公开(公告)号：US5798422A

公开(公告)日：1998-08-25

申请号：US511809

申请日：1995-08-07

申请人： Akio Karasawa ,  Akihiro Yamaguchi ,  Keizaburo Yamaguchi ,  Yuko Ishihara

发明人： Akio Karasawa ,  Akihiro Yamaguchi ,  Keizaburo Yamaguchi ,  Yuko Ishihara

IPC分类号： B41M5/155 ,  C07C65/105 ,  C07C65/24 ,  C08G61/02 ,  C08L63/00 ,  G03F7/023 ,  C08F6/00 ,  C08F6/02

CPC分类号： G03F7/0236 ,  B41M5/155 ,  C07C65/105 ,  C07C65/24 ,  C08G61/02 ,  C08L63/00 ,  G03F7/0233

摘要： Disclosed are an aromatic hydroxycarboxylic acid resin represented by the following formula (1): ##STR1## wherein each A group is the same or different and individually represents a substituted or unsubstituted phenylene or naphthylene group, R.sup.1 represents a hydrogen atom or a C.sub.1-4 alkyl group, R.sup.2 represents a hydrogen atom or a C.sub.1-10 alkyl, C.sub.1-10 alkoxyl, nitro or hydroxyl group, l stands for an integer of 0-100, m stands for an integer of 0-20 and n stands for an integer of 0-3 with the proviso that m stands for an integer other than 0 when all of the A group represent an unsubstituted or substituted a group, a preparation process thereof and use of the same.

摘要翻译： 公开了由下式（1）表示的芳族羟基羧酸树脂：其中每个A基团相同或不同，并且各自表示取代或未取代的亚苯基或亚萘基 R 1表示氢原子或C 1-4烷基，R 2表示氢原子或C 1-10烷基，C 1-10烷氧基，硝基或羟基，l表示0〜100的整数，m表示 0〜20的整数，n表示0-3的整数，条件是当A组全部为未取代或取代的基团时，m表示0以外的整数，其制备方法及其用途 。

公开(公告)号：US6040111A

公开(公告)日：2000-03-21

申请号：US993657

申请日：1997-12-18

申请人： Akio Karasawa ,  Akihiro Yamaguchi ,  Keizaburo Yamaguchi ,  Yuko Ishihara

发明人： Akio Karasawa ,  Akihiro Yamaguchi ,  Keizaburo Yamaguchi ,  Yuko Ishihara

IPC分类号： B41M5/155 ,  C07C65/105 ,  C07C65/24 ,  C08G61/02 ,  C08L63/00 ,  G03F7/023 ,  C08F6/00

CPC分类号： G03F7/0236 ,  B41M5/155 ,  C07C65/105 ,  C07C65/24 ,  C08G61/02 ,  C08L63/00 ,  G03F7/0233

摘要： Disclosed are an aromatic hydroxycarboxylic acid resin represented by the following formula (1): ##STR1## wherein each A group is the same or different and individually represents a substituted or unsubstituted phenylene or naphthylene group, R.sup.1 represents a hydrogen atom or a C.sub.1-4 alkyl group, R.sup.2 represents a hydrogen atom or a C.sub.1-10 alkyl, C.sub.1-10 alkoxyl, nitro or hydroxyl group, l stands for an integer of 0-100, m stands for an integer of 0-20 and n stands for an integer of 0-3 with the proviso that m stands for an integer other than 0 when all of the A group represent an unsubstituted or substituted phenylene group, a preparation process thereof and use of the same.

摘要翻译： 公开了由下式（1）表示的芳族羟基羧酸树脂：其中每个A基团相同或不同，并且各自表示取代或未取代的亚苯基或亚萘基，R 1表示氢原子或C 1-4烷基， R 2表示氢原子或C 1-10烷基，C 1-10烷氧基，硝基或羟基，l表示0〜100的整数，m表示0〜20的整数，n表示0〜 3，条件是当A基全部为未取代或取代的亚苯基时，m代表0以外的整数，其制备方法和用途。

公开(公告)号：US5710334A

公开(公告)日：1998-01-20

申请号：US453073

申请日：1995-05-26

申请人： Yuko Ishihara ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Yuko Ishihara ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C07C201/12 ,  C07C205/45 ,  C07C221/00 ,  C07C225/22 ,  C08G73/10 ,  C08G73/12 ,  C08J5/18 ,  C08L79/08 ,  C07C217/84 ,  C07C217/90

CPC分类号： C08G73/10 ,  C08G73/1007 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1067 ,  Y10T428/31504 ,  Y10T428/31721

摘要： This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide. The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability. The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

摘要翻译： 本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺，用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，包含热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物， 用于制备树脂组合物的树脂组合物的注塑制品，通过将上述可溶性和热塑性聚酰亚胺与纤维增强剂组合成型而获得的聚酰亚胺类复合材料和具有用上述聚酰亚胺改性的表面的纤维增强剂。 聚酰亚胺包含必需的结构单元，其具有一个或多个下式的重复结构单元：其中m和n分别为0或1的整数，且R为“无定形”，优异的 与传统已知的聚酰亚胺相比在降低的温度下的熔体流动稳定性，并且具有极大的改进的加工性能。 通过使用新颖的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。 因此，在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时，可以获得优异的熔体流动性和溶剂中的溶解性。

公开(公告)号：US5354890A

公开(公告)日：1994-10-11

申请号：US80772

申请日：1993-06-24

申请人： Shoji Tamai ,  Wataru Yamashita ,  Yuichi Okawa ,  Yuko Ishihara ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Wataru Yamashita ,  Yuichi Okawa ,  Yuko Ishihara ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C08G73/10 ,  C08G73/14

CPC分类号： C07C225/22 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/14

摘要： A heat-resistant and thermoplastic polyimide which has low dielectric characteristics and recurring structural units of the following formula: ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member; aromatic diamines which are useful for the raw material monomers of the polyimide and have following formulas: ##STR2## and a process for preparing the polyimide of the above formula by reacting these aromatic diamines with a tetracarboxylic dianhydride in the presence of an aromatic dicarboxylic anhydride or aromatic monoamine, and successively thermally or chemically imidizing the resultant polyamic acid; are disclosed.

摘要翻译： 具有低介电特性和具有下式的重复结构单元的耐热热塑性聚酰亚胺：其中R是具有2至27个碳原子并且选自脂族基团的四价基团 ，脂环族基团，单芳族基团，稠合多芳族基团和非缩合芳族基团彼此直接连接或桥接成员; 芳族二胺可用于聚酰亚胺的原料单体，具有以下分子式：＆lt; IMAGE＆gt;（IA）和＆lt; IMAGE＆gt;（IB）和通过使这些芳族二胺与四羧酸 二酐在芳族二羧酸酐或芳族单胺的存在下，并依次热或化学酰亚胺化所得聚酰胺酸; 被披露。

公开(公告)号：US5260388A

公开(公告)日：1993-11-09

申请号：US894940

申请日：1992-06-08

申请人： Shoji Tamai ,  Wataru Yamashita ,  Yuichi Okawa ,  Yuko Ishihara ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Wataru Yamashita ,  Yuichi Okawa ,  Yuko Ishihara ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C08G73/10 ,  C08G73/14 ,  C08G8/02 ,  C08G69/26

CPC分类号： C07C225/22 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1039 ,  C08G73/1067 ,  C08G73/14

摘要： A heat-resistant and thermoplastic polyimide which has low dielectric characteristics and recurring structural units of the following formula ##STR1## wherein R is a tetravalent radical having from 2 to 27 carbon atoms and selected from the group consisting of an aliphatic radical, alicyclic radical, monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member; aromatic diamines which are useful for the raw material monomers of the polyimide and have following formulas: ##STR2## and ##STR3## and a process for preparing the polyimide of the above formula by reacting these aromatic diamines with a tetracarboxylic dianhydride in the presence of an aromatic dicarboxylic anhydride or aromatic monoamine, and successively thermally or chemically imidizing the resultant polyamic acid.

公开(公告)号：US5480965A

公开(公告)日：1996-01-02

申请号：US280551

申请日：1994-07-26

申请人： Wataru Yamashita ,  Yuichi Okawa ,  Hideaki Oikawa ,  Tadashi Asanuma ,  Yuko Ishihara ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi ,  Shoji Tamai

发明人： Wataru Yamashita ,  Yuichi Okawa ,  Hideaki Oikawa ,  Tadashi Asanuma ,  Yuko Ishihara ,  Mitsunori Matsuo ,  Keizaburo Yamaguchi ,  Akihiro Yamaguchi ,  Shoji Tamai

IPC分类号： C07C201/12 ,  C07C205/45 ,  C07C221/00 ,  C07C225/22 ,  C08G73/10 ,  C08G73/12 ,  C08J5/18 ,  C08L79/08 ,  C08G69/26 ,  C08L77/00

CPC分类号： C08G73/10 ,  C08G73/1007 ,  C08G73/1014 ,  C08G73/1017 ,  C08G73/1067 ,  Y10T428/31504 ,  Y10T428/31721

摘要： This invention relates to a novel thermoplastic and amorphous polyimide which is readily soluble in organic solvent, a novel aromatic diamino compound used for the polyimide, a preparation process thereof, a polyimide-based resin composition comprising the thermoplastic polyimide and a fibrous reinforcement, a process for preparing the resin composition, an injection molded article of the resin composition, a polyimide-based composite obtained by molding the above soluble and thermoplastic polyimide in combination with a fibrous reinforcement, and a fibrous reinforcement having a surface modified with the above polyimide.The polyimide comprise a requisite structural unit having one or more recurring structural units of the formula: ##STR1## wherein m and n are individually an integer of 0 or 1, and R is ##STR2## The polyimide of the invention is essentially amorphous, excellent in melt flow stability in the decreased temperature as compared with conventionally known polyimide and has greatly improved processability.The polyimide of the invention obtained by using a novel aromatic diamino compound as a monomer can control various properties such as melt flow ability and solubility in solvents by side chains and not by principal chain of polyimide. Thus, excellent melt flow property and solubility in solvents can be obtained while maintaining high heat resistance and adhesive property which are derived from benzophenone structure of the diamino compound of the the invention.

摘要翻译： 本发明涉及易溶于有机溶剂的新型热塑性和无定形聚酰亚胺，用于聚酰亚胺的新型芳族二氨基化合物及其制备方法，包含热塑性聚酰亚胺和纤维增强剂的聚酰亚胺基树脂组合物， 用于制备树脂组合物的树脂组合物的注塑制品，通过将上述可溶性和热塑性聚酰亚胺与纤维增强剂组合成型而获得的聚酰亚胺类复合材料和具有用上述聚酰亚胺改性的表面的纤维增强剂。 聚酰亚胺包含必需的结构单元，其具有一个或多个下式的重复结构单元：其中m和n分别为0或1的整数，R为本发明的聚酰亚胺基本上为 与常规已知的聚酰亚胺相比，在降低的温度下的熔体流动稳定性优异并且具有极大的改进的加工性。 通过使用新颖的芳族二氨基化合物作为单体获得的本发明的聚酰亚胺可以通过侧链而不是聚酰亚胺的主链来控制各种性能如熔体流动性和在溶剂中的溶解度。 因此，在保持由本发明的二氨基化合物的二苯甲酮结构得到的高耐热性和粘合性的同时，可以获得优异的熔体流动性和溶剂中的溶解性。

公开(公告)号：US5322962A

公开(公告)日：1994-06-21

申请号：US59758

申请日：1993-05-12

申请人： Shoji Tamai ,  Keizaburo Yamaguchi ,  Yuko Ishihara ,  Saburo Kawashima ,  Hideaki Oikawa ,  Toshiyuki Kataoka ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Keizaburo Yamaguchi ,  Yuko Ishihara ,  Saburo Kawashima ,  Hideaki Oikawa ,  Toshiyuki Kataoka ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C08G73/10

CPC分类号： C08G73/10 ,  C07C225/22 ,  C08G73/1067 ,  C08G73/1078

摘要： Disclosed are a novel aromatic diamine; a polymide comprising 1,3-bis(3-aminobenzoyl)benzene or 4,4'-bis(3-aminobenzoyl)biphenyl as a diamine component and having recurring structural units represented by the formula (III): ##STR1## wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having from 2 to 27 carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and X is a divalent radical of ##STR2## and a polyimide having a terminal aromatic group which is essentially unsubstituted or substituted with a radical having no reactivity with amines or dicarboxylic acid anhydrides or a composition comprising said polyimide.

摘要翻译： 公开了一种新型芳族二胺; （III）所示的具有重复结构单元的1,3-二（3-氨基苯甲酰基）苯或4,4'-双（3-氨基苯甲酰基）联苯的聚酰亚胺作为二胺成分， 其中R是选自具有2至27个碳原子的脂肪族基团，脂环族基团，单芳族基团，缩合多芳族基团和与直接键合或桥接成员相互连接的非缩合芳族基团的四价基团，以及 X是的二价基团和具有基本上未被取代的末端芳基或被不与胺或二羧酸酐反应的基团取代的聚酰亚胺或包含所述聚酰亚胺的组合物。

公开(公告)号：US5231160A

公开(公告)日：1993-07-27

申请号：US752053

申请日：1991-08-29

申请人： Shoji Tamai ,  Keizaburo Yamaguchi ,  Yuko Ishihara ,  Saburo Kawashima ,  Hideaki Oikawa ,  Toshiyuki Kataoka ,  Akihiro Yamaguchi

发明人： Shoji Tamai ,  Keizaburo Yamaguchi ,  Yuko Ishihara ,  Saburo Kawashima ,  Hideaki Oikawa ,  Toshiyuki Kataoka ,  Akihiro Yamaguchi

IPC分类号： C07C225/22 ,  C08G73/10

CPC分类号： C08G73/10 ,  C07C225/22 ,  C08G73/1067 ,  C08G73/1078

摘要： A novel aromatic diamine; a polyimide comprising 1,3-bis(3-aminobenzoyl)benzene or 4,4'-bis(3-aminobenzoyl)biphenyl as a diamine component and having recurring structural units represented by the formula (III): ##STR1## wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having from 2 to 27 carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and noncondensed aromatic radical connected each other with a direct bond or a bridge member, and X is a divalent radical of ##STR2## and a polyimide having a terminal aromatic group which is essentially unsubstituted or substituted with a radical having no reactivity with amines or dicarboxylic acid anhydrides or a composition comprising said polyimide.

公开(公告)号：US6161214A

公开(公告)日：2000-12-12

申请号：US29258

申请日：1998-03-06

申请人： Yuko Ishihara ,  Yasuhiro Maenishi

发明人： Yuko Ishihara ,  Yasuhiro Maenishi

IPC分类号： H05K13/00 ,  G05B19/408 ,  G06F17/50 ,  H05K13/02 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/08 ,  G05B19/408 ,  G05B2219/35363 ,  G05B2219/50113 ,  Y10T29/4913 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/49137

摘要： A method is presented of generating data on component arrangement capable of shortening the moving distance of the mounting head in an electronic component mounting machine, and enhancing the mounting efficiency.The distribution center coordinates and their distributed state values of electronic components on a circuit board grouped in accordance with their kind are determined. The arrangement position of each electronic component at a component feed section is determined based on the distribution center coordinates. When the arrangement positions of more than two kinds of electronic components thus determined are the same, the arrangement position of the electronic component having a smaller distributed state value is preferentially determined.

摘要翻译： PCT No.PCT / JP96 / 02537 Sec。 371日期1998年3月6日 102（e）1998年3月6日PCT PCT 1996年9月6日PCT公布。 出版物WO97 / 09684 日期1997年03月13日提出了一种生成能够缩短电子部件安装机中的安装头的移动距离的部件配置的数据的方法，提高了安装效率。 确定根据其种类分组的电路板上的电子部件的配电中心坐标及其分布状态值。 基于分配中心坐标来确定每个电子部件在部件供给部分处的布置位置。 当如此确定的两种以上的电子部件的布置位置相同时，优先确定具有较小分布状态值的电子部件的布置位置。