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公开(公告)号：US08261730B2
公开(公告)日：2012-09-11
申请号：US12360858
申请日：2009-01-28
IPC分类号： B28D1/06
CPC分类号： B28D5/0082 , B08B3/02 , B08B2203/0229 , B28D5/007 , B28D5/0076 , B28D5/045 , Y02P70/179
摘要： An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.
摘要翻译： 公开了一种集成晶片处理系统及其方法。 在一个实施例中，切片晶片的晶片堆叠包括基部和从基部向外延伸的多个切片晶片，其中通过切割工件的一部分而获得多个切片晶片，其中基部为未切割部分 其是工件的剩余部分或通过焊接附接到多个切片晶片的板，并且其中工件是单晶或多晶硅。 此外，切片晶片的晶片堆叠在清洁和湿化学罐中原位处理，用于诸如损伤蚀刻，纹理化和氧化物蚀刻的工艺，并且还在高温炉中原位处理用于诸如扩散和抗反射涂层 。
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公开(公告)号：US20100126488A1
公开(公告)日：2010-05-27
申请号：US12343499
申请日：2008-12-24
CPC分类号： B28D5/045 , B24B27/0633 , B28D5/007 , B28D5/0082 , Y02P70/179
摘要： A method and apparatus of cutting wafers by wire sawing is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a top outlet located in top position with respect to a work piece for applying fluid during sawing, and a chute located substantially below the work piece for receiving the fluid, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluid moves in a vertical direction against and into the work piece. The wire sawing apparatus further includes a frame for holding the horizontal ingot feeding wire slicing apparatus, and a control panel for operating the wire sawing apparatus.
摘要翻译： 公开了一种通过锯切切割晶片的方法和装置。 在一个实施例中，线锯切割装置包括一个水平锭锭送丝切割装置，它包括垂直丝网，其中垂直丝网的锯线基本上位于垂直平面中并沿大致垂直的方向移动，顶部出口 位于相对于用于在锯切期间施加流体的工件的顶部位置，以及基本上位于工件下方的用于接收流体的滑槽，其中工件通过水平移动而推动抵靠竖直网状物，并且流体在 垂直方向抵靠工件。 线切割装置还包括用于保持水平锭子送料线切片装置的框架和用于操作丝锯切割装置的控制面板。
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公开(公告)号：US20100126489A1
公开(公告)日：2010-05-27
申请号：US12360858
申请日：2009-01-28
CPC分类号： B28D5/0082 , B08B3/02 , B08B2203/0229 , B28D5/007 , B28D5/0076 , B28D5/045 , Y02P70/179
摘要： An integrated wafer processing system and a method thereof is disclosed. In one embodiment, a wafer stack of sliced wafers includes a base, and a plurality of sliced wafers extending outwardly from the base, where the plurality of sliced wafers are obtained by slicing a portion of a work piece, where the base is an uncut portion which is the remaining portion of the work piece or a plate attached by welding to the plurality of sliced wafers and where the work piece is mono-crystalline or multi-crystalline silicon. Further, the wafer stack of sliced wafers are treated in-situ in cleaning and wet chemical tanks for processes such as damage etching, texturization and oxide etching and also treated in-situ in high temperature furnaces for processes such as diffusion and anti-reflection coating.
摘要翻译： 公开了一种集成晶片处理系统及其方法。 在一个实施例中，切片晶片的晶片堆叠包括基部和从基部向外延伸的多个切片晶片，其中通过切割工件的一部分而获得多个切片晶片，其中基部为未切割部分 其是工件的剩余部分或通过焊接附接到多个切片晶片的板，并且其中工件是单晶或多晶硅。 此外，切片晶片的晶片堆叠在清洁和湿化学罐中原位处理，用于诸如损伤蚀刻，纹理化和氧化物蚀刻的工艺，并且还在高温炉中原位处理用于诸如扩散和抗反射涂层 。
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公开(公告)号：US08065995B2
公开(公告)日：2011-11-29
申请号：US12352612
申请日：2009-01-13
IPC分类号： B28D1/08
CPC分类号： B28D5/0076 , B28D5/0082 , B28D5/045 , Y10T83/9292
摘要： A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.
摘要翻译： 公开了一种在线锯中切割和清洁晶片的方法和设备。 在一个实施例中，线锯切割装置包括一个水平锭锭送丝切割装置，它包括垂直丝网，其中垂直丝网的锯线基本上位于垂直平面中并沿基本垂直的方向移动，第一顶部 出口和位于相对于用于在锯切期间施加流体的工件的顶部位置的第二顶部出口，以及至少一个位于工件下方用于接收流体的滑槽，其中工件被推靠在垂直线网 通过水平运动，流体沿垂直方向流动并进入工件，用于切片和清洁晶片。
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公开(公告)号：US20100126490A1
公开(公告)日：2010-05-27
申请号：US12352612
申请日：2009-01-13
IPC分类号： B28D1/08
CPC分类号： B28D5/0076 , B28D5/0082 , B28D5/045 , Y10T83/9292
摘要： A method and apparatus of cutting and cleaning wafers in a wire saw is disclosed. In one embodiment, a wire sawing apparatus includes a horizontal ingot feeding wire slicing apparatus which includes a vertical wire web, in which sawing wires of the vertical wire web are located substantially in a vertical plane and move in a substantially vertical direction, a first top outlet and a second top outlet located in a top position with respect to a work piece for applying fluids during sawing, and at least one chute located substantially below the work piece for receiving the fluids, wherein the work piece is impelled against the vertical wire web by horizontal movement and the fluids flow in a vertical direction against and into the work piece for slicing and cleaning wafers.
摘要翻译： 公开了一种在线锯中切割和清洁晶片的方法和设备。 在一个实施例中，线锯切割装置包括一个水平锭锭送丝切割装置，它包括垂直丝网，其中垂直丝网的锯线基本上位于垂直平面中并沿基本垂直的方向移动，第一顶部 出口和位于相对于用于在锯切期间施加流体的工件的顶部位置的第二顶部出口，以及至少一个位于工件下方用于接收流体的滑槽，其中工件被推靠在垂直线网 通过水平运动，流体沿垂直方向流动并进入工件，用于切片和清洁晶片。
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6.发明申请CLOUD-BASED ENERGY CONSUMPTION AND COLOR-CODED PERFORMANCE DATABASE SOLUTION FOR BUILDINGS 审中-公开基于云的能源消耗和色彩编码的性能数据库解决方案公开(公告)号：US20150206078A1
公开(公告)日：2015-07-23
申请号：US14600776
申请日：2015-01-20
CPC分类号： G06Q10/0631 , G06Q50/16
摘要： A database for the aggregation of data to support the management and upholding of various properties includes a number of interrelated databases, third party information, and an interpretive system that enables quick understanding of the efficiency of a property to be ascertained. The software for such analysis is preferably cloud based and accessible from any location. The software makes a number of analytical calculations and assigns visual codes or cues to each property based on these performance variables. In some embodiments, the system may suggest certain actions to be taken in response to certain perceived situations.
摘要翻译： 用于汇总数据以支持管理和维护各种属性的数据库包括一些相互关联的数据库，第三方信息和解释系统，可以快速了解要确定的属性的效率。 用于这种分析的软件优选是基于云的并且可以从任何位置访问。 该软件进行一些分析计算，并根据这些性能变量为每个属性分配视觉代码或提示。 在一些实施例中，系统可以建议响应于某些感知情况采取某些动作。
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7.发明申请CLOUD BASED ENERGY PORTFOLIO BUILDER TO BUILD AND MANAGE ENERGY AND UTILITIES FOR GEOGRAPHICALLY DISTRIBUTED BUILDINGS 审中-公开基于云的能源组合建筑物对地理分布式建筑物的建筑和管理能源和实用公开(公告)号：US20150206076A1
公开(公告)日：2015-07-23
申请号：US14600802
申请日：2015-01-20
CPC分类号： G06Q10/063 , G06Q50/16 , Y02P90/82
摘要： A system for data collection and aggregation may be used by property managers, property owners, and the like to maximize monetary savings as it relates to utility consumption. Generally, a software system and/or platform is provided which a user can employ to enter various parameters. The software can further be given permission to access user accounts connected to the utility service providers. Once a user portfolio has been established, the system automatically updates and analyzes the sourced data. The user can then manage their properties remotely and understand where and how monetary savings can be realized.
摘要翻译： 财产管理者，财产所有者等可以使用数据收集和汇总的系统来最大限度地节省资金，因为它与公用事业消费有关。 通常，提供了用户可以使用的软件系统和/或平台来输入各种参数。 该软件还可以被授予访问连接到公用事业服务提供商的用户帐户的权限。 一旦建立了用户组合，系统将自动更新和分析源数据。 然后，用户可以远程管理其属性，并了解可以实现货币节省的方式和方式。
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