link capacitor; a converter bridge connected to the first DC link; a transformer, preferably a medium frequency transformer, having a primary side and a secondary side; the primary side of the transformer comprising a plurality of M>1 primary windings, each of the plurality of primary windings having a first and a second terminal; wherein the dual active bridge DC/DC converter further comprises a first plurality of M energy transfer inductors; and wherein for each of the M primary windings, a different one from the first plurality of energy transfer inductors is connected between said primary winding bridge and the converter bridge.

公开(公告)号：US12016162B2

公开(公告)日：2024-06-18

申请号：US17434546

申请日：2020-02-25

Applicant: AUDI AG ,  Hitachi Energy Switzerland AG

Inventor： Thomas Gradinger ,  Jürgen Schuderer ,  Felix Traub ,  Chunlei Lui ,  Fabian Mohn ,  Daniele Torresin

IPC: H05K7/20 ,  H01L23/473

CPC classification number: H05K7/20927 ,  H01L23/473

Abstract: An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

公开(公告)号：US11848252B2

公开(公告)日：2023-12-19

申请号：US16846844

申请日：2020-04-13

Applicant: AUDI AG ,  Hitachi Energy Switzerland AG

Inventor： Thomas Gradinger ,  Daniele Torresin

IPC: H01L23/473 ,  H01L21/48 ,  H01L25/07

CPC classification number: H01L23/473 ,  H01L21/4882 ,  H01L25/072

Abstract: A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.