摘要:
A drying apparatus for processing a surface of a substrate wherein, when a nitrogen gas is fed to a nozzle, a jet of the nitrogen gas spouted through a jet hole is generated. The jet becomes film-shaped and is projected upwardly along an inner surface of a side wall of a processing vessel. Then, the jet is collected into an outside through a suction port formed in an upper portion of the processing vessel. The inner surface of the side wall of the processing vessel is covered with the jet. Therefore, an IPA vapor can be prevented from condensing uselessly on the inner surface. As a result, the IPA vapor is effectively utilized for condensation on a surface of the object to be processed which is mounted on a pan. Thus, defective dryness of the object can be prevented.
摘要:
A nozzle and an exhaust member are provided opposite to each other with an upward opening of a processing vessel interposed therebetween. A side wall of the processing vessel is smoothly curved inward as the opening is approached upward. The nozzle spouts a nitrogen gas fed from a nitrogen gas feeder as a jet for covering the opening toward an exhaust port of the exhaust member. The jet can effectively function as a curtain because the side wall of the processing vessel is curved. Therefore, a cooling coil necessary for a conventional apparatus is not required. Consequently, instability of the state of the IPA vapor caused by the cooling coil can be eliminated so that defective dryness is relieved or eliminated.
摘要:
When an IPA is fed to a nozzle, a flow of the IPA passing through holes is generated. The flow becomes film-shaped and goes downward along an inner surface of a side wall of a processing vessel. Then, the flow is collected by a liquid receiving section formed in a lower portion of the processing vessel and discharged to an outside. The inner surface of the side wall of the processing vessel is covered with the flow of the IPA. Therefore, an IPA vapor can be prevented from condensing uselessly on the inner surface. As a result, the IPA vapor is effectively utilized for condensation on a surface of the object to be processed which is mounted on a pan. Thus, the defective dryness of the object can be prevented.
摘要:
Semiconductor wafer counters are respectively provided at a loader portion, at a plurality of processing baths and at an unloader portion in a semiconductor wafer processing apparatus in which semiconductor wafers are processed in sequence using a plurality of processing baths, and when missing of wafers is detected, an alarm is issued. Also, there is provided an interlock function which stops processing in a processing bath in which the missing is detected and allows processing in downstream processing baths to continue, but prevents additional lots from being introduced into the loader portion and stops processing in upstream processing baths after the completion of the chemical processing under way.
摘要:
A semiconductor device producing method that can clean an edge part of a semiconductor substrate with certainty is provided. The method of producing a semiconductor device includes a step of generating ions and a step of accelerating the ions by means of an electric field and radiating an ion flow onto an edge part of a semiconductor substrate to clean the edge part of the semiconductor substrate. The semiconductor substrate is moved relative to the ion flow while maintaining a state in which the ion flow is being radiated onto the edge part. The step of generating ions includes applying a high-frequency voltage between a pair of electrodes to generate the ions between the electrodes.
摘要:
A heat-sensitive recording sheet is disclosed, comprising a base having thereon a heat-sensitive layer which contains, as main components, at least two kinds of fluoran dye color formers selected from different groups and a developer which causes coloration of the color former by heating. The color image of the heat-sensitive recording sheet fades less under influence of heat or humidity. Further the heat-sensitive recording sheet has high whiteness and less fogging of the background.
摘要:
A semiconductor device includes: a first layer; a second layer above the first layer; first and second multi-layered structures; and a supporter. The first and second multi-layered structures extend from the first layer to connect to the second layer. The supporter extends from the first layer to connect to the second layer. The supporter is between the first and second multi-layered structures. The supporter is separated from the first and second multi-layered structures by empty space.
摘要:
A method of manufacturing a stack capacitance type capacitor is provided, which prevents the problem that the capacitor cannot be formed because a lower electrode collapses with the external wall thereof exposed in forming the lower electrode of the capacitor in a deep hole formed in silicon oxide, and removing silicon oxide that is a support base material for the lower electrode using a solution containing hydrogen fluoride to expose the external wall of the lower electrode. According to the invention, the support base material in which a deep hole is formed is formed with an amorphous carbon film, the amorphous carbon film used as the support base material for the lower electrode is removed by dry etching after forming the lower electrode, and it is thereby possible to prevent the lower electrode from collapsing.
摘要:
A semiconductor device manufactured by cleaning without dissolving W, Ti, or TiN even if these metallic materials are exposed on the substrates to be cleaned, and a method for manufacturing such a semiconductor device. Impurities present on a silicon substrate can be removed while controlling the etching of a tungsten film exposed on the surface of a silicon substrate, by dipping and cleaning the silicon substrate in one or a plurality of chemical solutions selected from a group consisting of HF, HCl, and NH4OH, under the condition that the surface of the silicon substrate is entirely covered with a tungsten film. After dry etching for patterning the tungsten film and the barrier metal, impurities present on a silicon substrate can be removed while controlling the etching of the tungsten film and the barrier metal exposed on the surface of a silicon substrate, by dipping and cleaning the silicon substrate in one or a plurality of chemical solutions selected from a group consisting of HCl and NH4OH.
摘要:
An apparatus for inhibiting the copying of confidential documents is disclosed. Confidential documents are treated with an infrared ray-absorbing agent. The apparatus for inhibiting the copying of confidential documents is comprised of a means to detect the presence of the infrared ray-absorbing agent, and a means to stop a copying operation upon detection of the agent or a means to start a control system to make the documents unreadable. Documents may also be provided with a metal layer. The apparatus is then comprised of a means to detect the presence of the metal layer and a means to stop a copying operation or to start a control system adapted to make copied materials undistinguishable or unreadable upon detection of the metal layer.