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公开(公告)号：US5496433A
公开(公告)日：1996-03-05
申请号：US38293
申请日：1993-03-29
IPC分类号： B29C43/20 , B29C43/32 , B29C43/36 , B29C43/56 , B29C43/58 , B29C65/52 , B29K105/06 , B29L9/00 , B29L31/34 , B30B7/02 , B30B12/00 , B30B15/06 , B30B15/22 , B30B15/34 , H05K3/46
CPC分类号： B29C43/203 , B29C43/56 , B29C43/58 , B30B15/064 , B32B37/10 , B29C2037/903 , B29C2043/561 , B29C2043/5808 , B29C33/20 , B29C43/32 , B32B2309/12 , B32B2309/72 , H05K3/4611
摘要： A hot press for producing a multilayered substrate including vertically opposing upper and lower bolsters relatively movable toward each other to press multilayered substrate blanks and to cool the plates after the bonding. A sealing arrangement includes a cylinder and encloses the upper and lower bolsters so as to define a hermetically sealed space, with an evacuating arrangement reducing the pressure inside the hermetically sealed space during heating and pressing in which a bonding agent in the multilayered substrate blanks is softened. A high-pressure gas supplying arrangement supplies a pressurizing gas into the hermetically sealed space so as to impart the bonding pressure. A pressure sensor detects the pressure inside the hermetically sealed space, and a controller effects a compensation for incremental increases in the bonding pressure when the pressure inside the hermetically sealed space is reduced by the evacuating arrangement and for incrementally decreasing the bonding pressure when the pressure inside the space is elevated by the pressurized gas, by feedback output signals of the pressure sensor to the hydraulic pressure source.
摘要翻译： 一种用于制造多层基板的热压机，包括可相对于彼此相对移动的垂直相对的上部和下部支撑块，以挤压多层基板坯料并在结合之后冷却板材。 密封装置包括一个气缸，并且包围上部和下部垫圈，以便限定一个气密密封的空间，排气装置在加热和加压期间降低密封空间内的压力，其中多层基材坯料中的粘结剂软化 。 高压气体供给装置将加压气体供给到气密密封空间中以赋予接合压力。 压力传感器检测密封空间内的压力，并且当通过排气装置减小密封空间内的压力时，控制器对粘合压力的增加的增加进行补偿，并且当内部的压力内部递增地降低接合压力时， 通过压力气体将压力传感器的反馈输出信号提升到液压源。
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公开(公告)号：US5182121A
公开(公告)日：1993-01-26
申请号：US594711
申请日：1990-10-09
申请人： Akimi Miyashita , Mutsumasa Fujii , Minoru Kubosawa , Keiichiro Torii , Nobuaki Ooki , Kiyonori Kogawa , Masami Kawaguchi , Hideyasu Murooka , Masayuki Kyooi
发明人： Akimi Miyashita , Mutsumasa Fujii , Minoru Kubosawa , Keiichiro Torii , Nobuaki Ooki , Kiyonori Kogawa , Masami Kawaguchi , Hideyasu Murooka , Masayuki Kyooi
IPC分类号： B30B7/02 , B29C33/04 , B29C43/20 , B29C43/32 , B29C43/56 , B29C65/52 , B29C65/78 , B29L9/00 , B30B12/00 , B30B15/00 , B30B15/34 , H05K3/46
CPC分类号： B30B15/0017 , B29C33/04 , B29C43/56 , B29C2043/561 , B29C43/32 , H05K3/4611
摘要： A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.
摘要翻译： 一种热压机，包括用于在减压条件下的多层基板的周围材料的可置换套筒，气体加压条件和具有热板的加热条件。 上下密封单元密封套筒的内部，机构降低并提升套筒。 先导检查机构防止下压板在减压条件和气压条件下升高/降低，并且保持器保持套筒的降低或升高的状态。 在减压条件和气体压力条件下形成多层基板。 因此，除去多层基材的材料和挥发性组合物之间的气氛和水分。 此外，在多层基板中消除了在加热板的加热和加压过程期间产生的空隙。 通过在气体压力条件下通过加热板在热和压力下进行多层基板的形成，提高了最终的尺寸精度和形状，并且抑制了翘曲或扭曲。
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公开(公告)号：US5297480A
公开(公告)日：1994-03-29
申请号：US879247
申请日：1992-05-06
IPC分类号： B29C43/32 , B29C33/02 , B29C33/04 , B29C35/02 , B29C35/04 , B29C43/56 , B29C65/48 , B29L9/00 , B29L31/34 , B30B7/02 , B30B15/00 , B30B15/06 , B30B15/34 , B32B37/10 , H05K3/46 , B30B9/00
CPC分类号： B30B15/064 , B29C33/02 , B29C33/04 , B29C43/56 , B30B15/061 , B32B37/10 , H01L21/67092 , B29C2035/0211 , B29C2043/561 , B29C35/041 , B29C43/32 , B32B2309/68 , B32B2457/08 , H05K3/4611
摘要： A high vacuum hot press for producing a multi-layer board. The high vacuum hot press includes a pair of heat insulating members each comprising a heat insulating material and a thin metallic cover defining an evacuated hermetic space accommodating therein the heat insulating material. The heat insulating members are arranged on respective surfaces, facing each other on a pair of bolsters. A pair of hot plates are placed on the heat insulating members, respectively. A multi-layer workpiece is disposed between the hot plates in a sealed space in a sealing unit. The multi-layer work includes wafers and an adhesive base material. The sealed space is evacuated to a high vacuum by an evacuating unit, and the multi-layer workpiece is heated by a heating unit under a high vacuum. The high vacuum hot press is further provided with a bonding unit which shifts the bolsters relative to each other to open and close the sealing unit and to bond the wafers of the multi-layer workpiece to each others for producing the multi-layer board.
摘要翻译： 一种用于生产多层板的高真空热压机。 高真空热压机包括一对隔热构件，每个隔热构件包括隔热材料和限定在其中容纳隔热材料的抽空的密封空间的薄金属盖。 绝热构件布置在相互面对的一对垫子上。 一对热板分别放置在绝热构件上。 多层工件在密封单元的密封空间中设置在热板之间。 多层工作包括晶片和粘合剂基材。 密封空间通过抽气单元抽真空至高真空，多层工件在高真空下由加热单元加热。 高真空热压机还具有接合单元，该接合单元相对于彼此移动，以打开和关闭密封单元并将多层工件的晶片彼此粘合以制造多层板。
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4.发明授权Hot press with pressure vessels to uniformly distribute pressure to the work piece 失效用压力容器热压，以均匀分布压力到工件
公开(公告)号：US5558015A
公开(公告)日：1996-09-24
申请号：US360087
申请日：1994-12-20
申请人： Akimi Miyashita , Mutsumasa Fujii , Haruo Mishina
发明人： Akimi Miyashita , Mutsumasa Fujii , Haruo Mishina
IPC分类号： B30B15/34 , B29C43/18 , B29C43/20 , B29C43/52 , B29C43/56 , B29C43/58 , B29C65/52 , B29L9/00 , B29L31/34 , B30B5/06 , B30B15/06 , H05K3/46 , B30B5/02
CPC分类号： B29C43/56 , B29C43/203 , B29C43/52 , B30B15/064 , B30B5/062 , B32B37/10 , B29C2043/3647 , B29C2043/561 , B29C43/32 , B29L2031/3425 , B29L2031/7232 , B32B37/1009 , H05K3/4611
摘要： A hot press used, for example, for producing a thin printed board and a multilayered board, such as liquid crystal glass board bonded by a low-viscosity adhesive, and to a hot press suitable for forming a board requiring uniform bonding pressure. A hot press includes an upper and a lower bolster arranged in vertically opposed relation to each other, an upper and a lower heat plate respectively disposed in opposed relation to the upper and lower bolsters, a device for moving at least one of the upper and lower bolsters toward the other to produce a pressing force between the upper and lower heat plates, and pressure vessels respectively mounted on the heat plates. Each pressure vessel is made of a thin film and is filled with a fluid heating medium. When substrate blanks are interposed between the upper and lower pressure vessels and pressed by them, surface pressure for adhesive bonding becomes uniform, and heat from the heat plates is uniformly transferred to the blanks.
摘要翻译： 例如，用于制造薄型印刷电路板和多层板的热压机，例如通过低粘度粘合剂粘合的液晶玻璃板，以及适于形成需要均匀粘合压力的板的热压机。 热压机包括彼此垂直相对设置的上部和下部垫块，分别设置成与上部和下部垫圈相对的上部和下部加热板，用于移动上部和下部中的至少一个的装置 朝向另一侧的垫圈在上下加热板和分别安装在加热板上的压力容器之间产生压力。 每个压力容器由薄膜制成并填充流体加热介质。 当衬底坯料插入在上压力容器和下压力容器之间并被其按压时，用于粘合剂粘合的表面压力变得均匀，并且来自加热板的热均匀地转移到坯料。
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公开(公告)号：US5578159A
公开(公告)日：1996-11-26
申请号：US257519
申请日：1994-06-09
CPC分类号： B30B15/007 , B29C43/203 , B29C43/58 , B30B15/064 , B30B15/16 , B32B37/0007 , B32B37/10 , B29C2043/5808 , B29K2311/14 , B32B2309/12 , B32B2309/72 , B32B2457/08 , H05K3/4611
摘要： In a hot press according to the present invention, a control panel detects the fact that the viscosity of bonding resin of multilayer circuit board materials is minimized by taking thereinto at least one of the values measured by a speed sensor of a lower bolster, a measuring portion for measuring a control current of an electromagnetic proportional relief valve and a relief amount detector for detecting the relief amount of the electromagnetic proportional relief valve, and gives an instruction of an optimum air pressure addition timing. Accordingly, even if the multilayer circuit board materials and the like are varied, it is always possible to change over from a vacuum condition to an air pressure added condition at the best timing, thereby making it possible to obtain a multilayer circuit board of a uniform thickness without causing generation of void.
摘要翻译： 在根据本发明的热压机中，控制面板通过采用由下垫片的速度传感器测量的值中的至少一个来测量多层电路板材料的粘合树脂的粘度被最小化的事实， 用于测量电磁比例溢流阀的控制电流的部分和用于检测电磁比例溢流阀的溢流量的释放量检测器，并且给出最佳气压添加定时的指令。 因此，即使多层电路板材料等变化，总是可以在最佳时机从真空状态向空气压力添加状态转换，从而可以获得均匀的多层电路板 厚度而不会产生空隙。
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公开(公告)号：US5555798A
公开(公告)日：1996-09-17
申请号：US149616
申请日：1993-11-09
申请人： Akimi Miyashita , Mutsumasa Fujii , Kenji Hisadomi
发明人： Akimi Miyashita , Mutsumasa Fujii , Kenji Hisadomi
CPC分类号： B30B15/064 , B30B11/04 , B30B15/34 , B32B37/1054 , H05K3/4611
摘要： A hot press for producing multilayered substrate blanks wherein the substrate blanks are placed between upper and lower bolsters via heat insulating plates and heating plates. The multilayered substrate blanks are fitted into a frame which is provided on the upper bolster and the multilayered substrate blanks are pressed and heated. The frame is fashioned of a material having a coefficient of thermal expansion less than the coefficients of thermal expansion of the multilayered substrate blanks. When the multilayered substrate blanks are pressed and heated, outside dimensions become equal to the inside dimensions of the frame. Thus, no flow of an adhesive out of the multilayered substrate blanks occurs, and as a result it is possible to produce a high density multilayered substrate with a large number of layers.
摘要翻译： 一种用于生产多层基材坯料的热压机，其中基板坯料通过绝热板和加热板放置在上垫板和下垫板之间。 将多层基材坯料装配到设置在上垫板上的框架中，并且多层基材坯料被按压和加热。 框架由具有小于多层基板坯料的热膨胀系数的热膨胀系数的材料制成。 当多层基材坯料被按压和加热时，外部尺寸变得等于框架的内部尺寸。 因此，不会发生多层基板坯料中的粘合剂流动，结果可以制造出具有大量层的高密度多层基板。
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