公开(公告)号：US4336260A

公开(公告)日：1982-06-22

申请号：US16757

申请日：1979-03-02

申请人： Alan J. Payne ,  Michael V. Aylott ,  Jimmie L. Moore ,  Edward M. Yokley

发明人： Alan J. Payne ,  Michael V. Aylott ,  Jimmie L. Moore ,  Edward M. Yokley

IPC分类号： C07D471/04 ,  A61K31/44 ,  A61K31/435 ,  A61K31/455

CPC分类号： C07D471/04

摘要： Treatment of central nervous system depression in a mammal using method and compositions employing 1-aryl-1,2,3,4-tetrahydro-.beta.-carboline-3-carboxylic acids, esters and pharmaceutically-acceptable salts.

摘要翻译： 使用1-芳基-1,2,3,4-四氢-β-咔啉-3-羧酸，酯和药学上可接受的盐的方法和组合物治疗哺乳动物的中枢神经系统抑制。

公开(公告)号：US06688956B1

公开(公告)日：2004-02-10

申请号：US09934780

申请日：2001-08-22

申请人： Edward M. Yokley ,  Yaw S. Obeng

发明人： Edward M. Yokley ,  Yaw S. Obeng

IPC分类号： B24D1100

CPC分类号： B24B37/24 ,  B24D3/26 ,  B24D18/0063 ,  B29C44/56 ,  B29C59/14 ,  Y10T428/24967

摘要： To address the deficiencies of the prior art, the present invention provides a polishing pad comprising a thermoplastic polymer and a method of manufacturing therefor. More specifically, the present invention polishing pad fabricated from an extruded amorphous thermoplastic and free of a gate vestige. The invention also provides a method of manufacturing a polishing pad that is free from a gate vestige pad from an extruded amorphous thermoplastic.

摘要翻译： 为了解决现有技术的缺点，本发明提供一种包含热塑性聚合物的抛光垫及其制造方法。 更具体地说，本发明的抛光垫由挤出的非晶态热塑性塑料制成并且没有浇口痕迹。 本发明还提供了一种制造抛光垫的方法，所述抛光垫与挤出的非晶态热塑性材料不相隔离。

公开(公告)号：US06846225B2

公开(公告)日：2005-01-25

申请号：US10000101

申请日：2001-10-24

申请人： Yaw S. Obeng ,  Edward M. Yokley

发明人： Yaw S. Obeng ,  Edward M. Yokley

IPC分类号： B24B37/04 ,  B24B49/16 ,  B24D3/26 ,  B24D13/14 ,  B24D18/00 ,  B29C59/14 ,  B24B1/00

CPC分类号： B24B37/24 ,  B24B37/013 ,  B24B37/042 ,  B24B49/003 ,  B24B49/16 ,  B24D3/26 ,  B24D18/0063 ,  B24D18/009 ,  B29C59/14 ,  B29K2105/04

摘要： The present invention is directed, in general, to a method of polishing a surface on substrates, such as semiconductor wafers and, more specifically, to a polishing pad suitable for this purpose. The polishing pad comprises a polishing body that includes a cross-linked polymer material, and may be incorporated into a polishing apparatus. Polishing includes positioning the substrate containing at least one layer against the polishing body and polishing the layer.

公开(公告)号：US06579604B2

公开(公告)日：2003-06-17

申请号：US09994407

申请日：2001-11-27

申请人： Yaw S. Obeng ,  Edward M. Yokley

发明人： Yaw S. Obeng ,  Edward M. Yokley

IPC分类号： B32B2700

CPC分类号： B24B37/24 ,  B24B37/013 ,  B24B37/042 ,  B24B49/003 ,  B24B49/16 ,  B24D3/26 ,  B24D18/0063 ,  B24D18/009 ,  B29C44/56 ,  B29C59/14 ,  B29K2105/04 ,  Y10T428/249952 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/31507 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31743 ,  Y10T428/31765 ,  Y10T428/31786

摘要： The present invention is directed, in general, to an improved material and method of planarizing a surface on a semiconductor wafer and, more specifically, to a method of altering the properties of polymers, preferably thermoplastic foam polymers, used in polishing applications. The chemical and mechanical properties thermoplastic foam substrates can be transformed by inorganic, inorganic-organic, and or organic—organic grafting techniques, such that the polymer foam is endowed with new set of properties that more desirable and suitable for polishing.

公开(公告)号：US06575823B1

公开(公告)日：2003-06-10

申请号：US10077709

申请日：2002-03-04

申请人： Yaw S. Obeng ,  Edward M. Yokley

发明人： Yaw S. Obeng ,  Edward M. Yokley

IPC分类号： B24D328

CPC分类号： B24B37/24 ,  B24D3/28 ,  B24D3/346

摘要： The present invention is directed, in general, to polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to polishing pads containing a precursor slurry modifier. In the presence of a polishing slurry during chemical mechanical polishing, the precursor is released to the polishing slurry to form a slurry modifier thereby improving polishing.

摘要翻译： 本发明一般涉及用于半导体晶片和集成电路的化学机械抛光的抛光垫。 更具体地，本发明涉及包含前体浆料改性剂的抛光垫。 在化学机械抛光期间在抛光浆料存在下，将前体释放到抛光浆料中以形成浆料改性剂，从而改善抛光。

公开(公告)号：US20190219512A1

公开(公告)日：2019-07-18

申请号：US16246172

申请日：2019-01-11

申请人： Clifford H. Kern, III ,  Edward M. Yokley ,  William Tison Wyatt ,  Morton Greene

发明人： Clifford H. Kern, III ,  Edward M. Yokley ,  William Tison Wyatt ,  Morton Greene

IPC分类号： G01N21/77 ,  G01N33/02 ,  A61K39/085

CPC分类号： G01N21/77 ,  A61K39/085 ,  C07K14/31 ,  C07K16/1271 ,  C12Q1/14 ,  G01N33/02 ,  G01N33/56938 ,  G01N2021/7756

摘要： A bio-sensor device for the electro-chemical detection of a bacterial pathogen, the device including a sample chamber and an electronic data module. The sample chamber includes electrical probes to detect pathogenic antigens in a sample containing the bacterial pathogen. The electrical probes detect a reaction voltage corresponding to an antigen-antibody reaction occurring when the pathogenic antigens come into contact with an antibody specific for pathogenic antigens present in a reaction medium in the sample chamber and contacted by the electrical probes. The electronic data module detects and processes electrical signals from the conductive electrical probes corresponding to an amount of the antigen present in the sample, wherein the reaction voltage is detected at the time of the reaction.

公开(公告)号：US20100055658A1

公开(公告)日：2010-03-04

申请号：US12282858

申请日：2007-03-13

申请人： W. Michael Sturm ,  Edward M. Yokley ,  Melissa Meredith Wells ,  Bruce Holt ,  John Murphy

发明人： W. Michael Sturm ,  Edward M. Yokley ,  Melissa Meredith Wells ,  Bruce Holt ,  John Murphy

IPC分类号： G09B7/00

CPC分类号： G09B7/00

摘要： In systems, methods and program products relating to the assessment of individuals, a subject can be provided with an assessment through software and a computer for improved functionality. The software may be directly installed on the subject's computer or may be on a remote server accessible through a communication network, such as a local network or the Internet. Stimuli to be presented to subject are selected in real time and may be selected randomly from a database of stimuli. Further, in the event of borderline cases, a refinement process may be used to provide an accurate assessment of the subject. Methods for the assessment of teams, comprising subject individuals, for the construction of ideal process profiles, and for coaching individuals are provided.

摘要翻译： 在与个人评估有关的系统，方法和程序产品中，可以通过软件和计算机提供对主题的评估以改进功能。 该软件可以直接安装在被摄体的计算机上，或者可以在可通过诸如本地网络或因特网的通信网络访问的远程服务器上。 要呈现给受试者的刺激是实时选择的，并且可以从刺激数据库中随机选择。 此外，如果发生边界案件，可以使用细化过程来提供对主题的准确评估。 提供了评估团队的方法，包括受试者个人，构建理想的过程简档和辅导人员。

公开(公告)号：US06821570B2

公开(公告)日：2004-11-23

申请号：US10218869

申请日：2002-08-14

申请人： Yaw S. Obeng ,  Edward M. Yokley

发明人： Yaw S. Obeng ,  Edward M. Yokley

IPC分类号： C23C1402

CPC分类号： B24B37/24 ,  B24B37/013 ,  B24B37/042 ,  B24B49/003 ,  B24B49/16 ,  B24D3/26 ,  B24D18/0063 ,  B24D18/009 ,  B29C44/56 ,  B29C59/14 ,  B29K2105/04 ,  Y10T428/249952 ,  Y10T428/249953 ,  Y10T428/249987 ,  Y10T428/24999 ,  Y10T428/249991 ,  Y10T428/31507 ,  Y10T428/31551 ,  Y10T428/31725 ,  Y10T428/31743 ,  Y10T428/31765 ,  Y10T428/31786

摘要： The present invention is directed to a method for preparing a polymer for chemical mechanical polishing of a semiconductor substrate. The method comprises providing a thermoplastic foam substrate and exposing the substrate to an initial plasma reactant to produce a modified surface thereon. The method also includes exposing the modified surface to a secondary plasma reactant to create a grafted surface on the modified surface. An electrode temperature is maintained between about 20° C. and about 100° C. during the exposures of the substrate and the modified surface.

摘要翻译： 本发明涉及制备用于半导体衬底的化学机械抛光的聚合物的方法。 该方法包括提供热塑性泡沫基材并将基底暴露于初始等离子体反应物以在其上产生改性表面。 该方法还包括将改性表面暴露于次级等离子体反应物以在改性表面上产生接枝表面。 在基材和改性表面的曝光期间，电极温度保持在约20℃至约100℃之间。

公开(公告)号：US06764574B1

公开(公告)日：2004-07-20

申请号：US09938150

申请日：2001-08-22

申请人： Yaw S. Obeng ,  Edward M. Yokley ,  Kathleen C. Richardson

发明人： Yaw S. Obeng ,  Edward M. Yokley ,  Kathleen C. Richardson

IPC分类号： H01L21302

CPC分类号： B24B37/24 ,  B24D3/28 ,  B24D3/346

摘要： The present invention is directed, in general, to packaged polishing pads for chemical mechanical polishing of semiconductor wafers and integrated circuits. More specifically, the invention is directed to a method of preparing and packing the pad and the packaging therefor. Prior to placing the pad on a platen and polishing with the pad, a polishing pad having an hygroscopic absorbency is soaked with an aqueous media for a time sufficient to equilibrate the pad. The pad maybe packaged by placement in a sealable moisture tight package after soaking or before soaking along with a sufficient quantity of aqueous media to allow the pad to equilibrate.

摘要翻译： 本发明一般涉及用于半导体晶片和集成电路的化学机械抛光的封装抛光垫。 更具体地，本发明涉及一种制备和包装垫及其包装的方法。 在将垫放置在压板上并用垫抛光之前，将具有吸湿吸收性的抛光垫用水性介质浸泡足以平衡垫的时间。 在浸泡之后或在浸泡之前，通过放置在可密封的防潮包装中，垫可以包含足够量的水性介质以使垫平衡。

公开(公告)号：US20230280300A1

公开(公告)日：2023-09-07

申请号：US18177456

申请日：2023-03-02

申请人： Clifford H. Kern, III ,  Edward M. Yokley ,  William Tison Wyatt ,  Morton Greene

发明人： Clifford H. Kern, III ,  Edward M. Yokley ,  William Tison Wyatt ,  Morton Greene

IPC分类号： G01N27/327 ,  G01N33/543 ,  G01N33/02 ,  C07K16/12

CPC分类号： G01N27/327 ,  G01N33/5438 ,  G01N33/02 ,  C07K16/1271 ,  C07K16/1282 ,  C12Q1/04

摘要： A bio-sensor device for the electrochemical detection of a bacterial pathogen, the device including a sample chamber and an electronic data module. The sample chamber includes passive sensing probes to detect pathogenic antigens in a sample containing the bacterial pathogen. The probes detect a reaction voltage corresponding to an antigen-antibody reaction occurring when the pathogenic antigens come into contact with an antibody specific for pathogenic antigens present in in the contents of the sample chamber and contacted by the electrical probes. The electronic data module detects and processes electrical signals detected by the conductive electrical probes corresponding to an amount of the antigen present in the sample, wherein the reaction voltage is detected at the time of the reaction.