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1.发明申请Optocoupler for Converting Optical Signals into Electrical Signals and Vice Versa 有权光耦合器将光信号转换为电信号和副信号公开(公告)号：US20070217734A1
公开(公告)日：2007-09-20
申请号：US11679601
申请日：2007-02-27
申请人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
发明人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
IPC分类号： G02B6/26
CPC分类号： G02B6/4202 , G02B6/423 , H01L31/0203 , H01L31/125 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。
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2.发明授权Optocoupler for converting optical signals into electrical signals and vice versa 有权光耦合器用于将光信号转换为电信号，反之亦然公开(公告)号：US07476036B2
公开(公告)日：2009-01-13
申请号：US11679601
申请日：2007-02-27
申请人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
发明人： Albert Auburger , Jochen Dangelmaier , Cyrus Ghahremani , Thomas Lichtenegger , Stefan Paulus , Jean Schmitt , Horst Theuss , Helmut Wietschorke
IPC分类号： G02B6/42
CPC分类号： G02B6/4202 , G02B6/423 , H01L31/0203 , H01L31/125 , H01L2224/48091 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.
摘要翻译： 用于将光信号转换为电信号的光耦合器，反之亦然，包括具有用于接收光波导的插座连接器的封装。 在封装的下侧，表面安装的外触点设置在互连膜上。 在光波导的光轴上的封装中设置包括一个光学半导体芯片和一个专用半导体芯片的半导体芯片的安装位置。 光学半导体芯片与封装内的光轴对准。 外部触点布置在柔性互连膜上的封装外部。 在安装位置和外部触点之间，互连膜包括嵌入封装材料中的弯曲区域，使得封装的下侧上的可表面安装的外部触点可自由接近。
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3.发明申请Device and Method for Data Transmission Between Structural Units Connected by an Articulated Joint 有权由铰接接头连接的结构单元之间的数据传输的装置和方法公开(公告)号：US20070230876A1
公开(公告)日：2007-10-04
申请号：US11693446
申请日：2007-03-29
IPC分类号： G02B6/36
CPC分类号： G02B6/4202 , G02B6/4232
摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.
摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。
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4.发明授权Device and method for data transmission between structural units connected by an articulated joint 有权通过铰接接头连接的结构单元之间的数据传输的装置和方法公开(公告)号：US07413353B2
公开(公告)日：2008-08-19
申请号：US11693446
申请日：2007-03-29
CPC分类号： G02B6/4202 , G02B6/4232
摘要： A device for transmitting data between two structural units connected to one another by an articulated joint has a long service life which permits a high transmission rate in conjunction with particularly small dimensions. The first structural unit includes a first optoelectronic component and the second structural unit includes a second optoelectronic component, the first optoelectronic component being connected to the second optoelectronic component via at least one optical fiber. One end of the optical fiber is brought into contact with the first optoelectronic component via a molded interconnect device (MID) plug connection and the other end is brought into contact with the second optoelectronic component via another MID plug connection.
摘要翻译： 用于通过铰接接头彼此连接的两个结构单元之间传输数据的设备具有较长的使用寿命，其允许高传输速率与特别小的尺寸相结合。 第一结构单元包括第一光电子部件，第二结构单元包括第二光电子部件，第一光电子部件经由至少一根光纤连接到第二光电部件。 通过模制的互连装置（MID）插头连接使光纤的一端与第一光电子部件接触，另一端通过另一个MID插头连接与第二光电子部件接触。
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公开(公告)号：US07836764B2
公开(公告)日：2010-11-23
申请号：US11732433
申请日：2007-04-02
申请人： Horst Theuss , Albert Auburger , Terje Skog , Jean Schmitt
发明人： Horst Theuss , Albert Auburger , Terje Skog , Jean Schmitt
IPC分类号： G01D11/24
CPC分类号： G01D11/245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , Y10T29/49117 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.
摘要翻译： 本发明涉及包括传感器芯片和容纳传感器芯片的结构的装置。 该结构被模具化合物覆盖并且由陶瓷或玻璃材料制成。
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公开(公告)号：US20080236278A1
公开(公告)日：2008-10-02
申请号：US11732433
申请日：2007-04-02
申请人： Horst Theuss , Albert Auburger , Terje Skog , Jean Schmitt
发明人： Horst Theuss , Albert Auburger , Terje Skog , Jean Schmitt
CPC分类号： G01D11/245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/1461 , H01L2924/181 , Y10T29/49117 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The invention relates to a device comprising a sensor chip and a structure housing the sensor chip. The structure is covered by a mold compound and is fabricated from a ceramic or a glass material.
摘要翻译： 本发明涉及包括传感器芯片和容纳传感器芯片的结构的装置。 该结构被模具化合物覆盖并且由陶瓷或玻璃材料制成。
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7.发明授权Integrated circuit having a semiconductor sensor device with embedded column-like spacers 有权集成电路具有带嵌入式柱状间隔物的半导体传感器装置公开(公告)号：US07964954B2
公开(公告)日：2011-06-21
申请号：US11685619
申请日：2007-03-19
申请人： Jean Schmitt
发明人： Jean Schmitt
IPC分类号： H01L23/24
CPC分类号： H01L27/14618 , B81B7/0051 , B81B7/0058 , G01D11/245 , G01L19/141 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01068 , H01L2924/1815 , H01L2924/00014
摘要： An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.
摘要翻译： 公开了一种具有半导体传感器装置的集成电路，该半导体传感器装置包括部分填充有橡胶弹性组合物的传感器壳体。 一个实施例具有传感器芯片，传感器区域布置在壳体的内部。 传感器壳体具有通向周围的开口，其以传感器区域朝向开口的方式设置。 传感器芯片被嵌入到壳体内部的所有侧面上的橡胶弹性组合物中。 传感器壳体具有夹层状框架，该框架具有一个在另一个上方布置的三个区域，包括具有橡胶弹性组合物的中间区域。
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8.发明授权Method and article of estimating of phase and gain mismatch and corresponding method and device for receiving a digital base band signal 有权相位和增益失配估计的方法和文章，以及用于接收数字基带信号的相应方法和装置公开(公告)号：US07924955B2
公开(公告)日：2011-04-12
申请号：US11367903
申请日：2006-03-03
申请人： Jean Schmitt
发明人： Jean Schmitt
IPC分类号： H04L27/08
CPC分类号： H04L27/3863 , H04L27/2647
摘要： The method is for estimating a phase and gain mismatch of a base band digital signal. It comprises: determining (10) weight coefficients depending upon the likelihood of the frequency values of a segment of said base band digital signal; and determining (26) the phase and gain mismatch for the segment using the weight coefficients.
摘要翻译： 该方法用于估计基带数字信号的相位和增益失配。 其包括：根据所述基带数字信号的段的频率值的似然性来确定（10）权重系数; 以及使用所述权重系数确定（26）所述段的相位和增益失配。
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9.发明申请INTEGRATED CIRCUIT HAVING A SEMICONDUCTOR SENSOR DEVICE AND METHOD FOR PRODUCING THE SAME 有权具有半导体传感器装置的集成电路及其制造方法公开(公告)号：US20070222005A1
公开(公告)日：2007-09-27
申请号：US11685619
申请日：2007-03-19
申请人： Jean Schmitt
发明人： Jean Schmitt
IPC分类号： H01L29/82
CPC分类号： H01L27/14618 , B81B7/0051 , B81B7/0058 , G01D11/245 , G01L19/141 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2924/01068 , H01L2924/1815 , H01L2924/00014
摘要： An integrated circuit having a semiconductor sensor device including a sensor housing partly filled with a rubber-elastic composition is disclosed. One embodiment has a sensor chip with sensor region arranged in the interior of the housing. The sensor housing has an opening to the surroundings which is arranged in such a way that the sensor region faces the opening. The sensor chip is embedded into a rubber-elastic composition on all sides in the interior of the housing. The sensor housing has a sandwich-like framework having three regions arranged one above another, including an intermediate region with the rubber-elastic composition.
摘要翻译： 公开了一种具有半导体传感器装置的集成电路，该半导体传感器装置包括部分填充有橡胶弹性组合物的传感器壳体。 一个实施例具有传感器芯片，传感器区域布置在壳体的内部。 传感器壳体具有通向周围的开口，其以传感器区域朝向开口的方式设置。 传感器芯片被嵌入到壳体内部的所有侧面上的橡胶弹性组合物中。 传感器壳体具有夹层状框架，该框架具有一个在另一个上方布置的三个区域，包括具有橡胶弹性组合物的中间区域。
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公开(公告)号：US20060209702A1
公开(公告)日：2006-09-21
申请号：US10549988
申请日：2004-03-17
申请人： Jean Schmitt , Dominique Le Foll , Bogdan Ghita
发明人： Jean Schmitt , Dominique Le Foll , Bogdan Ghita
CPC分类号： H04L41/00 , H04L41/0896 , H04L43/0852 , H04L43/0882
摘要： The invention relates to a method for evaluating the bandwidth between a first point and a second point liable to exchange digital data packets in a telecommunications network including a plurality of sub-networks. The method according to the invention includes the following steps: for each transmission direction through at least one of said sub-networks, associating a same identifier with the quasi-simultaneously transmitted packets, time-stamping and recording the received packets, identifying and sorting the packets received with the same identifier, selecting the largest possible integral number m of groups of packets with the same identifier, measuring the time intervals separating the instants when the packets of the selected groups are received by the second point, calculating the bandwidth according to the number of packets of the selected groups and to said total transmission time of said packets.
摘要翻译： 本发明涉及一种用于评估在包括多个子网络的电信网络中易于交换数字数据分组的第一点和第二点之间的带宽的方法。 根据本发明的方法包括以下步骤：对于通过至少一个所述子网的每个传输方向，将相同的标识符与准同时发送的分组相关联，对所接收的分组进行时间戳和记录，识别和分类 以相同的标识符接收到的分组，选择具有相同标识符的分组组的最大可能整数m，测量当第二点接收到所选择的分组的分组时分离时刻的时间间隔，根据 所选组的分组数和所述分组的所述总传输时间。
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