公开(公告)号：US5781073A

公开(公告)日：1998-07-14

申请号：US685684

申请日：1996-07-24

Applicant: Adam Mii

Inventor： Adam Mii

IPC: H03L1/02 ,  H03L1/00

CPC classification number: H03L1/026

Abstract: A temperature compensation apparatus for an oscillator includes an oscillator having an output for generating a clock signal with a frequency identical to the oscillating frequency of the oscillator, a memory for storing a frequency compensation lookup table based on the relationship between output frequencies of the oscillator and the environmental temperature variations, a temperature detector for detecting the environmental temperature variations, a central processing unit for selecting a rating output frequency of the oscillator, acquiring a frequency compensation value from the frequency compensation lookup table stored in the memory in response to a detected environmental temperature, and converting the frequency compensation value into a corresponding compensation signal, and a compensation circuit receiving an output signal of the oscillator and a compensation signal from the CPU for compensating a deviation between the output frequency of the oscillator and the rating frequency and outputting a frequency signal close to the rating frequency of the oscillator.

Abstract translation: 用于振荡器的温度补偿装置包括：振荡器，具有用于产生频率与振荡器的振荡频率相同的时钟信号的输出;存储器，用于存储基于振荡器的输出频率与振荡器的输出频率之间的关系的频率补偿查找表;以及 环境温度变化，用于检测环境温度变化的温度检测器，用于选择振荡器的额定输出频率的中央处理单元，响应于检测到的环境，从存储在存储器中的频率补偿查找表获取频率补偿值 并将频率补偿值转换成相应的补偿信号，以及接收振荡器的输出信号的补偿电路和来自CPU的补偿信号，以补偿振荡器的输出频率与额定频率之间的偏差 并输出接近振荡器额定频率的频率信号。

公开(公告)号：US5545948A

公开(公告)日：1996-08-13

申请号：US303180

申请日：1994-09-08

Applicant: Adam Mii

Inventor： Adam Mii

IPC: H01J61/30 ,  H01J61/70

CPC classification number: H01J61/70 ,  H01J61/30

Abstract: A glass tube lamp matrix device includes a working gas container set and a glass tube matrix. The working gas container set includes a plurality of parallel first elongated containers in a plane and a plurality of parallel second elongated containers crossing the first elongated containers in a plane and forming an angle therewith. Each of the first and second elongated containers contains a working gas therein. The glass tube matrix includes a plurality of thin glass tubes, each of which having two open ends which are fluidly and respectively communicated with one of the first elongated containers and one of the second elongated containers, thereby filling the glass tubes with the working gas. Each of the glass tubes has a cross-sectional area much smaller than that of the first and second elongated containers. The working gas in a particular glass tube discharges so as to emit light when a sufficient voltage drop is applied to electrodes provided in the first and second elongated containers corresponding to the particular glass tube. Due to the large working gas capacity of the container set, a longer useful life and lower maintenance costs can be achieved.

Abstract translation: 玻璃管灯矩阵装置包括工作气体容器组和玻璃管矩阵。 工作气体容器组包括在平面中的多个平行的第一细长容器和在平面中与第一细长容器相交并形成一角度的多个平行的第二细长容器。 第一和第二细长容器中的每一个在其中包含工作气体。 玻璃管矩阵包括多个薄玻璃管，每个薄玻璃管具有两个开口端，其流体地分别与第一细长容器中的一个和第二细长容器中的一个连通，由此用工作气体填充玻璃管。 每个玻璃管的横截面积远小于第一和第二细长容器的横截面面积。 当对与特定玻璃管相对应的第一和第二细长容器中设置的电极施加足够的电压降时，特定玻璃管中的工作气体放电以发光。 由于容器组的工作气体容量大，可以实现更长的使用寿命和更低的维护成本。

公开(公告)号：US4979017A

公开(公告)日：1990-12-18

申请号：US314713

申请日：1989-02-23

Applicant: Adam Mii

Inventor： Adam Mii

IPC: H01L23/495 ,  H01L25/075 ,  H01L33/54 ,  H01L33/62

CPC classification number: H01L33/62 ,  H01L23/49562 ,  H01L25/0753 ,  H01L2924/0002 ,  H01L33/54

Abstract: A semiconductor element string having a number of semiconductor elements mounted on a lead frame. The lead frame has a transverse plate, an assembling plate and a number of first and second leads respectively connected to the transverse plate and the assembling plate. The lead frame is used to form the semiconductor element string by soldering the semiconductor elements on the end portions of the first and second leads. When forming the semiconductor element string, one of the leads of each of the semiconductor elements in the string is connected to the transverse plate.

Abstract translation: 一种半导体元件串，其具有安装在引线框架上的多个半导体元件。 引线框架具有横板，组装板和分别连接到横板和组装板的多个第一和第二引线。 引线框用于通过将半导体元件焊接在第一和第二引线的端部上来形成半导体元件串。 当形成半导体元件串时，串中的每个半导体元件的引线中的一个连接到横向板。

公开(公告)号：US4984057A

公开(公告)日：1991-01-08

申请号：US558748

申请日：1990-07-27

Applicant: Adam Mii

Inventor： Adam Mii

IPC: H01L25/13 ,  H01L33/62 ,  H05K1/18

CPC classification number: H01L33/62 ,  H05K1/18 ,  H01L25/13 ,  H01L2924/0002 ,  H05K2201/10106 ,  H05K2201/1053 ,  H05K2201/10757 ,  H05K2201/10924

Abstract: A semiconductor element string having a number of semiconductor elements, each of which has the first and second leads mounted on a transverse plate. The first leads are cut off from the transverse plate, when the semiconductor element string is to be mounted on the printed circuit board. The second leads connected to the transverse plate serve as the ground lines for the respective semiconductor elements by bending two distal ends of the transverse plate to be mounted on the printed circuit board. A linking piece is provided crossing over the middle portions of the first and second leads so as to make the whole construction more stable. The second leads are bent into a S-shaped structure. Each second lead and its corresponding first lead are located on a first vertical plane which intersects with a second vertical plane passing through a common longitudinal axis of the semiconductor element string by an angle.

Abstract translation: 一种具有多个半导体元件的半导体元件串，每个半导体元件具有安装在横向板上的第一和第二引线。 当将半导体元件串安装在印刷电路板上时，第一引线与横板相切。 连接到横板的第二引线通过弯曲要安装在印刷电路板上的横向板的两个远端，用作各个半导体元件的接地线。 跨越第一和第二引线的中间部分设置连接件，以使整个结构更稳定。 第二个引线弯曲成S形结构。 每个第二引线及其对应的第一引线位于与通过半导体元件串的公共纵向轴线一个角度的第二垂直平面相交的第一垂直平面上。

公开(公告)号：US4949156A

公开(公告)日：1990-08-14

申请号：US154588

申请日：1988-02-10

Applicant: Adam Mii

Inventor： Adam Mii

IPC: G09F9/33 ,  H01L25/13 ,  H01L33/62

CPC classification number: H01L33/62 ,  G09F9/33 ,  H01L25/13 ,  H01L2924/0002

Abstract: A semiconductor string connection structure comprising a plurality of encasements, each of which has a light emitting diode chip and a pair of conducting leads, a plurality of binding pieces connected between the encasements, a plurality of longitudinal pieces disposed between two pairs of the conducting leads or at the right-most or left-most side thereof, a plurality of transverse thin pieces connected with the leads and longitudinal pieces, and a transverse plate disposed and connected with lower ends of the leads and longitudinal piece. The transverse plate serves as a common line, therefore, the lower half of the semiconductor string connection structure is folded 180 degrees such that the whole structure can be mounted on a circuit board to form a large display.

Abstract translation: 一种半导体串连接结构，包括多个封装，每个封装具有发光二极管芯片和一对导电引线，连接在所述外壳之间的多个绑定件，设置在两对导电引线之间的多个纵向件 或者在其最右侧或最左侧具有与引线和纵向件连接的多个横向薄片，以及设置并连接到引线和纵向件的下端的横向板。 横板用作公共线，因此，半导体串连接结构的下半部折叠180度，使得整个结构可以安装在电路板上以形成大的显示。