公开(公告)号：US09781839B1

公开(公告)日：2017-10-03

申请号：US14883302

申请日：2015-10-14

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： David Neuman ,  Robert Neuman ,  Pat Connolly ,  Brian Backes

IPC分类号： H05K3/10 ,  H05K3/32

CPC分类号： H05K3/321 ,  H05K3/10 ,  H05K3/103 ,  H05K2201/10287

摘要： A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.