公开(公告)号：US20140144683A1

公开(公告)日：2014-05-29

申请号：US14169640

申请日：2014-01-31

Applicant: Advanced Semiconductor Engineering, Inc.

Inventor： Kuo-Hua CHEN ,  Ming-Chiang LEE ,  Tsung-Hsun LEE ,  Chen-Chuan FAN

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0298 ,  H01L23/3128 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/09 ,  H05K1/116 ,  H05K2201/09781

Abstract: A substrate structure is provided. The substrate structure includes a number of traces, a substrate core, a number of first metal tiles, a number of second metal tiles, a number of first electrically-functioning circuits, and a number of second electrically-functioning circuits. The substrate core has a first surface and a second surface opposite to the first surface. The traces, the first metal tiles, and the first electrically-functioning circuits are disposed on the first surface and add up to a first metal structure proportion, and the second metal tiles and the second electrically-functioning circuits are disposed on the second surface and add up to a second metal structure proportion. The difference between the first metal structure proportion and the second metal structure proportion is within 15%.

Abstract translation: 提供了基板结构。 衬底结构包括多个迹线，衬底芯，多个第一金属瓦，多个第二金属瓦，多个第一电功能电路和多个第二电功能电路。 衬底芯具有与第一表面相对的第一表面和第二表面。 迹线，第一金属瓦片和第一电功能电路设置在第一表面上并且加到第一金属结构比例，并且第二金属瓦片和第二电功能电路设置在第二表面上， 加起来第二个金属结构比例。 第一金属结构比例与第二金属结构比例之差在15％以内。