公开(公告)号：US20190301661A1

公开(公告)日：2019-10-03

申请号：US16369479

申请日：2019-03-29

Applicant: Advanced Ion Beam Technology, Inc.

Inventor： Yu-Lin Chang ,  Chien-Cheng Kuo ,  Yu-Ho Ni ,  Chun-Chieh Lin

IPC: F16L59/065

Abstract: The proposed vacuum jacketed tube may deliver the high/low temperature fluid with less temperature-transfer, especially may delivery high/low temperature fluid through a flexible structure. The vacuum jacketed tube includes a tubular structure surrounding a pipe wherein the fluid is delivered therethrough. Also, the space between the tubular structure and the pipe may be vacuumed. Therefore, the heat transferred into and/or away the fluid may be minimized, especially if the tubular structure and the pipe is separated by at least one thermal insulator or is separated mutually. Moreover, the vacuum jacketed tube may be mechanically connected to the source/destination of the delivered fluid, even other vacuum jacketed tube, through the bellows and/or the rotary joint. Besides, the pipe may be surrounded by a Teflon bellows and the tubular structure may be surrounded by a steel bellows, so as to further reduce the heat transferred into/away the fluid delivered inside the pipe.

公开(公告)号：US20180131293A1

公开(公告)日：2018-05-10

申请号：US15689158

申请日：2017-08-29

Applicant: Advanced Ion Beam Technology, Inc.

Inventor： Te-Min Wang ,  Yu-Ho Ni ,  Chun-Chieh Lin ,  Chien-Chung Hou ,  Cheng-Mao Chien

IPC: H02N13/00 ,  H05F3/02 ,  G01R27/26

CPC classification number: H02N13/00 ,  G01R27/2605 ,  G01R31/2808 ,  G01R31/2831 ,  H01L21/67288 ,  H01L21/6833 ,  H01L21/68742 ,  H05F3/02

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

公开(公告)号：US10804821B2

公开(公告)日：2020-10-13

申请号：US15689158

申请日：2017-08-29

Applicant: Advanced Ion Beam Technology, Inc.

Inventor： Te-Min Wang ,  Yu-Ho Ni ,  Chun-Chieh Lin ,  Chien-Chung Hou ,  Cheng-Mao Chien

IPC: H02N13/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  G01R31/28 ,  G01R27/26 ,  H05F3/02

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.

公开(公告)号：US11349414B2

公开(公告)日：2022-05-31

申请号：US17017099

申请日：2020-09-10

Applicant: Advanced Ion Beam Technology, Inc.

Inventor： Te-Min Wang ,  Yu-Ho Ni ,  Chun-Chieh Lin ,  Chien-Chung Hou ,  Cheng-Mao Chien

IPC: H02N13/00 ,  H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  G01R31/28 ,  G01R27/26 ,  H05F3/02

Abstract: An apparatus and a method for monitoring the relative relationship between the wafer and the chuck is provided, especially for monitoring whether the wafer is sticky on the chuck when the wafer is de-chucked. The lift pins may be extended outside the chuck to separate the wafer and the chuck when the wafer is de-chucked. By detecting the capacitance between the de-chucked wafer and the chuck, especially by comparing the detected capacitance with the capacitance that the wafer is held by the chuck, one may determine whether the wafer is sticky on the chuck, or even whether the wafer is properly supported by the lift pins. Accordingly, an early alarm may be issued if the wafer is sticky or improperly removed. Besides, by controlling a switch electrically connected to a lift pin that contacted the wafer, the charges at the wafer may be eliminated.