公开(公告)号：US20110228258A1

公开(公告)日：2011-09-22

申请号：US13118004

申请日：2011-05-27

申请人： Akira HAMAMATSU ,  Minori NOGUCHI ,  Yoshimasa OHSHIMA ,  Sachio UTO ,  Taketo UENO ,  Hiroyuki NAKANO ,  Takahiro JINGU ,  Hisashi HATANO ,  Yukihisa MOHARA ,  Seiji OTANI ,  Takahiro TOGASHI

发明人： Akira HAMAMATSU ,  Minori NOGUCHI ,  Yoshimasa OHSHIMA ,  Sachio UTO ,  Taketo UENO ,  Hiroyuki NAKANO ,  Takahiro JINGU ,  Hisashi HATANO ,  Yukihisa MOHARA ,  Seiji OTANI ,  Takahiro TOGASHI

IPC分类号： G01N21/88

CPC分类号： G01N21/956

摘要： A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.

摘要翻译： 通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置，通过从仰角不同的多个方向之一的细长形状的光束照射， 根据要检测的缺陷的种类从照明光源发射的光束。 通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像，通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率 形状光通量。 通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

公开(公告)号：US20130058558A1

公开(公告)日：2013-03-07

申请号：US13593227

申请日：2012-08-23

申请人： Taketo UENO ,  Yasuhiro YOSHITAKE

发明人： Taketo UENO ,  Yasuhiro YOSHITAKE

IPC分类号： G06K9/62

CPC分类号： G01N21/9501 ,  G01N21/956 ,  G03F1/84 ,  G03F7/7065 ,  H01L21/67288

摘要： A defect inspection system is disclosed for easily setting inspection conditions and providing an inspection condition and a defect signal intensity to an operator. The defect inspection system digitizes a defective image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image as a defect signal intensity and accumulates them in association with the inspection condition. The inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. A recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and provided to the operator.

摘要翻译： 公开了一种用于容易地设置检查条件并向操作者提供检查条件和缺陷信号强度的缺陷检查系统。 缺陷检查系统将缺陷图像，与其对应的参考图像和缺陷图像和参考图像的不匹配部分数字化为缺陷信号强度，并与检查条件相关联地累加它们。 更改检查条件以重复评估，同时重复累积工作，直到完成对设定范围内的所有检查条件的评估。 包括具有高缺陷信号强度的累积条件和作为检查条件配方的检查条件项目分配的配方文件被自动输出并提供给操作者。

公开(公告)号：US20080239289A1

公开(公告)日：2008-10-02

申请号：US12046521

申请日：2008-03-12

申请人： Taketo UENO ,  Yasuhiro YOSHITAKE

发明人： Taketo UENO ,  Yasuhiro YOSHITAKE

IPC分类号： G01N21/00

CPC分类号： G01N21/95607

摘要： A semiconductor defect inspection apparatus using a method of comparing an inspected image with a reference image includes the following: (1) a light source and an illuminating optical system, (2) plural defect optical imaging systems and photo detectors for scattered light detection, (3) a substrate holder and a stage for a scan, (4) means for obtaining the misalignment information on an adjacent die image using the inspection image of a defect optical imaging system with the highest spatial resolution, and means for transmitting the misalignment information to all the defect inspection image processing units, (5) means for correcting misalignment information so that a design and adjustment condition of each optical imaging system may be suited, and means for calculating a difference image between dies based on the corrected misalignment information, and (6) a defect detection and image processing unit for performing defect determination and detection processing based on the difference image between the dies.

摘要翻译： 使用将检查图像与参考图像进行比较的方法的半导体缺陷检查装置包括：（1）光源和照明光学系统，（2）多个缺陷光学成像系统和用于散射光检测的光电检测器（ 3）衬底保持器和用于扫描的台，（4）使用具有最高空间分辨率的缺陷光学成像系统的检查图像获得相邻裸片图像上的未对准信息的装置，以及用于将未对准信息发送到 所有缺陷检查图像处理单元，（5）用于校正未对准信息的装置，使得每个光学成像系统的设计和调整条件可能适合;以及用于基于校正的未对准信息计算管芯之间的差分图像的装置，以及（ 6）一种用于基于该差异执行缺陷确定和检测处理的缺陷检测和图像处理单元 模具之间的图像。