IMAGE FORMING APPARATUS AND DATA NOTIFICATION AND PRINTING METHOD BY IMAGE FORMING APPARATUS
    2.
    发明申请
    IMAGE FORMING APPARATUS AND DATA NOTIFICATION AND PRINTING METHOD BY IMAGE FORMING APPARATUS 审中-公开
    图像形成装置的图像形成装置和数据通知和打印方法

    公开(公告)号:US20120013945A1

    公开(公告)日:2012-01-19

    申请号:US13164751

    申请日:2011-06-20

    申请人: Akitoshi SUZUKI

    发明人: Akitoshi SUZUKI

    IPC分类号: G06K15/02

    摘要: According to one embodiment, an image forming apparatus includes: a fax receiving unit capable of receiving facsimile data; a printing unit which prints the facsimile data received by the fax receiving unit; a fax data storage unit in which, if the facsimile data received by the fax receiving unit is secure fax data, this secure fax data is stored; and an addition detecting unit which detects that a removable network addition device is connected to the apparatus.

    摘要翻译: 根据一个实施例,图像形成装置包括:能够接收传真数据的传真接收单元; 打印单元,其打印由所述传真接收单元接收的传真数据; 传真数据存储单元,其中如果由传真接收单元接收的传真数据是安全的传真数据,则存储该安全传真数据; 以及附加检测单元,其检测到可移动网络添加设备连接到所述设备。

    ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING ULTRA-THIN COPPER FOIL WITH CARRIER
    3.
    发明申请
    ULTRA-THIN COPPER FOIL WITH CARRIER AND PRINTED WIRING BOARD USING ULTRA-THIN COPPER FOIL WITH CARRIER 有权
    超薄铜箔带载体和印刷线路板使用超薄铜箔与载体

    公开(公告)号:US20090011271A1

    公开(公告)日:2009-01-08

    申请号:US12205439

    申请日:2008-09-05

    IPC分类号: C25D7/00 C25D5/10

    摘要: To produce an ultra-thin copper foil with a carrier foil that microscopic crystal grains can be deposited without being affected by the surface roughness of a carrier foil, etching can be performed until an ultra-fine width such that line/space is 15 mum or less, and the microscopic line and a wiring board have large peel strength even after line of 15 mum is etched. An ultra-thin copper foil wherein a carrier foil, a peeling layer, an ultra-thin copper foil are laminated in this order, the ultra-thin copper foil (before roughening treatment is performed) is an electrolytic copper foil that surface roughness of 2.5 mum as ten point height of roughness profile, and the minimum distance between peaks of salients of a based material is 5 mum or more. Moreover, the surface of the ultra-thin copper foil is performed roughening treatment.

    摘要翻译: 为了制造具有载体箔的超薄铜箔,可以沉积微晶粒而不受载体箔的表面粗糙度的影响,可以进行蚀刻直到超细宽度使得线/间隔为15μm或 即使在15um的线被蚀刻之后,微细线和布线板也具有较大的剥离强度。 依次层叠载体箔,剥离层,超薄铜箔的超薄铜箔,超薄铜箔(进行粗糙化处理前)是表面粗糙度为2.5的电解铜箔 妈妈作为十点高度的粗糙度轮廓,并且基础材料的突起峰之间的最小距离为5um以上。 此外,超薄铜箔的表面进行粗糙化处理。